P/N: 833802T00000
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com
PRODUCT SPECIFICATIONS ———
•
Devices: TO-220
• Size: 13.1 x 13.2 x 24.0MM
• Material: Copper, 0.6MM Thick
• Type: Stamped
• Finish: Tin Plate
•
IC Mounting: Integrated Spring
• PCB Mounting: Solderable Device Leads
• Package: Bulk
FEATURES & BENEFITS —————
•
No Hardware Device Attachment
•
Constant Spring Force Tension
• RoHS Compliant
TO-220
Board Level
Heat Sinks
0
20
40
60
80
100
0 1 2 3 4 5
Heat Dissipated - Watts
Temp Rise Above Ambient -
o
C
(Mounting Surface)
0
4
8
12
16
20
0 200 400 600 800 1000
Air Velocity - LFM
Thermal Resistance - oC/ Watt
(Mounting Surface to Ambient)
CUSTOMIZED HEAT SINKS ————
•
Specialized Tabs, Plating
•
Specialized Body Configurations
•
Contact Applications Engineering
