SEMIKRON VrsM Iray (Sin. 180; Toase = -..) VARM V 4000 A (50C) 6000 A (85C) 100 SKN 4000/01 - 200 SKN 4000/02 SKN 6000/02 400 SKN 4000/04 SKN 6000/04 600 SKN 4000/06 - Symbol | Conditions SKN 4000 SKN 6000 IFaAV Tease = 50C:DSC" 4000 A = 85C:psc" 6000 A = 100C:Dsc") 2740 A 5400 A lFsm Ty = 25C 10 ms 60 kA Ty = 180C 50 kA i*t Ty = 25C 18 -10A*s Ty =180C 12,5 -10A*s la Ty = 25C; Vr = Varm 4mA Ty = 180C; VR = Varo 100 mA Ve Ty = 25C; lp =14 kA; max. 1,35") 13?) Vito) Ty = 180C 0,7V 07V 'T Ty = 180C 0,04 mQ 0,04 mQ Rihje psc 0,030 C/W 0,012C/W ssc 0,060 C/W 0,024 C/W Rich psc 0,005 C/W 0,005 C/W ssc 0,010 C/W 0,010C/W Tj 40 +180 C Tsig 40 ...4 150C F St units 24 ..30kN 24 ... 30 KN a US units 5400 ... 6750 Ibs. |5400 ... 6750 Ibs, w 129g 130 g Case E22 E35 1 DSC = Double sided cooling; SSC = Single sided cooling For parallel connections selected devices are available on request Rectifier Diodes SKN 4000 SKN 6000 Features @ Capsule type metai-ceramic packages with precious metal pressure contacts e Medium voltage, high current rectifier diodes with slim package for lowest thermal resistance. Low power dissipation. Especially suited for water cooling. Forward selections for paralleling available Typical Applications @ Welding e@ Electroplating by SEMIKRON B8~47kw thia~-10.03 | c/w Peay 0 O lew 1 2 3 kA 0 Tomb 50 100 150 C 200 Fig. 2a Power dissipation vs. forward current and ambient temperature 75 SKN 6000 kW 25 Fray 0 O Ieay 1 2 3 4 5 kA O 7.5 kW 2.6 Fray 50 100 150 c 200 Fig. 2b Power dissipation vs. forward current and ambient temperature 5 kA bay Oo 0 kase 50 100 4150 c 200 Fig. 3a Rated forward current vs. case temperature 7S SKN 6000 Bsc kA 2.5 lFav 0 0 Teese 50 100 150 200 Fig. 3b Rated forward current vs. case temperature B848 by SEMIKRONsEMIKRON 40 ae gw |_-SKN 4000 hat 30 20 2th 0-3 t 10-2 1071 10 10! s 102 Fig. 5a Transient thermal impedance vs. time 20 72 1_SKN 6000 uu 2th 10-8 t 10-2 1071 10 101 s 10? Fig. 5c Transient thermal impedance vs. time 20 A|"SKN 4000 16 G Yp 0,5 1 15 V2 Fig. 6 a Forward characteristics by SEMIKRON 78 a SKN 4000 ssc 25 Zh 8 jo-3 10-2 om 109 401 s 102 Fig. 5b Transient thermal impedance vs. time 40 zw | SKN 6000 kW ati 30 20 th 8 0 2 ost 10-2 1071 10 107 s 10 Fig. 5d Transient thermal impedance vs. time 20 SKN 6000 kA lp Oo 0 Ve 0.5 1 v 15 Fig. 6 b Forward characteristicslFtov) 'esm 1.8 lege (kA) Tyjz25 C | T2180 C 0.8 0.6 0.4 10 t 101 ms 103 Fig. 7 Surge overload current vs. time 4a kA- SKN 4000- DSC Tease: 50C at 21904 30 ED=7, 100% teen-ts 20 |e 10 + ED 3 10 30 50 % 100 Fig. 12 a Rated peak forward current vs. duty cycle 40 kA ~SKN 6000 3 DSC Tease: 60C 36 30 25 20 ED=42.100% sp teen-ts lem 15 1 D 3 5 10 30 50 % 100 Fig. 12 c Rated peak forward current vs. duty cycle 30 ka SKN 4000- |" DSC Teases 100C ne 3 20 ED-12 -100% Sp tants |Fm 0 1 ED 3 10 30 0 % 100 Fig. 12 b Rated peak forward current vs. duty cycle 35 a (SKN 6000- * OSC Tonses 100C 30 25 20 |EM 15 1 ED 3 5 10 30 50 % 100 Fig. 12d Rated peak forward current vs. duty cycle B8&-50 by SEMIKRON oT ]sEMIKRON 2SKN 4000 ka 2sSKN 4000 | DSC Tease: 50C 100C ns 3 18 ED=42 -100% Isp te=n-ts 10 Ig Q 1 ED 3 5 10 30 50 % 100 1 ED 3 5 10 30 50 % 100 Fig. 13 a Rated direct output current vs. duty cycle Fig. 13 b Rated direct current vs. duty cycle 25 kA =3.2*SKN 6000 Tease= 50C 25 2-SKN 6000 ** DSC Tease= 100 C kA ns 20 3 20 EO=F2 -100% sp tents la 10 1 ED 3 5 10 30 50 % 100 4 ED 3 5 40 30 0 % 100 Fig. 13.c Rated direct output current vs. duty cycle Fig. 13d Rated direct current vs. duty cycle by SEMIKRON B8-51| SkNa 2 SKNa 4 Case E5 Case E6 IEC: A2) . BS 3934: SO - 16 JEDEC: DO - 1 80,8 $78 102 12 0 26,7 * HH n= | 4 | y 2 yt Wa M4 e 218 ~| Dimensions in mm * modified Dimensions in mm SKNa 20 max.10,5 Case E9 | 95,3 1EC:A16M ;A7U, DIN 41886: 102 A2 NY BS3934:S0-31 yp {| JEDEC:DO-4M o2 E V4 oO +1 uD 2 8 ! 4 SKN SKR swit of => Lag =) b4 g a} LMe Dimensions in mm modified B8-52 by SEMIKRON ~ ] |