Product Folder Sample & Buy Support & Community Tools & Software Technical Documents Reference Design SM72485 SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 SM72485 100-V, 150-mA Constant On-Time Buck Switching Regulator 1 Features 3 Description * * * * * * * The SM72485 step-down switching regulator features all of the functions required to implement a low cost, efficient, Buck bias regulator. This high voltage regulator contains an 100-V N-channel buck switch. The device is easy to implement and is provided in the VSSOP and the thermally enhanced WSON package. The regulator is based on a control scheme using an on-time inversely proportional to VIN. This feature allows the operating frequency to remain relatively constant. The control scheme requires no loop compensation. An intelligent current limit is implemented with forced off-time, which is inversely proportional to VOUT. This scheme ensures short circuit control while providing minimum foldback. Other features include: Thermal shutdown, VCC undervoltage lockout, gate drive undervoltage lockout, maximum duty cycle limiter, and a precharge switch. 1 * * * * * * * Operating Input Voltage: 6 V to 95 V Integrated 100-V, N-Channel Buck Switch Internal Start-Up Regulator No Loop Compensation Required Ultra-Fast Transient Response On-time Varies Inversely With Input Voltage Operating Frequency Remains Constant With Varying Line Voltage and Load Current Adjustable Output Voltage From 2.5 V Highly Efficient Operation Precision Internal Reference Low Bias Current Intelligent Current Limit Thermal Shutdown Package - VSSOP (3 mm x 3 mm) - WSON (4 mm x 4 mm) Device Information(1) PART NUMBER SM72485 2 Applications * * * * PV Panel Smart Junction Boxes Nonisolated Telecommunication Buck Regulator Secondary High Voltage Post Regulator 42-V Automotive Systems PACKAGE BODY SIZE (NOM) VSSOP (8) 3.00 mm x 3.00 mm WSON (8) 4.00 mm x 4.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application, Basic Step-Down Regulator 6V - 95V Input VIN VCC VIN C1 C3 SM72485 RT BST GND C4 L1 RT/SD VOUT SW RCL D1 SHUTDOWN RFB2 RCL RTN R3 C2 FB GND RFB1 Copyright (c) 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SM72485 SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 7 7.1 Overview ................................................................... 7 7.2 Functional Block Diagram ......................................... 7 7.3 Feature Description................................................... 7 7.4 Device Functional Modes.......................................... 9 8 Application and Implementation ........................ 12 8.1 Application Information............................................ 12 8.2 Typical Application .................................................. 12 9 Power Supply Recommendations...................... 17 10 Layout................................................................... 18 10.1 Layout Guidelines ................................................. 18 10.2 Layout Example .................................................... 18 11 Device and Documentation Support ................. 19 11.1 11.2 11.3 11.4 11.5 11.6 Documentation Support ........................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 19 19 19 19 19 19 12 Mechanical, Packaging, and Orderable Information ........................................................... 19 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (April 2013) to Revision E Page * Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal Information table, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................................................................................. 1 * Deleted Renewable Energy Grade from Features ................................................................................................................. 1 * Deleted Lead temperature (260C maximum) from Absolute Maximum Ratings table.......................................................... 4 * Changed Junction to Ambient, RJA, value in Thermal Information table From: 200C/W To: 139.6C/W (VSSOP) and From: 40C/W To: 42.3C/W (WSON) ............................................................................................................................ 4 Changes from Revision C (April 2013) to Revision D * 2 Page Changed layout of National Seminconductor Data Sheet to TI format .................................................................................. 1 Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 SM72485 www.ti.com SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 5 Pin Configuration and Functions DGK Package 8-Pin VSSOP Top View NGU Package 8-Pin WSON Top View SW 1 8 VIN BST 2 7 VCC RCL 3 6 RT/SD RTN 4 5 FB SW 1 8 VIN BST 2 7 VCC RCL 3 6 RT/SD RTN 4 5 FB Exposed Pad on Bottom Connect to Ground Pin Functions PIN TYPE (1) DESCRIPTION 2 I An external capacitor is required between the BST and the SW pins. TI recommends a 0.01-F ceramic capacitor. An internal diode charges the capacitor from VCC during each off-time. 5 5 I This pin is connected to the inverting input of the internal regulation comparator. The regulation threshold is 2.5 V. RCL 3 3 I A resistor between this pin and RTN sets the off-time when current limit is detected. The off-time is preset to 35 s if FB = 0 V. RT/SD 6 6 I A resistor between this pin and VIN sets the switch on-time as a function of VIN. The minimum recommended on-time is 400 ns at the maximum input voltage. This pin can be used for remote shutdown. RTN 4 4 G Ground for the entire circuit. SW 1 1 O Power switching node. Connect to the output inductor, re-circulating diode, and bootstrap capacitor. VCC 7 7 I This regulated voltage provides gate drive power for the internal Buck switch. An internal diode is provided between this pin and the BST pin. A local 0.47-F decoupling capacitor is required. The series pass regulator is current limited to 9 mA. VIN 8 8 I Input operating voltage: 6 V to 95 V. -- Thermal Pad NC NAME VSSOP WSON BST 2 FB Exposed Pad (1) The exposed pad has no electrical contact. Connect to system ground plane for reduced thermal resistance. G = Ground, I = Input, O = Output, NC = No Contact Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 3 SM72485 SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX UNIT VIN to GND -0.3 100 V BST to GND -0.3 114 V SW to GND (steady-state) -1 V BST to VCC 100 V BST to SW 14 V VCC to GND 14 V All other inputs to GND -0.3 7 V Storage temperature, Tstg -55 150 C (1) (2) (3) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. For detailed information on soldering plastic VSSOP and WSON packages, see Absolute Maximum Ratings for Soldering (SNOA549). 6.2 ESD Ratings V(ESD) (1) Electrostatic discharge VALUE UNIT 2000 V Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) VIN Input voltage TJ Operating junction temperature MIN MAX 6 95 UNIT V -40 125 C 6.4 Thermal Information SM72485 THERMAL METRIC (1) DGK (VSSOP) NGU (WSON) 8 PINS 8 PINS UNIT RJA Junction-to-ambient thermal resistance 139.6 42.3 C/W RJC(top) Junction-to-case (top) thermal resistance 41.8 41.4 C/W RJB Junction-to-board thermal resistance 68.4 20.1 C/W JT Junction-to-top characterization parameter 4.2 0.4 C/W JB Junction-to-board characterization parameter 67.5 20.3 C/W RJC(bot) Junction-to-case (bottom) thermal resistance -- 4.1 C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 SM72485 www.ti.com SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 6.5 Electrical Characteristics Typical values apply for TA = TJ = 25C, Minimum and Maximum limits apply for TA = TJ = -40C to 125C, and VIN = 48 V (unless otherwise noted) (1) PARAMETER TEST CONDITIONS MIN TYP MAX 7 7.4 UNIT VCC SUPPLY VCCREG VCC regulator output VIN = 48 V Dropout voltage, VIN - VCC VIN = 6 V to 8.5 V VCC bypass threshold VIN rising 6.6 100 VCC bypass hysteresis 8.5 V 300 mV VIN = 6 V 100 VIN = 10 V 8.8 VIN = 48 V 0.8 VCC current limit VIN = 48 V 9.2 VCC UVLO VCC rising 5.3 V 190 mV VCC output impedance VCC UVLO hysteresis VCC UVLO filter delay ICC V mV mA 3 s Operating current VFB = 3 V, VIN = 48 V 550 750 A Shutdown current VRT/SD = 0 V 110 176 A 2.2 4.6 3.8 4.8 SWITCH CHARACTERISTICS Buckswitch RDS(ON) ITEST = 200 mA Gate drive UVLO VBST - VSW rising 2.8 Gate drive UVLO hysteresis Precharge switch voltage 490 At 1 mA Precharge switch on-time V mV 0.8 V 150 ns CURRENT LIMIT Current limit threshold 0.24 Current limit response time ISW overdrive = 0.1 A, time to switch OFF tOFF_1 Off-time generator VFB = 0 V, RCL = 100 k tOFF_2 Off-time generator VFB = 2.3 V, RCL = 100 k 0.3 0.36 350 A ns 35 s 2.56 ON-TIME GENERATOR tON_1 On-time generator VIN = 10 V, RON = 200 k 2.15 2.77 3.5 s tON_2 On-time generator VIN = 95 V, RON = 200 k 200 300 420 ns Remote shutdown threshold Rising 0.4 0.7 1.05 Remote shutdown hysteresis V 35 mV 300 ns MINIMUM OFF-TIME Minimum off-time VFB = 0 V REGULATION AND OV COMPARATORS FB reference threshold Internal reference, trip point for switch = ON FB overvoltage threshold Trip point for switch = OFF FB bias current 2.445 2.5 2.55 V 2.875 V 100 nA 165 C 25 C THERMAL SHUTDOWN TSD Thermal shutdown temperature Thermal shutdown hysteresis (1) All limits are ensured. All electrical characteristics having room temperature limits are tested during production with TA = TJ = 25C. All minimum and maximum limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical process control. Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 5 SM72485 SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 www.ti.com 6.6 Typical Characteristics Circuit of Figure 10 Figure 1. Efficiency vs Load Current and VIN Figure 2. VCC vs VIN CURRENT LIMIT OFF TIME (Ps) 35 30 25 20 15 RCL = 500k 300k 10 100k 5 50k 0 0 0.5 1.0 1.5 2.0 2.5 VFB (V) 6 Figure 3. On-Time vs Input Voltage and RT Figure 4. Current Limit OFF-Time vs VFB and RCL Figure 5. Maximum Frequency vs VOUT and VIN Figure 6. ICC Current vs Applied VCC Voltage Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 SM72485 www.ti.com SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 7 Detailed Description 7.1 Overview The SM72485 step-down switching regulator features all the functions required to implement a low-cost, efficient, buck-bias power converter. This high-voltage regulator contains a 100-V, N-channel buck switch that is easy to implement and is provided in the VSSOP and the thermally enhanced WSON package. The regulator is based on a control scheme using an on-time inversely proportional to VIN. The control scheme requires no loop compensation. Current limit is implemented with forced off-time, which is inversely proportional to VOUT. This scheme ensures short-circuit control while providing minimum foldback. The SM72485 can be applied in numerous applications to efficiently regulate down higher voltages. This regulator is well suited for high voltage PV panel junction boxes, 48-V telecom and the new 42-V automotive power bus ranges. Features include: thermal shutdown, VCC undervoltage lockout, gate drive undervoltage lockout, maximum duty cycle limit timer, intelligent current limit off-timer, and a precharge switch. 7.2 Functional Block Diagram SM72485 7 V BIAS REGULATOR 6 V to 95 V Input VIN C5 C1 V IN SENSE Q2 GND BYPASS SWITCH VCC UVLO THERMAL SHUTDOWN VCC C3 RT ON TIMER START 0 .7 V RT FINISH RT / SD BST SHUTDOWN OVER-VOLTAGE COMPARATOR START GD UVLO 300ns MIN Vin SD 2 . 875 V FINISH SSET Q FB R CL VOUT D1 RCLRQ REGULATION COMPARATOR RTN SW SHIFT FB R CL L1 LEVEL 2.5A RCL C4 DRIVER OFF TIMER PRE CHARGE FINISH START CURRENT LIMIT OFF TIMER 0.3A BUCK SWITCH CURRENT SENSE R FB 2 R FB 1 R3 C2 Copyright (c) 2016, Texas Instruments Incorporated 7.3 Feature Description 7.3.1 Control Circuit Overview The SM72485 is a buck DC-DC regulator that uses a control scheme in which the on-time varies inversely with line voltage (VIN). Control is based on a comparator and the on-time one-shot, with the output voltage feedback (FB) compared to an internal reference (2.5 V). If the FB level is below the reference the buck switch is turned on for a fixed time determined by the line voltage and a programming resistor (RT). Following the ON period, the switch remains off for at least the minimum off-timer period of 300 ns. If FB is still below the reference at that time, the switch turns on again for another on-time period. This continues until regulation is achieved. Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 7 SM72485 SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 www.ti.com Feature Description (continued) The SM72485 operates in discontinuous conduction mode at light load currents, and continuous conduction mode at heavy load current. In discontinuous conduction mode, current through the output inductor starts at zero and ramps up to a peak during the on-time, then ramps back to zero before the end of the off-time. The next ontime period starts when the voltage at FB falls below the internal reference, until then the inductor current remains zero. In this mode the operating frequency is lower than in continuous conduction mode, and varies with load current. Therefore at light loads the conversion efficiency is maintained, because the switching losses reduce with the reduction in load and frequency. The discontinuous operating frequency can be calculated in Equation 1. F VOUT 2 u Lu 1.04 u 1020 RL u (RT )2 where * RL = the load resistance (1) In continuous conduction mode, current flows continuously through the inductor and never ramps down to zero. In this mode the operating frequency is greater than the discontinuous mode frequency and remains relatively constant with load and line variations. The approximate continuous mode operating frequency can be calculated in Equation 2. VOUT F 1.385 u 10 10 u RT (2) The output voltage (VOUT) is programmed by two external resistors as shown in the Functional Block Diagram. The regulation point can be calculated in Equation 3. VOUT = 2.5 x (RFB1 + RFB2) / RFB1 (3) The SM72485 regulates the output voltage based on ripple voltage at the feedback input, requiring a minimum amount of ESR for the output capacitor C2. A minimum of 25 mV to 50 mV of ripple voltage at the feedback pin (FB) is required for the SM72485. In cases where the capacitor ESR is too small, additional series resistance may be required (R3 in the block diagram). For applications where lower output voltage ripple is required the output can be taken directly from a low-ESR output capacitor, as shown in Figure 7. However, R3 slightly degrades the load regulation. L1 SW RFB2 SM72485 R3 FB VOUT2 RFB1 C2 Copyright (c) 2016, Texas Instruments Incorporated Figure 7. Low Ripple Output Configuration 8 Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 SM72485 www.ti.com SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 Feature Description (continued) 7.3.2 Current Limit The SM72485 contains an intelligent current limit off-timer. If the current in the Buck switch exceeds 0.3 A, the present cycle is immediately terminated, and a non-resetable off-timer is initiated. The length of off-time is controlled by an external resistor (RCL) and the FB voltage (see Figure 4). When FB = 0 V, a maximum off-time is required, and the time is preset to 35 s. This condition occurs when the output is shorted, and during the initial part of start-up. This amount of time ensures safe short-circuit operation up to the maximum input voltage of 95 V. In cases of overload where the FB voltage is above zero volts (not a short circuit) the current limit off-time is less than 35 s. Reducing the off-time during less severe overloads reduces the amount of foldback, recovery time, and the start-up time. The off-time is calculated in Equation 4. tOFF = 10-5 / (0.285 + (VFB / 6.35 x 10-6 x RCL)) (4) The current-limit-sensing circuit is blanked for the first 50 ns to 70 ns of each on-time so it is not falsely tripped by the current surge which occurs at turnon. The current surge is required by the re-circulating diode (D1) for its turnoff recovery. 7.3.3 N-Channel Buck Switch and Driver The SM72485 integrates an N-channel buck switch and associated floating high voltage gate driver. The gate driver circuit works in conjunction with an external bootstrap capacitor and an internal high voltage diode. A 0.01F ceramic capacitor (C4) connected between the BST pin and SW pin provides the voltage to the driver during the on-time. During each off-time, the SW pin is at approximately 0 V, and the bootstrap capacitor charges from VCC through the internal diode. The minimum off-timer, set to 300 ns, ensures a minimum time each cycle to recharge the bootstrap capacitor. The internal precharge switch at the SW pin is turned on for 150 ns during the minimum off-time period, ensuring sufficient voltage exists across the bootstrap capacitor for the on-time. This feature helps prevent operating problems which can occur during very light load conditions, involving a long off-time, during which the voltage across the bootstrap capacitor could otherwise reduce below the gate drive UVLO threshold. The precharge switch also helps prevent start-up problems which can occur if the output voltage is precharged prior to turnon. After current limit detection, the precharge switch is turned on for the entire duration of the forced offtime. 7.3.4 Thermal Protection The SM72485 must be operated so the junction temperature does not exceed 125C during normal operation. An internal thermal shutdown circuit is provided to shutdown the SM72485 in the event of a higher than normal junction temperature. When activated, typically at 165C, the controller is forced into a low power reset state by disabling the buck switch. This feature prevents catastrophic failures from accidental device overheating. When the junction temperature reduces below 140C (typical hysteresis = 25C) normal operation is resumed. 7.4 Device Functional Modes 7.4.1 Start-Up Regulator (VCC) The high voltage bias regulator is integrated within the SM72485. The input pin (VIN) can be connected directly to line voltages between 6 V and 95 V, with transient capability to 100 V. Referring to the block diagram and the graph of VCC vs VIN, when VIN is between 6 V and the bypass threshold (nominally 8.5 V), the bypass switch (Q2) is on, and VCC tracks VIN within 100 mV to 150 mV. The bypass switch on-resistance is approximately 100 , with inherent current limiting at approximately 100 mA. When VIN is above the bypass threshold Q2 is turned off, and VCC is regulated at 7 V. The VCC regulator output current is limited at approximately 9.2 mA. When the SM72485 is shutdown using the RT/SD pin, the VCC bypass switch is shut off regardless of the voltage at VIN. Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 9 SM72485 SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 www.ti.com Device Functional Modes (continued) When VIN exceeds the bypass threshold, the time required for Q2 to shut off is approximately 2 s to 3 s. The capacitor at VCC (C3) must be a minimum of 0.47 F to prevent the voltage at VCC from rising above its absolute maximum rating in response to a step input applied at VIN. C3 must be placed as close as possible to the VCC and RTN pins. In applications with a relatively high input voltage, power dissipation in the bias regulator is a concern. An auxiliary voltage of between 7.5 V and 14 V can be diode connected to the VCC pin to shut off the VCC regulator, thereby reducing internal power dissipation. The current required into the VCC pin is shown in Figure 6. Internally a diode connects VCC to VIN requiring that the auxiliary voltage be less than VIN. The turnon sequence is shown in Figure 8. During the initial delay (t1) VCC ramps up at a rate determined by its current limit and C3 while internal circuitry stabilizes. When VCC reaches the upper threshold of its undervoltage lockout (UVLO, typically 5.3 V) the buckswitch is enabled. The inductor current increases to the current limit threshold (ILIM) and during t2 VOUT increases as the output capacitor charges up. When VOUT reaches the intended voltage the average inductor current decreases (t3) to the nominal load current (IO). VIN t1 7V UVLO V CC Vin SW Pin 0V I LIM Inductor Current IO t2 t3 V OUT Figure 8. Start-Up Sequence 7.4.2 Regulation Comparator The feedback voltage at FB is compared to an internal 2.5-V reference. In normal operation (the output voltage is regulated), an on-time period is initiated when the voltage at FB falls below 2.5 V. The buck switch remains on for the on-time, causing the FB voltage to rise above 2.5 V. After the on-time period, the buck switch remains off until the FB voltage again falls below 2.5 V. During start-up, the FB voltage is below 2.5 V at the end of each ontime, resulting in the minimum off-time of 300 ns. Bias current at the FB pin is nominally 100 nA. 7.4.3 Overvoltage Comparator The feedback voltage at FB is compared to an internal 2.875-V reference. If the voltage at FB rises 2.875 V above the on-time pulse is immediately terminated. This condition can occur if the input voltage, or the output load, change suddenly. The buck switch does not turn on again until the voltage at FB falls below 2.5 V. 10 Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 SM72485 www.ti.com SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 Device Functional Modes (continued) 7.4.4 ON-Time Generator and Shutdown The on-time for the SM72485 is determined by the RT resistor, and is inversely proportional to the input voltage (VIN), resulting in a nearly constant frequency as VIN is varied over its range. The on-time equation for the SM72485 is Equation 5. tON = 1.385 x 10-10 x RT / VIN (5) RT must be selected for a minimum on-time (at maximum VIN) greater than 400 ns, for proper current limit operation. This requirement limits the maximum frequency for each application, depending on VIN and VOUT. The SM72485 can be remotely disabled by taking the RT/SD pin to ground. See Figure 9. The voltage at the RT/SD pin is between 1.5 V and 3 V, depending on VIN and the value of the RT resistor. Input Voltage VIN SM72485 RT RT/SD STOP RUN Copyright (c) 2016, Texas Instruments Incorporated Figure 9. Shutdown Implementation Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 11 SM72485 SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The SM72485 is a step-down DC-to-DC regulator. It is typically used to convert a higher DC voltage to a lower DC voltage with a maximum output current of 150 mA. The following design procedure can be used to select components for the SM72485. This section presents a simplified discussion of the design process. The final circuit is shown in Figure 10. The circuit was tested, and the resulting performance is shown in Figure 14 and Figure 15. 8.2 Typical Application 12V - 90V Input VCC VIN 8 C1 1.0 PF 7 C3 0.47 PF C5 0.1 PF BST RT 2 309k RT/SD C4 0.01 PF SM72485 6 L1 220 PH 10.0V SW VOUT 1 SHUTDOWN D1 RCL RFB2 3.01k R3 RFB1 1.0k C2 22 PF 3.3 3 RCL FB 316k RTN 5 4 GND Copyright (c) 2016, Texas Instruments Incorporated Figure 10. SM72485 Example Circuit Diagram 8.2.1 Design Requirements For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters 12 PARAMETER EXAMPLE VALUE Input voltage 12 V to 90 V Output voltage 10 V Minimum load current 100 mA Maximum load current 150 mA Feedback resistor ratio 3:1 Switching frequency 234 kHz Inductor 200 H Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 SM72485 www.ti.com SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 8.2.2 Detailed Design Procedure 8.2.2.1 Selection of External Components Here is a guide for determining the component values illustrated with a design example. See Functional Block Diagram and Table 2 for more information. The following sections configure the SM72485 for: * Input voltage (VIN): 12 V to 90 V * Output voltage (VOUT1): 10 V * Load current (for continuous conduction mode): 100 mA to 150 mA Table 2. Bill of Materials ITEM DESCRIPTION PART NUMBER VALUE C1 Ceramic capacitor TDK C4532X7R2A105M 1 F, 100 V C2 Ceramic capacitor TDK C4532X7R1E226M 22 F, 25 V C3 Ceramic capacitor Kemet C1206C474K5RAC 0.47 F, 50 V C4 Ceramic capacitor Kemet C1206C103K5RAC 0.01 F, 50 V C5 Ceramic capacitor TDK C3216X7R2A104M 0.1 F, 100 V D1 Schottky power diode Diodes Inc. DFLS1100 100 V, 1 A COILTRONICS DR125-221-R, or L1 Power inductor RFB2 Resistor RFB1 Resistor Vishay CRCW12061001F 1 k R3 Resistor Vishay CRCW12063R30F 3.3 RT Resistor Vishay CRCW12063093F 309 k TDK SLF10145T-221MR65 Vishay CRCW12063011F 220 H 3.01 k RCL Resistor Vishay CRCW12063163F 316 k U1 Switching regulator Texas Instruments SM72485 -- 8.2.2.1.1 RFB1 and RFB2 VOUT = VFB x (RFB1 + RFB2) / RFB1, and because VFB = 2.5 V, the ratio of RFB2 to RFB1 calculates as 3:1. Standard values of 3.01 k and 1 k are chosen. Other values could be used as long as the 3:1 ratio is maintained. 8.2.2.1.2 Fs and RT The recommended operating frequency range for the SM72485 is 50 kHz to 1.1 MHz. Unless the application requires a specific frequency, the choice of frequency is generally a compromise, because it affects the size of L1 and C2, and the switching losses. The maximum allowed frequency, based on a minimum on-time of 400 ns, is calculated from Equation 6. FMAX = VOUT / (VINMAX x 400 ns) (6) For this exercise, FMAX = 277 kHz. From Equation 2, RT calculates to 260 k. A standard value 309-k resistor is used to allow for tolerances in Equation 2, resulting in a frequency of 234 kHz. 8.2.2.1.3 L1 The main parameter affected by the inductor is the output current ripple amplitude. The choice of inductor value therefore depends on both the minimum and maximum load currents, keeping in mind that the maximum ripple current occurs at maximum VIN. Minimum load current: To maintain continuous conduction at minimum Io (100 mA), the ripple amplitude (IOR) must be less than 200 mAP-P so the lower peak of the waveform does not reach zero. L1 is calculated using Equation 7. VOUT x (VIN VOUT ) L1 IOR xFs x VIN (7) At VIN = 90 V, L1(min) calculates to 190 H. The next larger standard value (220 H) is chosen and with this value IOR calculates to 173 mAP-P at VIN = 90 V, and 32 mAP-P at VIN = 12 V. Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 13 SM72485 SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 www.ti.com Maximum load current: At a load current of 150 mA, the peak of the ripple waveform must not reach the minimum ensured value of the SM72485's current limit threshold (240 mA). Therefore the ripple amplitude must be less than 180 mAP-P, which is already satisfied in the above calculation. With L1 = 220 H, at maximum VIN and IO, the peak of the ripple is 236 mA. While L1 must carry this peak current without saturating or exceeding its temperature rating, it also must be capable of carrying the maximum specified value of the SM72485's current limit threshold (360 mA) without saturating, because the current limit is reached during start-up. The DC resistance of the inductor must be as low as possible to minimize its power loss. 8.2.2.1.4 C3 The capacitor on the VCC output provides not only noise filtering and stability, but its primary purpose is to prevent false triggering of the VCC UVLO at the buck switch on or off transitions. C3 must be no smaller than 0.47 F. 8.2.2.1.5 C2 and R3 When selecting the output filter capacitor C2, the items to consider are ripple voltage due to its ESR, ripple voltage due to its capacitance, and the nature of the load. 8.2.2.1.6 ESR and R3 A low ESR for C2 is generally desirable so as to minimize power losses and heating within the capacitor. However, the regulator requires a minimum amount of ripple voltage at the feedback input for proper loop operation. For the SM72485 the minimum ripple required at pin 5 is 25 mVP-P, requiring a minimum ripple at VOUT of 100 mV. Because the minimum ripple current (at minimum VIN) is 32 mAP-P, the minimum ESR required at VOUT is 100 mV / 32 mA = 3.12 . Because quality capacitors for SMPS applications have an ESR considerably less than this, R3 is inserted as shown in the Functional Block Diagram. R3's value, along with C2's ESR, must result in at least 25-mVP-P ripple at pin 5. Generally, R3 is 0.5 to 4 . 8.2.2.1.7 RCL When current limit is detected, the minimum off-time set by this resistor must be greater than the maximum normal off-time, which occurs at maximum input voltage. Using Equation 5, the minimum on-time is 476 ns, yielding an off-time of 3.8 s (at 234 kHz). Due to the 25% tolerance on the on-time, the off-time tolerance is also 25%, yielding a maximum off-time of 4.75 s. Allowing for the response time of the current limit detection circuit (350 ns) increases the maximum off-time to 5.1 s. This is increased an additional 25% to 6.4 s to allow for the tolerances of Equation 4. Using Equation 4, RCL calculates to 310 k at VFB = 2.5 V. A standard value 316-k resistor is used. 8.2.2.1.8 D1 The important parameters are reverse recovery time and forward voltage. The reverse recovery time determines how long the reverse current surge lasts each time the buck switch is turned on. The forward voltage drop is significant in the event the output is short-circuited as it is only this diode's voltage which forces the inductor current to reduce during the forced off-time. For this reason, a higher voltage is better, although that affects efficiency. A good choice is a Schottky power diode, such as the DFLS1100. D1's reverse voltage rating must be at least as great as the maximum VIN, and its current rating be greater than the maximum current limit threshold (360 mA). 8.2.2.1.9 C1 This capacitor's purpose is to supply most of the switch current during the on-time, and limit the voltage ripple at VIN, on the assumption that the voltage source feeding VIN has an output impedance greater than zero. At maximum load current, when the buck switch turns on, the current into pin 8 suddenly increases to the lower peak of the output current waveform, ramp up to the peak value, then drop to zero at turnoff. The average input current during this on-time is the load current (150 mA). For a worst case calculation, C1 must supply this average load current during the maximum on-time. To keep the input voltage ripple to less than 2 V (for this exercise), C1 is calculated by Equation 8. Ix tON 0.15 Ax 3.57Ps C1 = 0.268 PF 'V 2.0 V (8) 14 Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 SM72485 www.ti.com SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 Quality ceramic capacitors in this value have a low ESR which adds only a few millivolts to the ripple. It is the capacitance which is dominant in this case. To allow for the capacitor's tolerance, temperature effects, and voltage effects, a 1-F, 100-V, X7R capacitor is used. 8.2.2.1.10 C4 TI recommends a value of 0.01 F for C4, as this is appropriate in the majority of applications. A high-quality ceramic capacitor, with low ESR is recommended as C4 supplies the surge current to charge the buck switch gate at turnon. A low ESR also ensures a quick recharge during each off-time. At minimum VIN, when the on-time is at maximum, it is possible during start-up that the C4 does not fully recharge during each 300-ns off-time. The circuit is not able to complete the start-up and achieve output regulation then. This can occur when the frequency is intended to be low (for example, RT = 500 K). In this case, C4 must be increased so it can maintain sufficient voltage across the buck switch driver during each on-time. 8.2.2.1.11 C5 This capacitor helps avoid supply voltage transients and ringing due to long lead inductance at VIN. A low ESR, 0.1-F ceramic chip capacitor is recommended, placed close to the SM72485. 8.2.2.2 Low Output Ripple Configurations For applications where low output ripple is required, the following sections can be used to reduce or nearly eliminate the ripple. 8.2.2.2.1 Reduced Ripple Configuration In Figure 11, Cff is added across RFB2 to AC-couple the ripple at VOUT directly to the FB pin. This allows the ripple at VOUT to be reduced to a minimum of 25 mVp-p by reducing R3, because the ripple at VOUT is not attenuated by the feedback resistors. The minimum value for Cff is determined from Equation 9. 3 x t ON (max) Cff = (RFB1 / / RFB 2 ) where * tON(max) is the maximum on-time which occurs at VIN(min) (9) The next larger standard value capacitor must be used for Cff. L1 SW VOUT Cff SM72485 RFB2 R3 FB RFB1 C2 Copyright (c) 2016, Texas Instruments Incorporated Figure 11. Reduced Ripple Configuration Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 15 SM72485 SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 www.ti.com 8.2.2.2.2 Minimum Ripple Configuration If the application requires a lower value of ripple (<10 mVp-p), the circuit of Figure 12 can be used. R3 is removed, and the resulting output ripple voltage is determined by the inductor's ripple current and C2's characteristics. RA and CA are chosen to generate a sawtooth waveform at their junction, and that voltage is ACcoupled to the FB pin through CB. To determine the values for RA, CA and CB, use Equation 10. Calculate VA = VOUT - (VSW x (1 - (VOUT / VIN(min)))) where * VSW is the absolute value of the voltage at the SW pin during the off-time (typically 1 V) (10) VA is the DC voltage at the RA/CA junction, and is used in Equation 11. Calculate RA x CA = (VIN(min) - VA) x tON / V where * * tON is the maximum on-time (at minimum input voltage) V is the desired ripple amplitude at the RA/CA junction (typically 40 mV to 50 mV) (11) RA and CA are then chosen from standard value components to satisfy the above product. Typically CA is 1000 pF to 5000 pF, and RA is 10 k to 300 k. CB is then chosen large compared to CA, typically 0.1 F. L1 SW VOUT SM72485 CA RA C2 RFB2 FB CB RFB1 Copyright (c) 2016, Texas Instruments Incorporated Figure 12. Minimum Output Ripple Using Ripple Injection 8.2.2.2.3 Alternate Minimum Ripple Configuration The circuit in Figure 13 is the same as that in the block diagram, except the output voltage is taken from the junction of R3 and C2. The ripple at VOUT is determined by the inductor's ripple current and C2's characteristics. However, R3 slightly degrades the load regulation. This circuit may be suitable if the load current is fairly constant. L1 SW SM72485 RFB2 R3 FB VOUT RFB1 C2 Copyright (c) 2016, Texas Instruments Incorporated Figure 13. Alternate Minimum Output Ripple 16 Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 SM72485 www.ti.com SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 8.2.3 Application Curves Figure 14. Efficiency vs Load Current and VIN Figure 15. Efficiency vs VIN 9 Power Supply Recommendations The SM72485 is designed to operate from an input voltage supply range between 6 V and 95 V. This input supply must be able to withstand the maximum input current and maintain a stable voltage. The resistance of the input supply rail must be low enough that an input current transient does not cause a high enough drop at the SM72485 supply voltage that can cause a false UVLO fault triggering and system reset. If the input supply is placed more than a few inches from the SM72485, additional bulk capacitance may be required in addition to the ceramic input capacitors. The amount of bulk capacitance is not critical, but a 47-F or 100-F electrolytic capacitor is a typical choice. Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 17 SM72485 SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 www.ti.com 10 Layout 10.1 Layout Guidelines A proper layout is essential for optimum performance of the circuit. In particular, the following guidelines must be observed. 1. CIN: The loop consisting of input capacitor (CIN), VIN pin, and RTN pin carries switching currents. Therefore, the input capacitor must be placed close to the IC, directly across VIN and RTN pins and the connections to these two pins must be direct to minimize the loop area. In general, it is not possible to accommodate all of input capacitance near the IC. A good practice is to use a 0.1-F or 0.47-F capacitor directly across the VIN and RTN pins close to the IC, and the remaining bulk capacitor as close as possible. 2. CVCC and CBST: The VCC and bootstrap (BST) bypass capacitors supply switching currents to the highand low-side gate drivers. These two capacitors must also be placed as close to the IC as possible, and the connecting trace length and loop area must be minimized. 3. The Feedback trace carries the output voltage information and a small ripple component that is necessary for proper operation of SM72485. Therefore, take care while routing the feedback trace to avoid coupling any noise to this pin. In particular, feedback trace must not run close to magnetic components, or parallel to any other switching trace. 4. SW trace: The SW node switches rapidly between VIN and GND every cycle and is therefore a possible source of noise. The SW node area must be minimized. In particular, the SW node must not be inadvertently connected to a copper plane or pour. 10.2 Layout Example Figure 16. Layout Recommendation 18 Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 SM72485 www.ti.com SNVS697E - JANUARY 2011 - REVISED DECEMBER 2016 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation see the following: Absolute Maximum Ratings for Soldering (SNOA549) 11.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.6 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 2011-2016, Texas Instruments Incorporated Product Folder Links: SM72485 19 PACKAGE OPTION ADDENDUM www.ti.com 26-Aug-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) SM72485MM/NOPB NRND VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 2485 SM72485MME/NOPB NRND VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 2485 SM72485MMX/NOPB NRND VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 2485 SM72485SD/NOPB NRND WSON NGU 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 S2485 SM72485SDE/NOPB NRND WSON NGU 8 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 S2485 SM72485SDX/NOPB NRND WSON NGU 8 4500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 S2485 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 26-Aug-2016 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 13-Jul-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SM72485MM/NOPB VSSOP DGK 8 SM72485MME/NOPB VSSOP DGK SM72485MMX/NOPB VSSOP DGK SM72485SD/NOPB WSON SM72485SDE/NOPB SM72485SDX/NOPB SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 8 250 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 NGU 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 WSON NGU 8 250 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 WSON NGU 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 13-Jul-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SM72485MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 SM72485MME/NOPB VSSOP DGK 8 250 210.0 185.0 35.0 SM72485MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 SM72485SD/NOPB WSON NGU 8 1000 210.0 185.0 35.0 SM72485SDE/NOPB WSON NGU 8 250 210.0 185.0 35.0 SM72485SDX/NOPB WSON NGU 8 4500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NGU0008B SDC08B (Rev A) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2016, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: SM72485SD/NOPB SM72485SDX/NOPB SM72485SDE/NOPB SM72485MMX/NOPB SM72485MM/NOPB SM72485MME/NOPB