© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 8
1Publication Order Number:
LMV321/D
LMV321, LMV358, LMV324
Single, Dual, Quad
Low-Voltage, Rail-to-Rail
Operational Amplifiers
The LMV321, LMV358, and LMV324 are CMOS single, dual, and
quad low voltage operational amplifiers with rail−to−rail output
swing. These amplifiers are a cost−effective solution for applications
where low power consumption and space saving packages are critical.
Specification tables are provided for operation from power supply
voltages at 2.7 V and 5 V. Rail−to−Rail operation provides improved
signal−to−noise preformance. Ultra low quiescent current makes this
series of amplifiers ideal for portable, battery operated equipment. The
common mode input range includes ground making the device useful
for low−side current−shunt measurements. The ultra small packages
allow for placement on the PCB in close proximity to the signal source
thereby reducing noise pickup.
Features
•Operation from 2.7 V to 5.0 V Single−Sided Power Supply
•LMV321 Single Available in Ultra Small 5 Pin SC70 Package
•No Output Crossover Distortion
•Industrial temperature Range: −40°C to +85°C
•Rail−to−Rail Output
•Low Quiescent Current: LMV358 Dual − 220 mA, Max per Channel
•No Output Phase−Reversal from Overdriven Input
•These are Pb−Free Devices
Typical Applications
•Notebook Computers and PDA’s
•Portable Battery−Operated Instruments
•Active Filters
Figure 1. Open Loop Frequency Response
(RL = 2 kW, TA = 255C, VS = 5 V)
Figure 2. CMRR vs. Input Common Mode
Voltage
30
40
50
60
70
80
−1012345
INPUT COMMON MODE VOLTAGE (V)
CMRR (dB)
VS = 5 V
FREQUENCY (Hz)
GAIN (dB)
−20
0
20
40
60
80
100
120
Over −40°C to +85°C
Same Gain $1.8 dB (Typ)
1k 10k 100k 1M 10M
10 100
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SC−70
CASE 419A
See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
ORDERING AND MARKING INFORMATION
Micro8]
CASE 846A
UDFN8
CASE 517AJ
SOIC−14
CASE 751A
TSSOP−14
CASE 948G
11
1
SOIC−8
CASE 751
1
8
1
1
8
1
5
TSOP−5
CASE 483
LMV321, LMV358, LMV324
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2
MARKING DIAGRAMS
AAC MG
G
AAC = Specific Device Code
M = Date Code
G= Pb−Free Package
PIN CONNECTIONS
(Top View)
SC70−5/TSOP−5
+IN
V−
−IN
V+
OUTPUT
−
+
2
1
3
5
4
LMV
324
ALYW
1
14
LMV324 = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G= Pb−Free Package
V358 = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G= Pb−Free Package
(Note: Microdot may be in either location)
V358
AYWG
G
1
8
LMV324
AWLYWWG
1
14
LMV324 = Specific Device Code
A = Assembly Location
WL = Wafer Lot
Y = Year
WW = Work Week
G = Pb−Free Package
AC = Specific Device Code
M = Date Code
G= Pb−Free Package
OUT A 1
2
3
4
−+
+−
8
7
6
5
IN A−
IN A+
V−
V+
OUT B
IN B−
IN B+
A
B
UDFN8/Micro8/SOIC−81
2
3
4
5
6
7
14
13
12
11
10
9
8
−+
A+−
D
−++−
B C
OUT A
IN A−
IN A+
V+
IN B+
IN B−
OUT B
OUT D
IN D−
IN D+
V−
IN C+
IN C−
OUT C
SOIC−14 1
2
3
4
5
6
7
14
13
12
11
10
9
8
−+
A+−
D
−++−
B C
OUT A
IN A−
IN A+
V+
IN B+
IN B−
OUT B
OUT D
IN D−
IN D+
V−
IN C+
IN C−
OUT C
TSSOP−14
(Top View) (Top View) (Top View)
V358
ALYWX
G
1
8
V358 = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G= Pb−Free Package
SC−70
UDFN8
SOIC−14 TSSOP−14
Micro8
SOIC−8
AC M
G
1
5
3ACAYWG
G
3AC = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G= Pb−Free Package
TSOP−5
(Note: Microdot may be in either location)
(Note: Microdot may be in either location)
LMV321, LMV358, LMV324
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3
MAXIMUM RATINGS
Symbol Rating Value Unit
VSSupply Voltage (Operating Range VS = 2.7 V to 5.5 V) 5.5 V
VIDR Input Differential Voltage $Supply Voltage V
VICR Input Common Mode Voltage Range −0.5 to (V+) + 0.5 V
Maximum Input Current 10 mA
tSo Output Short Circuit (Note 1) Continuous
TJMaximum Junction Temperature (Operating Range −40°C to 85°C) 150 °C
qJA Thermal Resistance: °C/W
SC−70 280
Micro8 238
TSOP−5 333
UDFN8 (1.2 mm x 1.8 mm x 0.5 mm) 350
SOIC−8 212
SOIC−14 156
TSSOP−14 190
Tstg Storage Temperature −65 to 150 °C
Mounting Temperature (Infrared or Convection −20 sec) 235 °C
VESD ESD Tolerance
LMV321
Machine Model
Human Body Model
LMV358/324
Machine Model
Human Body Mode
100
1000
100
2000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may
affect device reliability.
1. Continuous short−circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction
temperature of 150°C. Output currents in excess of 45 mA over long term may adversely affect reliability. Shorting output to either V+
or V− will adversely affect reliability.
LMV321, LMV358, LMV324
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4
2.7 V DC ELECTRICAL CHARACTERISTICS (Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = 2.7 V,
RL = 1 MW, V− = 0 V, VO = V+/2)
Parameter Symbol Condition Min Typ Max Unit
Input Offset Voltage VIO TA = −40°C to +85°C 1.7 9 mV
Input Offset Voltage Average Drift ICVOS TA = −40°C to +85°C 5 mV/°C
Input Bias Current IB TA = −40°C to +85°C <1 nA
Input Offset Current IIO TA = −40°C to +85°C <1 nA
Common Mode Rejection Ratio CMRR 0 V v VCM v 1.7 V 50 63 dB
Power Supply Rejection Ratio PSRR 2.7 V v V+ v 5 V,
VO = 1 V
50 60 dB
Input Common−Mode Voltage Range VCM For CMRR w 50 dB 0 to 1.7 −0.2 to 1.9 V
Output Swing VOH RL = 10 kW to 1.35 V VCC − 100 VCC − 10 mV
VOL RL = 10 kW to 1.35 V (Note 2) 60 180 mV
Supply Current LMV321
LMV358 (Both Amplifiers)
LMV324 (4 Amplifiers)
ICC 80
140
260
185
340
680
mA
2.7 V AC ELECTRICAL CHARACTERISTICS (Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = 2.7 V,
RL = 1 MW, V− = 0 V, VO = V+/2)
Parameter Symbol Condition Min Typ Max Unit
Gain Bandwidth Product GBWP CL = 200 pF 1 MHz
Phase Margin Qm60 °
Gain Margin Gm10 dB
Input−Referred Voltage Noise enf = 50 kHz 50 nV/√Hz
2. Guaranteed by design and/or characterization.
LMV321, LMV358, LMV324
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5
5.0 V DC ELECTRICAL CHARACTERISTICS (Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = 5.0 V,
RL = 1 MW, V− = 0 V, VO = V+/2)
Parameter Symbol Condition Min Typ Max Unit
Input Offset Voltage VIO TA = −40°C to +85°C 1.7 9 mV
Input Offset Voltage Average Drift TCVIO TA = −40°C to +85°C 5 mV/°C
Input Bias Current (Note 3) IB
TA = −40°C to +85°C
< 1 nA
Input Offset Current (Note 3) IIO TA = −40°C to +85°C< 1 nA
Common Mode Rejection Ratio CMRR 0 V v VCM v 4 V 50 65 dB
Power Supply Rejection Ratio PSRR 2.7 V v V+ v 5 V,
VO = 1 V, VCM = 1 V
50 60 dB
Input Common−Mode Voltage Range VCM For CMRR w 50 dB 0 to 4 −0.2 to 4.2 V
Large Signal Voltage Gain (Note 3) AVRL = 2 kW15 100 V/mV
TA = −40°C to +85°C 10
Output Swing VOH RL = 2 kW to 2.5 V
TA = −40°C to +85°C
VCC − 300
VCC − 400
VCC − 40 V
VOL RL = 2 kW to 2.5 V (Note 3)
TA = −40°C to +85°C
120 300
400
mV
VOH RL = 10 kW to 2.5 V (Note 3)
TA = −40°C to +85°C
VCC − 100
VCC − 200
V
VOL RL = 10 kW to 2.5 V
TA = −40°C to +85°C
65 180
280
mV
Output Short Circuit Current IOSourcing = VO = 0 V (Note 3)
Sinking = VO = 5 V (Note 3)
10
10
60
160
mA
Supply Current ICC LMV321
TA = −40°C to +85°C
130 250
350
mA
LMV358 Both Amplifiers
TA = −40°C to +85°C
210 440
615
LMV324 All Four Amplifiers
TA = −40°C to +85°C
410 830
1160
5.0 V AC ELECTRICAL CHARACTERISTICS (Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = 5.0 V,
RL = 1 MW, V− = 0 V, VO = V+/2)
Parameter Symbol Condition Min Typ Max Unit
Slew Rate SR1V/ms
Gain Bandwidth Product GBWP CL = 200 pF 1 MHz
Phase Margin Qm60 °
Gain Margin Gm10 dB
Input−Referred Voltage Noise enf = 50 kHz 50 nV/√Hz
3. Guaranteed by design and/or characterization.
LMV321, LMV358, LMV324
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6
TYPICAL CHARACTERISTICS
(TA = 25°C and VS = 5 V unless otherwise specified)
Figure 3. Open Loop Frequency Response
(RL = 2 kW, TA = 255C, VS = 5 V)
Figure 4. Open Loop Phase Margin
(RL = 2 kW, TA = 255C, VS = 5 V)
FREQUENCY (Hz)
PHASE MARGIN (°)
100
90
80
70
60
50
40
30
20
10
0
10 100 1k 10k 100k
Figure 5. CMRR vs. Frequency
(RL = 5 kW, VS = 5 V)
FREQUENCY (Hz)
CMRR (dB)
30
35
40
45
50
55
60
65
70
75
80
−0.5 0 0.5 1 1.5 2 2.5 3
Figure 6. CMRR vs. Input Common Mode
Voltage
INPUT COMMON MODE VOLTAGE (V)
CMRR (dB)
30
40
50
60
70
80
−1012345
Figure 7. CMRR vs. Input Common Mode
Voltage
INPUT COMMON MODE VOLTAGE (V)
CMRR (dB)
100
90
80
70
60
50
40
30
20
10
0
1k 10k 100k 1M 10M
Figure 8. PSRR vs. Frequency
(RL = 5 kW, VS = 2.7 V, +PSRR)
FREQUENCY (Hz)
PSRR (dB)
FREQUENCY (Hz)
GAIN (dB)
VS = 5 V
f = 10 kHz
VS = 2.7 V
f = 10 kHz
10
30
50
70
90
110
130
150
170
−20
0
20
40
60
80
100
120
Over −40°C to +85°C
Same Gain $1.8 dB (Typ)
1k 10k 100k 1M 10M10010 1k 10k 100k 1M 10M10010
LMV321, LMV358, LMV324
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7
TYPICAL CHARACTERISTICS
(TA = 25°C and VS = 5 V unless otherwise specified)
90
80
70
60
50
40
30
20
10
0
1k 10k 100k 1M 10M
Figure 9. PSRR vs. Frequency
(RL = 5 kW, VS = 2.7 V, −PSRR)
FREQUENCY (Hz)
PSRR (dB)
100
90
80
70
60
50
40
30
20
10
0
1k 10k 100k 1M 10M
Figure 10. PSRR vs. Frequency
(RL = 5 kW, VS = 5 V, +PSRR)
FREQUENCY (Hz)
PSRR (dB)
100
90
80
70
60
50
40
30
20
10
01k 10k 100k 1M 10M
Figure 11. PSRR vs. Frequency
(RL = 5 kW, VS = 5 V, −PSRR)
FREQUENCY (Hz)
PSRR (dB)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0 0.5 1 1.5 2 2.5 3
Figure 12. VOS vs CMR
VCM (V)
VOS (mV)
VS = 2.7 V
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
Figure 13. VOS vs CMR
VCM (V)
VOS (mV)
VS = 5.0 V
0
20
40
60
80
100
120
140
160
180
200
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
Figure 14. Supply Current vs. Supply Voltage
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (mA)
LMV321, LMV358, LMV324
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8
TYPICAL CHARACTERISTICS
(TA = 25°C and VS = 5 V unless otherwise specified)
Figure 15. THD+N vs Frequency
(Hz)
(%)
−0.1
−0.09
−0.08
−0.07
−0.06
−0.05
−0.04
−0.03
−0.02
−0.01
0
2.5 3 3.5 4 4.5
5
Figure 16. Output Voltage Swing vs Supply
Voltage (RL = 10k)
SUPPLY VOLTAGE (V)
VOUT REFERENCED TO V+ (V)
Positive Swing
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.1
2.5 3 3.5 4 4.5 5
Figure 17. Output Voltage Swing vs Supply
Voltage (RL = 10k)
SUPPLY VOLTAGE (V)
VOUT REFERENCED TO V− (V)
Negative Swing
−160
−140
−120
−100
−80
−60
−40
−20
0
0 0.5 1 1.5 2 2.5
Figure 18. Sink Current vs. Output Voltage
VS = 2.7 V
VOUT REFERENCED TO V− (V)
SINK CURRENT (mA)
−120
−100
−80
−60
−40
−20
0
012345
Figure 19. Sink Current vs. Output Voltage
VS = 5.0 V
VOUT REFERENCED TO V− (V)
SINK CURRENT (mA)
0
20
40
60
80
100
120
0 0.5 1.0 1.5 2.0 2.5
Figure 20. Source Current vs. Output Voltage
VS = 2.7 V
VOUT REFERENCED TO V+ (V)
SOURCE CURRENT (mA)
0.001
0.01
0.1
1
10 100 1k 10k 100k
RL = 10 kW
Vout = 1 VPP
Av = +1
LMV321, LMV358, LMV324
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9
TYPICAL CHARACTERISTICS
(TA = 25°C and VS = 5 V unless otherwise specified)
0
10
20
30
40
50
60
70
80
90
100
110
012345
Figure 21. Source Current vs. Output Voltage
VS = 5.0 V
VOUT REFERENCED TO V+ (V)
SOURCE CURRENT (mA)
Figure 22. Settling Time vs. Capacitive Load
Figure 23. Settling Time vs. Capacitive Load Figure 24. Step Response − Small Signal
Non−Inverting (G = +1)
Figure 25. Step Response − Small Signal
Inverting (G = −1)
Figure 26. Step Response − Large Signal
Non−Inverting (G = +1)
RL = 2 kW
AV = 1
50 mV/div
2 ms/div
RL = 1 MW
AV = 1
50 mV/div
2 ms/div
50 mV/div
2 ms/div
Output
Input
50 mV/div
2 ms/div
Output
Input
1 V/div
2 ms/div
Output
Input
LMV321, LMV358, LMV324
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10
TYPICAL CHARACTERISTICS
(TA = 25°C and VS = 5 V unless otherwise specified)
Figure 27. Step Response − Large Signal
Inverting (G = −1)
1 V/div
2 ms/div
Output
Input
LMV321, LMV358, LMV324
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11
APPLICATIONS
+
−
R1
R2
VO
Vref
Vin
VOH
VO
VOL
Hysteresis
VinL VinH
Vref
MC1403
LMV321
−
+
R1
VCC
VCC
VO
2.5 V
R2
50 k
10 k
Vref
5.0 k
RC
RC
+
−
VO
For: fo = 1.0 kHz
R = 16 kW
C = 0.01 mF
VCC
LMV321
LMV321
Figure 28. Voltage Reference Figure 29. Wien Bridge Oscillator
Figure 30. Comparator with Hysteresis
VO+2.5 V(1 )R1
R2)
Vref +1
2VCC
fO+1
2pRC
VinL+R1
R1 )R2 (VOL *Vref) )Vref
VinH+R1
R1 )R2 (VOH *Vref) )Vref
H+R1
R1 )R2 (VOH *VOL)
For less than 10% error from operational amplifier,
((QO fO)/BW) < 0.1 where fo and BW are expressed in Hz.
If source impedance varies, filter may be preceded with
voltage follower buffer to stabilize filter parameters.
Given: fo= center frequency
A(fo) = gain at center frequency
Choose value fo, C
Vin
Figure 31. Multiple Feedback Bandpass Filter
−
+
VCC
R3
R1
R2
Vref
CC
VO
CO = 10 C
CO
LMV321
Then : R3 +Q
pfOC
R1 +R3
2A(f
O)
R2 +
R1 R3
4Q2R1 *R3
LMV321, LMV358, LMV324
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12
ORDERING INFORMATION
Order Number
Number
of
Channels Specific Device Marking Package Type Shipping†
LMV321SQ3T2G Single AAC SC−70
(Pb−Free)
3000 / Tape & Reel
LMV321SN3T1G* Single 3AC TSOP−5
(Pb−Free)
3000 / Tape & Reel
LMV358DMR2G Dual V358 Micro8
(Pb−Free)
4000 / Tape & Reel
LMV358MUTAG Dual AC UDFN8
(Pb−Free)
3000 / Tape & Reel
LMV358DR2G Dual V358 SOIC−8
(Pb−Free)
2500 / Tape & Reel
LMV324DR2G Quad LMV324 SOIC−14
(Pb−Free)
2500 / Tape & Reel
LMV324DTBR2G Quad LMV
324
TSSOP−14
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*Contact factory.
LMV321, LMV358, LMV324
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13
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B1.15 1.350.045 0.053
C0.80 1.100.031 0.043
D0.10 0.300.004 0.012
G0.65 BSC0.026 BSC
H--- 0.10---0.004
J0.10 0.250.004 0.010
K0.10 0.300.004 0.012
N0.20 REF0.008 REF
S2.00 2.200.079 0.087
B0.2 (0.008) MM
12 3
45
A
G
S
D 5 PL
H
C
N
J
K
−B−
SC−88A, SOT−353, SC−70
CASE 419A−02
ISSUE J
LMV321, LMV358, LMV324
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14
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM MIN MAX
MILLIMETERS
A3.00 BSC
B1.50 BSC
C0.90 1.10
D0.25 0.50
G0.95 BSC
H0.01 0.10
J0.10 0.26
K0.20 0.60
L1.25 1.55
M0 10
S2.50 3.00
123
54 S
A
G
L
B
D
H
C
J
__
0.7
0.028
1.0
0.039
ǒmm
inchesǓ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
CAB
T0.10
2X
2X T0.20
NOTE 5
T
SEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
LMV321, LMV358, LMV324
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15
PACKAGE DIMENSIONS
Micro8™
CASE 846A−02
ISSUE H
S
B
M
0.08 (0.003) A S
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
b
e
PIN 1 ID
8 PL
0.038 (0.0015)
−T−
SEATING
PLANE
A
A1 cL
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8X 8X
6X ǒmm
inchesǓ
SCALE 8:1
1.04
0.041
0.38
0.015
5.28
0.208
4.24
0.167
3.20
0.126
0.65
0.0256
DIM
A
MIN NOM MAX MIN
MILLIMETERS
−− −− 1.10 −−
INCHES
A1 0.05 0.08 0.15 0.002
b0.25 0.33 0.40 0.010
c0.13 0.18 0.23 0.005
D2.90 3.00 3.10 0.114
E2.90 3.00 3.10 0.114
e0.65 BSC
L0.40 0.55 0.70 0.016
−− 0.043
0.003 0.006
0.013 0.016
0.007 0.009
0.118 0.122
0.118 0.122
0.026 BSC
0.021 0.028
NOM MAX
4.75 4.90 5.05 0.187 0.193 0.199
HE
HE
DD
E
LMV321, LMV358, LMV324
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16
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AJ
SEATING
PLANE
1
4
58
N
J
X 45 _
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
LMV321, LMV358, LMV324
http://onsemi.com
17
PACKAGE DIMENSIONS
UDFN8 1.8x1.2, 0.4P
CASE 517AJ−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
ÉÉ
ÉÉ
A B
E
D
BOTTOM VIEW
b
e
8X
BAC
CNOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
A
A1
(A3)
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
L
8X
14
58
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b0.15 0.25
D1.80 BSC
E1.20 BSC
e0.40 BSC
L0.45 0.55
e/2
b2 0.30 REF
L1 0.00 0.03
L2 0.40 REF
DETAIL A
(L2)
(b2)
NOTE 5
L1
DETAIL A
M
0.10
M
0.05
0.22
0.32
8X
1.50
0.40 PITCH
0.66
DIMENSIONS: MILLIMETERS
MOUNTING FOOTPRINT*
7X
1
SOLDERMASK DEFINED
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
LMV321, LMV358, LMV324
http://onsemi.com
18
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE J NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
−B−
G
P7 PL
14 8
7
1
M
0.25 (0.010) B M
S
B
M
0.25 (0.010) A S
T
−T−
F
RX 45
SEATING
PLANE D14 PL K
C
J
M
_DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A8.55 8.75 0.337 0.344
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.228 0.244
R0.25 0.50 0.010 0.019
__ __
7.04
14X
0.58
14X
1.52
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
7X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
LMV321, LMV358, LMV324
http://onsemi.com
19
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G−01
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C−−− 1.20 −−− 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
L−U−
SEATING
PLANE
0.10 (0.004)
−T−
ÇÇÇ
ÇÇÇ
SECTION N−N
DETAIL E
JJ1
K
K1
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
−W−
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
−V−
14X REFK
N
N
7.06
14X
0.36 14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
LMV321, LMV358, LMV324
http://onsemi.com
20
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