Thermal Shock Test
Solder Resistance
Test
Solderability Test
High Temperature
High Humidity Test
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
MIL-STD-202:103B
JIS C 7021: B-11
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
This test intended to see soldering well
performed or not.
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
The purpose of this test is the resistance
of the device under tropical for hous.
PART NO. LSR2040
Low Temperature
Storage Test
Test Item
Operating Life Test
High Temperature
Storage Test
Reliability Test:
JIS C 7021: B-12
MIL-STD-883:1008
JIS C 7021: B-10
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Reference
Standard
LI GITEK ELECTRONICS CO.,LTD.
Proper ty of Ligitek Only
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
Test Condition
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
Description
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