GS81302D08GE-300 - GSI Technology

GS81302D08/09/18/36E-375/350/333/300/250

144Mb SigmaQuadTM-II

Burst of 4 SRAM

375 MHz–250 MHz

1.8 V VDD

1.8 V and 1.5 V I/O

165-Bump BGA

Commercial Temp

Industrial Temp

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Features

• Simultaneous Read and Write SigmaQuad™ Interface

• JEDEC-standard pinout and package

• Dual Double Data Rate interface

• Byte Write controls sample d at da ta-i n time

• Burst of 4 Read and Write

• 1.8 V +100/–100 mV core power supply

• 1.5 V or 1.8 V HSTL Interface

• Pipelined read operation

• Fully coherent read and write pipelin es

• ZQ pin for programmable output dri ve streng th

• IEEE 1149.1 JTAG-compliant Boundary Scan

• Pin-compatible with present 144 Mb devices

• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package

• RoHS-compliant 165-bump BGA package available

SigmaQuad™ Family Overview

The GS81302D08/09/18/36E are built in compliance with the

SigmaQuad-II SRAM pinout standard for Separate I/O

synchronous SRAMs. They are 150,9 94,944-bit (144Mb)

SRAMs. The GS81302D08/ 09/18/36E SigmaQuad SRAMs

are just one element in a family of low power, low voltage

HSTL I/O SRAMs designed to operate at the speeds needed to

implement economical high performance networking systems.

Clocking and Addressing Schemes

The GS81302D08/09/18/36E SigmaQuad -II SRAMs are

synchronous devices. They em pl oy two input register clock

inputs, K and K. K and K are independent single-ended clock

inputs, not differential inputs to a single differential clock input

buffer. The device also allows the user to manipulate the

output register clock inputs quasi independently with the C and

C clock inputs. C and C are also independent single-ended

clock inputs, not differential inputs. If the C clocks are tied

high, the K clocks are routed internally to fire the output

registers instead.

Each internal read and write operation in a SigmaQuad-II B4

RAM is four times wider than the device I/O bus. An input

data bus de-multiplexer is used to accumulate incoming data

before it is simultaneously written to the mem ory array. An

output data multiplexer is used to capture the data produced

from a single memory array read and then route it to the

appropriate output drivers as needed. Therefore the address

field of a SigmaQuad-II B4 RAM is always two address pins

less than the advertised index depth (e.g., the 16M x 8 has a

4M addressable index).

Parameter Synopsis

-375 -350 -333 -300 -250

tKHKH 2.66 ns 2.86 ns 3.0 ns 3.3 ns 4.0 ns

tKHQV 0.45 ns 0.45 ns 0.45 ns 0.45 ns 0.45 ns

4M x 36 SigmaQuad-II SRAM—Top View

12345678910 11

A CQ NA/SA

(288Mb) SA WBW2 KBW1 RSA SA CQ

B Q27 Q18 D18 SA BW3 KBW0 SA D17 Q17 Q8

C D27 Q28 D19 VSS SA NC SA VSS D16 Q7 D8

D D28 D20 Q19 VSS VSS VSS VSS VSS Q16 D15 D7

E Q29 D29 Q20 VDDQ VSS VSS VSS VDDQ Q15 D6 Q6

F Q30 Q21 D21 VDDQ VDD VSS VDD VDDQ D14 Q14 Q5

G D30 D22 Q22 VDDQ VDD VSS VDD VDDQ Q13 D13 D5

H Doff VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ

J D31 Q31 D23 VDDQ VDD VSS VDD VDDQ D12 Q4 D4

K Q32 D32 Q23 VDDQ VDD VSS VDD VDDQ Q12 D3 Q3

L Q33 Q24 D24 VDDQ VSS VSS VSS VDDQ D11 Q11 Q2

M D33 Q34 D25 VSS VSS VSS VSS VSS D10 Q1 D2

N D34 D26 Q25 VSS SA SA SA VSS Q10 D9 D1

P Q35 D35 Q26 SA SA CSA SA Q9 D0 Q0

R TDO TCK SA SA SA CSA SA SA TMS TDI

11 x 15 Bump BGA—15 x 17 mm2 Body—1 mm Bump Pitch

Notes:

1. BW0 controls writes to D0:D8; BW1 controls writes to D9:D17; BW2 controls writes to D18:D26; BW3 controls writes to D27:D35.

2. A2 is the expansion address.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

8M x 18 SigmaQuad-II SRAM—Top View

12345678910 11

A CQ SA SA WBW1 KNC/SA

(288Mb) RSA SA CQ

B NC Q9 D9 SA NC KBW0 SA NC NC Q8

C NC NC D10 VSS SA NC SA VSS NC Q7 D8

D NC D11 Q10 VSS VSS VSS VSS VSS NC NC D7

E NC NC Q11 VDDQ VSS VSS VSS VDDQ NC D6 Q6

F NC Q12 D12 VDDQ VDD VSS VDD VDDQ NC NC Q5

G NC D13 Q13 VDDQ VDD VSS VDD VDDQ NC NC D5

H Doff VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ

J NC NC D14 VDDQ VDD VSS VDD VDDQ NC Q4 D4

K NC NC Q14 VDDQ VDD VSS VDD VDDQ NC D3 Q3

L NC Q15 D15 VDDQ VSS VSS VSS VDDQ NC NC Q2

M NC NC D16 VSS VSS VSS VSS VSS NC Q1 D2

N NC D17 Q16 VSS SA SA SA VSS NC NC D1

P NC NC Q17 SA SA CSA SA NC D0 Q0

R TDO TCK SA SA SA CSA SA SA TMS TDI

11 x 15 Bump BGA—15 x 17 mm2 Body—1 mm Bump Pitch

Notes:

1. BW0 controls writes to D0:D8. BW1 controls writes to D9:D17.

2. A7 is the expansion address.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

16M x 9 SigmaQuad-II SRAM—Top View

12345678910 11

A CQ SA SA WNC KSA RSA SA CQ

B NC NC NC SA NC/SA

(288Mb) KBW0 SA NC NC Q4

C NC NC NC VSS SA NC SA VSS NC NC D4

D NC D5 NC VSS VSS VSS VSS VSS NC NC NC

E NC NC Q5 VDDQ VSS VSS VSS V DDQ NC D3 Q3

F NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC

G NC D6 Q6 VDDQ VDD VSS VDD VDDQ NC NC NC

H Doff VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ

J NC NC NC VDDQ VDD VSS VDD VDDQ NC Q2 D2

K NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC

L NC Q7 D7 VDDQ VSS VSS VSS VDDQ NC NC Q1

M NC NC NC VSS VSS VSS VSS VSS NC NC D1

N NC D8 NC VSS SA SA SA VSS NC NC NC

P NC NC Q8 SA SA CSA SA NC D0 Q0

R TDO TCK SA SA SA CSA SA SA TMS TDI

11 x 15 Bump BGA—13 x 15 mm2 Body—1 mm Bump Pitch

Notes:

1. BW0 controls writes to D0:D8.

2. B5 is the expansion address.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

16M x 8 SigmaQuad-II SRAM—Top View

12345678910 11

A CQ SA SA WNW1 KSA RSA SA CQ

B NC NC NC SA NC/SA

(288Mb) KNW0 SA NC NC Q3

C NC NC NC VSS SA NC SA VSS NC NC D3

D NC D4 NC VSS VSS VSS VSS VSS NC NC NC

E NC NC Q4 VDDQ VSS VSS VSS V DDQ NC D2 Q2

F NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC

G NC D5 Q5 VDDQ VDD VSS VDD VDDQ NC NC NC

H Doff VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ

J NC NC NC VDDQ VDD VSS VDD VDDQ NC Q1 D1

K NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC

L NC Q6 D6 VDDQ VSS VSS VSS VDDQ NC NC Q0

M NC NC NC VSS VSS VSS VSS VSS NC NC D0

N NC D7 NC VSS SA SA SA VSS NC NC NC

P NC NC Q7 SA SA CSA SA NC NC NC

R TDO TCK SA SA SA CSA SA SA TMS TDI

11 x 15 Bump BGA—15 x 17 mm2 Body—1 mm Bump Pitch

Notes:

1. NW0 controls writes to D0:D3. NW1 controls writes to D4:D7.

2. B5 is the expansion address.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Pin Description Table

Symbol Description Type Comments

SA Synchronous Address Inputs Input —

RSynchronous Read Input Active Low

WSynchronous Write Input Active Low

BW0–BW3 Synchronous Byte Writes Input Active Low

x9/x18/x36 only

NW0–NW1 Nybble Write Control Pin Input Active Low

x8 only

KInput Clock Input Active High

KInput Clock Input Active Low

COutput Clock Input Active High

COutput Clock Input Active Low

TMS Test Mode Select Input —

TDI Test Data Input Input —

TCK Test Clock Input Input —

TDO Test Data Output Output —

VREF HSTL Input Reference Voltage Input —

ZQ Output Impedance Matching Input Input —

Qn Synchronous Data Outputs Output —

Dn Synchronous Data Inputs Input —

Doff Disable DLL when low Input Active Low

CQ Output Echo Clock Output —

VDD Power Supply Supply 1.8 V Nominal

VDDQ Isolated Output Buffer Supply Supply 1.5 or 1.8 V Nominal

VSS Power Supply: Ground Supply —

NC No Connect — —

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Notes:

1. NC = Not Connected to die or any other pin

2. When ZQ pin is directly connected to VDDQ, output impedance is set to minimum value and it cannot be connected to ground or left

unconnected.

3. C, C, K, K cannot be set to VREF voltage.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Background

Separate I/O SRAMs, from a system architecture point of view, are attractive in applications where alternating reads and writes are

needed. Therefore, the SigmaQuad-II SRAM interface and truth table are optimized for alternating reads and writes. Separate I/O

SRAMs are unpopular in applications where multiple reads or multiple writes are needed because burst read or write transfers from

Separate I/O SRAMs can cut the RAM’s bandwidth in half.

SigmaQuad-II B4 SRAM DDR Read

The status of the Address Input, W, and R pins are sampled by the rising edges of K. W and R high causes chip disable. A low on

the Read Enable-bar pin, R, begins a read cycle. R is always ignored if the previous command loaded was a read command. Data

can be clocked out after the next rising edge of K with a rising edge of C (or by K if C and C are tied high), after the following

rising edge of K with a rising edge of C (or by K if C and C are tied high), after the next rising edge of K with a rising edge of C,

and after the following rising edge of K with a risin g edge of C. Clocking in a high on th e Read Enable-b ar pin, R, begins a read

port deselect cycle.

Read A NOP Read B Write C Read D Write E NOP

A B C D E

CC+1 C+2 C+3 EE+1

AA+1 A+2 A+3 BB+1 B+2 B+3 DD+1 D+2

Address

BWx

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

SigmaQuad-II B4 SRAM DDR Write

The status of the Address Input, W, and R pins are sampled by the rising edges of K. W and R high causes chip disable. A low on

the Write Enable-bar pin, W, and a high on the Read Enable-bar pin, R, begins a write cycle. W is alway s ignored if the previous

command was a write command. Data is clocked in by the next rising edge of K, the rising edge of K after that, the next rising edge

of K, and finally by the next rising edge of K.

Write A NOP Read B Write C Read D Write E NOP

A B C D E

AA+1 A+2 A+3 CC+1 C+2 C+3 EE+1 E+

BB+1 B+2 B+3 DD+1 D+2

Address

BWx

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Special Functions

Byte Write and Nybble Write Control

Byte Write Enable pins are sampled at the same time that Data In is sampled. A high on the Byte Write Enable pin associated with

a particular byte (e.g., BW0 controls D0–D8 inputs) will inhibit the storage of that particular byte, leavi ng whatever data may be

stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pin s ma y be dri ven high or low

during the data in sample times in a write sequence.

Each write enable command and write address loaded into the RAM provides the base address for a 4 beat data transfer. The x18

version of the RAM, for example, may write 72 bits in association with each address loaded. Any 9-bit byte may be masked in any

write sequence.

Nybble Write (4-bit) contro l is imp lemented on the 8-bit-wide version of the device. For the x8 version of the device, “Nybble

Write Enable” and “NBx” may be substituted in all the discus sion above.

Example x18 RAM Write Sequence using Byte Write Enables

Data In Sample Time BW0 BW1 D0–D8 D9–D17

Beat 1 0 1 Data In Don’t Care

Beat 2 1 0 Don’t Care Data In

Beat 3 0 0 Data In Data In

Beat 4 1 0 Don’t Care Data In

Resulting Write Operation

Byte 1

D0–D8 Byte 2

D9–D17 Byte 1

D0–D8 Byte 2

D9–D17 Byte 1

D0–D8 Byte 2

D9–D17 Byte 1

D0–D8 Byte 2

D9–D17

Written Unchanged Unchanged Written Written Written Unchanged Written

Beat 1 Beat 2 Beat 3 Beat 4

Output Register Cont rol

SigmaQuad-II SRAMs offer two mechanisms for controlling the output data regi sters. Typically, control is handled by the Output

Register Clock inputs, C and C. The Output Register Clock inputs can be used to make small phase adjustments in the firing of the

output registers by allowing the user to delay driving data out as much as a few nanoseconds beyond the next rising edges of the K

and K clocks. If the C and C clock inputs are tied high, the RAM reverts to K and K control of the outputs, allowing the RAM to

function as a conventional pipelined read SRAM.

A0–An

D1–DnBank 0 Bank 1 Bank 2 Bank 3

RRR

QQQ Q

CCCC

Q1–Qn

Note:

For simplicity BWn, NW n, K, and C are not shown.

CQ CQ CQ CQ

CQ0

CQ1

CQ2

CQ3

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Example Four Bank Depth Expansion Schematic

Burst of 4 SigmaQuad-II SRAM Depth Expansion

Read A Write B Read C Write D Read E Write F NOP

A B C D E F

DD+1 D+2 D+3

BB+1 B+2 B+3 F F+1 F

AA+1 A+2 A+3 EE+1 E+2

CC+1 C+2 C+3

Address

R(1)

R(2)

W(1)

W(2)

BWx(1)

D(1)

BWx(2)

D(2)

C[1]

Q(1)

CQ(1)

CQ[1]

C[2]

Q(2)

CQ[2]

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

FLXDrive-II Output Driver Impedance Control

HSTL I/O SigmaQuad-II SRAMs are supplied with programm a ble im pedance output drivers. The ZQ pin must be connected to

VSS via an external resistor, RQ, to allow the SRAM to monitor and adjust its output driver im pedance. The value of RQ must be

5X the value of the desired RAM output impedance. The allowable range of RQ to guarantee impedance matching continuously is

between 175Ω and 350Ω. Periodic readjustment of the output driver impedance is necessary as the impedance is affected by drifts

in supply voltage and temperature. The SRAM’s output impedance circuitry compensates for drifts in supply voltage and

temperature. A clock cycle counter periodically triggers an impedance evaluation, resets and counts again. Each impedance

evaluation may move the output driver impedance level one step at a time towards the optimum level. The output driver is

implemented with discrete binary weighted impedance steps.

x36 Byte Write Enable (BWn) Truth Table

BW0 BW1 BW2 BW3 D0–D8 D9–D17 D18–D26 D27–D35

1 1 1 1 Don’t Care Don’t Care Don’t Care Don’t Care

0 1 1 1 Data In Don’t Care Don’t Care Don’t Care

1 0 1 1 Don’t Care Data In Don’t Care Don’t Care

0 0 1 1 Data In Data In Don’t Care Don’t Care

1 1 0 1 Don’t Care Don’t Care Data In Don’t Care

0 1 0 1 Data In Don’t Care Data In Don’t Care

1 0 0 1 Don’t Care Data In Data In Don’t Care

0 0 0 1 Data In Data In Data In Don’t Care

1 1 1 0 Don’t Care Don’t Care Don’t Care Data In

0 1 1 0 Data In Don’t Care Don’t Care Data In

1 0 1 0 Don’t Care Data In Don’t Care Data In

0 0 1 0 Data In Data In Don’t Care Data In

1 1 0 0 Don’t Care Don’t Care Data In Data In

0 1 0 0 Data In Don’t Care Data In Data In

1 0 0 0 Don’t Care Data In Data In Data In

0 0 0 0 Data In Data In Data In Data In

x18 Byte Write Enable (BWn) Truth Table

BW0 BW1 D0–D8 D9–D17

1 1 Don’t Care Don’t Care

0 1 Data In Don’t Care

1 0 Don’t Care Data In

0 0 Data In Data In

x09 Byte Write Enable (BWn) Truth Table

BW0 D0–D8

1Don’t Care

0Data In

1Don’t Care

0Data In

x8 Nybble Write Enable (NWn) Truth Table

NW0 NW1 D0–D3 D4–D7

1 1 Don’t Care Don’t Care

0 1 Data In Don’t Care

1 0 Don’t Care Data In

0 0 Data In Data In

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Absolute Maximum Ratings

(All voltages reference to VSS)

Symbol Description Value Unit

VDD Voltage on VDD Pins –0.5 to 2.9 V

VDDQ Voltage in VDDQ Pins –0.5 to VDD V

VREF Voltage in VREF Pins –0.5 to VDDQ V

VI/O Voltage on I/O Pins –0.5 to VDDQ +0.5 (≤ 2.9 V max.) V

VIN Voltage on Other Input Pins –0.5 to VDDQ +0.5 (≤ 2.9 V max.) V

IIN Input Current on Any Pin +/–100 mA dc

IOUT Output Current on Any I/O Pin +/–100 mA dc

TJMaximum Junction Temperature 125 oC

TSTG Storage Temperature –55 to 125 oC

Note:

Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended

Operating Conditions. Exposure to conditions exceeding the Recommended Operating Conditions, for an extended period of time, may affect

reliability of this component.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Recommended Operating Conditions

Power Supplies

Parameter Symbol Min. Typ. Max. Unit

Supply Voltage VDD 1.7 1.8 1.9 V

I/O Supply Voltage VDDQ 1.4 —VDD V

Reference Voltage VREF 0.68 —0.95 V

Note:

The power supplies need to be powered up simultaneously or in the following sequence: VDD, VDDQ, VREF, followed by signal inputs. The power

down sequence must be the reverse. VDDQ must not exceed VDD. For more information, read AN1021 SigmaQuad and SigmaDDR Power-Up.

Operating Temperature

Parameter Symbol Min. Typ. Max. Unit

Junction Temperature

(Commercial Range Versions) TJ025 85 °C

Junction Temperature

(Industrial Range Versions)* TJ–40 25 100 °C

Note:

* The part numbers of Industrial Temperature Range versions end with the character “I”. Unless otherwise noted, all performance specifications

quoted are evaluated for worst case in the temperature range marked on the device.

Thermal Impedance

Package Test PCB

Substrate θ JA (C°/W)

Airflow = 0 m/s θ JA (C°/W)

Airflow = 1 m/s θ JA (C°/W)

Airflow = 2 m/s θ JB (C°/W) θ JC (C°/W)

165 BGA 4-layer 16.4 13.4 12.4 8.6 1.2

Notes:

1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.

2. Please refer to JEDEC standard JESD51-6.

3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to

the PCB can result in cooling or heating of the RAM depending on PCB temperature.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

HSTL I/O DC Input Characteristics

Parameter Symbol Min Max Units Notes

DC Input Logic High VIH (dc) VREF + 0.1 VDDQ + 0.3 V 1

DC Input Logic Low VIL (dc) –0.3 VREF – 0.1 V 1

Notes:

1. Compatible with both 1.8 V and 1.5 V I/O drivers.

2. These are DC test criteria. DC design criteria is VREF ± 50 mV. The AC VIH/VIL levels are defined separately for measuring timing

parameters.

3. VIL (Min)DC = –0.3 V, VIL(Min)AC = –1.5 V (pulse width ≤ 3 ns).

4. VIH (Max)DC = VDDQ + 0.3 V, VIH(Max)AC = VDDQ + 0.85 V (pulse width ≤ 3 ns).

HSTL I/O AC Input Characteristics

Parameter Symbol Min Max Units Notes

AC Input Logic High VIH (ac) VREF + 200 —mV 2,3

AC Input Logic Low VIL (ac) —VREF – 200 mV 2,3

VREF Peak-to-Peak AC Voltage VREF (ac) —5% VREF (DC) mV 1

Notes:

1. The peak-to-peak AC component superimposed on VREF may not exceed 5% of the DC component of VREF.

2. To guarantee AC characteristics, VIH,VIL, Trise, and Tfall of inputs and clocks must be within 10% of each other.

3. For devices supplied with HSTL I/O input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

20% tKHKH

VSS – 1.0 V

50%

VSS

VIH

Undershoot Measurement and Timing Overshoot Measurement and Timing

20% tKHKH

VDD + 1.0 V

50%

VDD

VIL

Capacitance

oC, f = 1 MHZ, VDD = 1.8 V)

Parameter Symbol Test conditions Typ. Max. Unit

Input Capacitance CIN VIN = 0 V 4 5 pF

Output Capacitance COUT VOUT = 0 V 6 7 pF

Clock Capacitance CCLK VIN = 0 V 5 6 pF

Note:

This parameter is sample tested.

AC Test Conditions

Parameter Conditions

Input high level 1.25 V

Input low level 0.25 V

Max. input slew rate 2 V/ns

Input reference level 0.75 V

Output reference level VDDQ/2

Note:

Test conditions as specified with output loading as shown unless otherwise noted.

VT = VDDQ/2

50Ω

RQ = 250 Ω (HSTL I/O)

VREF = 0.75 V

AC Test Load Diagram

(TA = 25

Input and Output Leakage Characteristics

Parameter Symbol Test Conditions Min. Max

Input Leakage Current

(except mode pins) IIL VIN = 0 to VDD –2 uA 2 uA

Doff IILDOFF VIN = 0 to VDD –20 uA 2 uA

Output Leakage Current IOL Output Disable,

VOUT = 0 to VDDQ –2 uA 2 uA

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Programmable Impedance HSTL Output Driver DC Electrical Characteristics

Parameter Symbol Min. Max. Units Notes

Output High Voltage VOH1 VDDQ/2 – 0.12 VDDQ/2 + 0.12 V 1, 3

Output Low Voltage VOL1 VDDQ/2 – 0.12 VDDQ/2 + 0.12 V 2, 3

Output High Voltage VOH2 VDDQ – 0.2 VDDQ V 4, 5

Output Low Voltage VOL2 Vss 0.2 V 4, 6

Notes:

1. IOH = (VDDQ/2) / (RQ/5) +/– 15% @ VOH = VDDQ/2 (for: 175Ω ≤ RQ ≤ 350Ω).

2. IOL = (VDDQ/2) / (RQ/5) +/– 15% @ VOL = VDDQ/2 (for: 175Ω ≤ RQ ≤ 350Ω).

3. Parameter tested with RQ = 250Ω and VDDQ = 1.5 V or 1.8 V

4. 0Ω ≤ RQ ≤ ∞Ω

5. IOH = –1.0 mA

6. IOL = 1.0 mA

Operating Currents

Parameter Symbol Test Conditions

-375 -350 -333 -300 -250

Notes

70°C

–40

85°C

70°C

–40

85°C

70°C

–40

85°C

70°C

–40

85°C

70°C

–40

85°C

Operating Current

(x36): DDR IDD VDD = Max, IOUT = 0 mA

Cycle Time ≥ tKHKH Min 1105

mA 1115

mA 1055

mA 1065

mA 1000

mA 1010

mA 915

mA 925

mA 790

mA 800

mA 2, 3

Operating Current

(x18): DDR IDD VDD = Max, IOUT = 0 mA

Cycle Time ≥ tKHKH Min 995

mA 1005

mA 940

mA 950

mA 890

mA 900

mA 815

mA 825

mA 700

mA 710

mA 2, 3

Operating Current

(x9): DDR IDD VDD = Max, IOUT = 0 mA

Cycle Time ≥ tKHKH Min 995

mA 1005

mA 940

mA 950

mA 890

mA 900

mA 815

mA 825

mA 700

mA 710

mA 2, 3

Operating Current

(x8): DDR IDD VDD = Max, IOUT = 0 mA

Cycle Time ≥ tKHKH Min 995

mA 1005

mA 940

mA 950

mA 890

mA 900

mA 815

mA 825

mA 700

mA 710

mA 2, 3

Standby Current

(NOP): DDR ISB1

Device deselected,

IOUT = 0 mA, f = Max,

All Inputs ≤ 0.2 V or ≥ VDD – 0.2 V

310

mA 320

mA 295

mA 305

mA 275

mA 285

mA 265

mA 275

mA 250

mA 260

mA 2, 4

Notes:

1. Power measured with out put pins floating.

2. Minimum cycle, IOUT = 0 mA

3. Operating current is calculated with 50% read cycles and 50% write cycles.

4. Standby Current is only af ter all pending read and write burst operations are completed.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

AC Electrical Characteristics

Parameter Symbol -375 -350 -333 -300 -250 Units Notes

Min Max Min Max Min Max Min Max Min Max

Clock

K, K Clock Cycle Time

C, C Clock Cycle Time tKHKH

tCHCH 2.66 8.4 2.86 8.4 3.0 8.4 3.3 8.4 4.0 8.4 ns

tKC Variable tKCVar —0.2 —0.2 —0.2 —0.2 —0.2 ns 6

K, K Clock High Pulse Width

C, C Clock High Pulse Width tKHKL

tCHCL 1.06 —1.14 —1.2 —1.32 —1.6 —ns

K, K Clock Low Pulse Width

C, C Clock Low Pulse Width tKLKH

tCLCH 1.06 —1.14 —1.2 —1.32 —1.6 —ns

K to K High

C to C High tKHKH

tCHCH 1.13 —1.23 —1.35 —1.49 —1.8 —ns

K to K High

C to C High tKHKH

tCHCH 1.13 —1.23 —1.35 —1.49 —1.8 —ns

K, K Clock High to C, C Clock High tKHCH 01.21 01.29 01.35 01.49 01.8 ns

DLL Lock Time tKCLock 1024 —1024 —1024 —1024 —1024 —cycle 7

K Static to DLL reset tKCReset 30 —30 —30 —30 —30 —ns

Output Times

K, K Clock High to Data Output V alid

C, C Clock High to Data Output Valid tKHQV

tCHQV —0.45 —0.45 —0.45 —0.45 —0.45 ns 4

K, K Clock High to Data Output Hold

C, C Clock High to Data Output Hold tKHQX

tCHQX –0.45 —–0.45 —–0.45 —–0.45 —–0.45 —ns 4

K, K Clock High to Echo Clock Valid

C, C Clock High to Echo Clock Valid tKHCQV

tCHCQV —0.45 —0.45 —0.45 —0.45 —0.45 ns

K, K Clock High to Echo Clock Hold

C, C Clock High to Echo Clock Hold tKHCQX

tCHCQX –0.45 —–0.45 —–0.45 —–0.45 —–0.45 —ns

CQ, CQ High Output Valid tCQHQV —0.2 —0.23 —0.25 —0.27 —0.30 ns 8

CQ, CQ High Output Hold tCQHQX –0.2 —–0.23 —–0.25 —–0.27 —–0.30 —ns 8

CQ Phase Distortion tCQHCQH

tCQHCQH 0.9 —1.0 —1.10 —1.24 —1.55 —ns

K Clock High to Data Output High-Z

C Clock High to Data Output High-Z tKHQZ

tCHQZ —0.45 —0.45 —0.45 —0.45 —0.45 ns 4

K Clock High to Data Output Low-Z

C Clock High to Data Output Low-Z tKHQX1

tCHQX1 –0.45 —–0.45 —–0.45 —–0.45 —–0.45 —ns 4

Setup Times

Address Input Setup Time tAVKH 0.4 —0.4 —0.4 —0.4 —0.5 —ns 1

Control Input Setup Ti me (R, W) tIVKH 0.4 —0.4 —0.4 —0.4 —0.5 —ns 2

Control Input Setup Ti me (BWX), (BWX)tIVKH 0.28 —0.28 —0.28 —0.3 —0.35 —ns 3

Data Input Setup Time tDVKH 0.28 —0.28 —0.28 —0.3 —0.35 —ns

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Hold Times

Address Input Hold Time tKHAX 0.4 —0.4 —0.4 —0.4 —0.5 —ns 1

Control Input Hold Time (R, W) tKHIX 0.4 —0.4 —0.4 —0.4 —0.5 —ns 2

Control Input Hold Time (BWX), (BWX)tKHIX 0.28 —0.28 —0.28 —0.3 —0.35 —ns 3

Data Input Hold Time tKHDX 0.28 —0.28 —0.28 —0.3 —0.35 —ns

Notes:

1. All Address inputs must meet the sp ecified setup and hold times for all latching clock edges.

2. Control signals are R, W

3. Control signals are BW0, BW1, and (NW0, NW1 for x8) and (BW2, BW3 for x36).

4. If C, C are tied high, K, K become the reference s for C, C timing parameters

5. To avoid bus contention, at a given voltage and temperature tCHQX1 is bigger than tCHQZ. The specs as shown do not imply bus contention because tCHQX1 is a MIN

parameter that is worst case at tot ally different test condit ions (0°C, 1.9 V) than tCHQZ, which is a MAX parameter (worst case at 70 °C, 1.7 V). It is not possible for two

SRAMs on the same board to be at such different voltages and temperatures.

6. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge.

7. VDD slew rate must be less than 0.1 V DC per 50 ns for DLL lock retention. DLL lock time begins once VDD and input clock are stable.

8. Echo clock is very tightly controlled to data valid/data hold. By design, there is a ±0.1 ns variation from echo clock to data. The datasheet parameters reflect tester guard

bands and test setup variations.

AC Electrical Characteristics (Continued)

Parameter Symbol -375 -350 -333 -300 -250 Units Notes

Min Max Min Max Min Max Min Max Min Max

K and K Controlled Read-Write-Read Timing Diagram

Read A Write B NOP Write C Read D Write E NOP

A B C D E

BB+1 B+2 B+3 CC+1 C+2 C+3 EE+1

AA+1 A+2 A+3 DD+1 D+2

CQHQVKHCQV

KHCQX

CQHQXKHCQV

KHCQX

KHQZ

KHQXKHQV

KHQX1

KHDXDVKH

KHIX

IVKH

KHIX

IVKH

KHIX

IVKH

AVKH

KHKHbar

KLKHKLKH

KHKLKHKL

KHKHKHKH

Address

BWx

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

C and C Controlled Read-Write-Read Timing Diagram

Read A NOP Read B Write C NOP Write D NOP

A B C D

CC+1 C+2 C+3 DD+1 D

AA+1 A+2 A+3 BB+1 B+2 B+3

CQHQV

CHCQX

CQHQX

CHCQV

CHCQX

CHQZCHQX

CHQV

CHQX1

DVKHKHDX

KHIXIVKH

KHIX

IVKH

KHIX

IVKH

KHAX

AVKH

KHKHbar

KLKHKLKH

KHKLKHKL

KHKHKHKH

Address

BWx

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

JTAG Port Operation

Overview

The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1 -1990, a serial boundary scan

interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with VDD. The JTAG output

drivers are powered by VDD.

Disabling the JTAG Port

It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless

clocked. TCK, TDI, and TMS are designed with internal pul l-up circuits.To assure normal operation of the RAM with the JTAG

Port unused, TCK, TDI, and TMS may be left floating or tied to either VDD or VSS. TDO sh ould be left unconnected.

JTAG Pin Descriptions

Pin Pin Name I/O Description

TCK Test Clock In Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate

from the falling edge of TCK.

TMS Test Mode Select In The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP

controller state machine. An undriven TMS input will produce the same result as a logic one input

level.

TDI Te st Data In In

The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers

placed between TDI and TDO. The register placed between TDI and TDO is determined by the

state of the TAP Controller state machine and the instruction that is currently loaded in the TAP

Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce

the same result as a logic one input level.

TDO Test Data Out Out Output that is active depending on the state of the TAP state machine. Output changes in

response to the falling edge of TCK. This is the output side of the serial registers placed between

TDI and TDO.

Note:

This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is

held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.

JTAG Port Registers

Overview

The various JTAG registers, refered to as Test Access Port or TAP Registers, are selected (one at a time) via the sequences of 1s

and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register th at captures serial inp ut data on the

rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the

TDI and TDO pins.

Instruction Register

The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or

the various data register states. Instruct ions are 3 bits long. The Instruction Register can be loaded when it is placed between the

TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the

controller is placed in Test-Logic-Reset state.

Bypass Register

The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through

the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Boundary Scan Register

The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.

The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The

Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the

device pins and the bits in the Boundary Scan Register is describ ed in the Scan Order Tab le followi ng. The Boundary Scan

Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O rin g when the controll er is in

Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,

SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.

Instruction Register

ID Code Register

Boundary Scan Register

012

····

31 30 29 12

Bypass Register

TDI TDO

TMS

TCK Te st Access Port (TAP) Controller

108

·· ······

Control Signals

JTAG TAP Block Diagram

Identification (ID) Register

The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controll er is put in

Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.

It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the

controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.

ID Register Contents

See BSDL Model GSI Technology

JEDEC Vendor

ID Code

Presence Register

Bit # 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

X X X X X X X X X X X X X X X X X X X X 0 0 0 1 1 0 1 1 0 0 1 1

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Tap Controller Instruction Set

Overview

There are two classes of instructions defined in the Standard 114 9.1-1990; the standard (Public) inst ructions, and device specific

(Private) instructions. Some Public instructions are man datory for 1149.1 compliance. Optional Public inst ructions must be

implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load

address, data or control signals into the RAM or to preload the I/O buffers.

When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.

When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired

instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the

TAP executes newly loaded instructions only when the controller is moved to Update-IR st ate. The TAP instruction set for this

device is listed in the following table.

Select DR

Capture DR

Shift DR

Exit1 DR

Pause DR

Exit2 DR

Update DR

Select IR

Capture IR

Shift IR

Exit1 IR

Pause IR

Exit2 IR

Update IR

Test Logic Reset

Run Test Idle 0

0 0

110

111

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

JTAG Tap Controller State Diagram

Instruction Descriptions

BYPASS

When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This

occurs when the TAP controller is moved to the Shift- DR state. Thi s allows the board level scan path to be shortened to facili-

tate testing of other devices in the scan path.

SAMPLE/PRELOAD

SAMPLE/PRELOAD is a Standard 1149.1 mandatory public in struction. When the SAMPLE / PRELOAD instruction is

loaded in the Instruction Register, moving the TAP contro ller into th e Capture-DR state lo ads the data in the RAMs inp ut and

I/O buffers into the Boundary Scan Register . Boundary Scan Register locations are not associated with an input or I/O pin, and

are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because

the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents

while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will

not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the

TAPs input data capture set-up plus hold tim e (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP

operation except capturing the I/O ring contents into the Boundary Scan Register . Moving the controller to Shift-DR state then

places the boundary scan register between the TDI and TDO pins.

EXTEST

EXTEST is an IEEE 1149.1 mandatory public in str ucti on. It is to be executed whenever the instruction register is loaded with

all logic 0s. The EXTEST command does not block or override th e RAM’s input pins; therefore, the RAM’s internal state is

still determined by its input pins.

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.

Then the EXTEST command is used to output the Bou ndary Scan Register’s contents, in parallel, on the RAM’s data output

drivers on the falling edge of TCK when the controller is in the Update-IR state.

Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruc-

tion is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not asso-

ciated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR

state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associ-

ated.

IDCODE

The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and

places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction

loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.

SAMPLE-Z

If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (high-

Z) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR

state.

JTAG TAP Instruction Set Summary

Instruction Code Description Notes

EXTEST 000 Places the Boundary Scan Register between TDI and TDO. 1

IDCODE 001 Preloads ID Register and places it between TDI and TDO. 1, 2

SAMPLE-Z 010 Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO.

Forces all RAM output drivers to High-Z. 1

GSI 011 GSI private instruction. 1

SAMPLE/PRELOAD 100 Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. 1

GSI 101 GSI private instruction. 1

GSI 110 GSI private instruction. 1

BYPASS 111 Places Bypass Register between TDI and TDO. 1

Notes:

1. Instruction codes expressed in binary, MSB on left, LSB on right.

2. Default instruction automatically loaded at power-up and in test-logic-reset state.

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

JTAG Port Recommended Operating Conditions and DC Characteristics

Parameter Symbol Min. Max. Unit Notes

Test Port Input Low Voltage VILJ –0.3 0.3 * VDD V 1

Test Port Input High Voltage VIHJ 0.7 * VDD VDD +0.3 V 1

TMS, TCK and TDI Input Leakage Current IINHJ –300 1uA 2

TMS, TCK and TDI Input Leakage Current IINLJ –1100 uA 3

TDO Output Leakage Current IOLJ –1 1 uA 4

Test Port Output High Voltage VOHJ VDD – 0.2 —V5, 6

Test Port Output Low Voltage VOLJ —0.2 V5, 7

Test Port Output CMOS High VOHJC VDD – 0.1 —V5, 8

Test Port Output CMOS Low VOLJC —0.1 V5, 9

Notes:

1. Input Under/overshoot voltage must be –1 V < Vi < VDDn +1 V not to exceed 2.9 V maximum, with a pulse width not to exceed 20% tTKC.

2. VILJ ≤ VIN ≤ VDDn

3. 0 V ≤ VIN ≤ VILJn

4. Output Disable, VOUT = 0 to VDDn

5. The TDO output driver is served by the VDD supply.

6. IOHJ = –2 mA

7. IOLJ = + 2 mA

8. IOHJC = –100 uA

9. IOLJC = +100 uA

Notes:

1. Include scope and jig capacitance.

2. Test conditions as shown unless otherwise noted.

JTAG Port AC Test Conditions

Parameter Conditions

Input high level VDD – 0.2 V

Input low level 0.2 V

Input slew rate 1 V/ns

Input reference level VDD/2

Output reference level VDD/2

TDO

VDD/2

50Ω30pF*

JTAG Port AC Test Load

* Distributed Test Jig Capacitance

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

JTAG Port Timing Diagram

tTH

tTS

tTKQ

tTH

tTS

tTH

tTS

tTKLtTKLtTKHtTKHtTKCtTKC

TCK

TDI

TMS

TDO

Parallel SRAM input

JTAG Port AC Electrical Characteristics

Parameter Symbol Min Max Unit

TCK Cycle Time tTKC 50 —ns

TCK Low to TDO Valid tTKQ —20 ns

TCK High Pulse Width tTKH 20 —ns

TCK Low Pulse Width tTKL 20 —ns

TDI & TMS Set Up Time tTS 10 —ns

TDI & TMS Hold Time tTH 10 —ns

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Package Dimensions—165-Bump FPBGA (Package E)

1 2 3 4 5 6 7 8 9 10 11 11 10 9 8 7 6 5 4 3 2 1

A1 CORNER TOP VIEW A1 CORNER

BOTTOM VIEW

1.0 1.0

10.0

1.01.0

14.0

15±0.05

17±0.05

0.20(4x)

Ø0.10

Ø0.25 C

C A B

Ø0.40~0.60 (165x)

CSEATING PLANE

0.15 C

0.36~0.46

1.50 MAX.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Ordering Information—GSI SigmaQuad-II SRAM

Org Part Number1 Type Package Speed

(MHz) TJ2

16M x 8 GS81302D08E-375 SigmaQuad-II SRAM 165-bump BGA 375 C

16M x 8 GS81302D08E-350 SigmaQuad-II SRAM 165-bump BGA 350 C

16M x 8 GS81302D08E-333 SigmaQuad-II SRAM 165-bump BGA 333 C

16M x 8 GS81302D08E-300 SigmaQuad-II SRAM 165-bump BGA 300 C

16M x 8 GS81302D08E-250 SigmaQuad-II SRAM 165-bump BGA 250 C

16M x 8 GS81302D08E-375I SigmaQuad-II SRAM 165-bump BGA 375 I

16M x 8 GS81302D08E-350I SigmaQuad-II SRAM 165-bump BGA 350 I

16M x 8 GS81302D08E-333I SigmaQuad-II SRAM 165-bump BGA 333 I

16M x 8 GS81302D08E-300I SigmaQuad-II SRAM 165-bump BGA 300 I

16M x 8 GS81302D08E-250I SigmaQuad-II SRAM 165-bump BGA 250 I

16M x 9 GS81302D09E-375 SigmaQuad-II SRAM 165-bump BGA 375 C

16M x 9 GS81302D09E-350 SigmaQuad-II SRAM 165-bump BGA 350 C

16M x 9 GS81302D09E-333 SigmaQuad-II SRAM 165-bump BGA 333 C

16M x 9 GS81302D09E-300 SigmaQuad-II SRAM 165-bump BGA 300 C

16M x 9 GS81302D09E-250 SigmaQuad-II SRAM 165-bump BGA 250 C

16M x 9 GS81302D09E-375I SigmaQuad-II SRAM 165-bump BGA 375 I

16M x 9 GS81302D09E-350I SigmaQuad-II SRAM 165-bump BGA 350 I

16M x 9 GS81302D09E-333I SigmaQuad-II SRAM 165-bump BGA 333 I

16M x 9 GS81302D09E-300I SigmaQuad-II SRAM 165-bump BGA 300 I

16M x 9 GS81302D09E-250I SigmaQuad-II SRAM 165-bump BGA 250 I

8M x 18 GS81302D18E-375 SigmaQuad-II SRAM 165-bump BGA 375 C

8M x 18 GS81302D18E-350 SigmaQuad-II SRAM 165-bump BGA 350 C

8M x 18 GS81302D18E-333 SigmaQuad-II SRAM 165-bump BGA 333 C

8M x 18 GS81302D18E-300 SigmaQuad-II SRAM 165-bump BGA 300 C

8M x 18 GS81302D18E-250 SigmaQuad-II SRAM 165-bump BGA 250 C

8M x 18 GS81302D18E-375I SigmaQuad-II SRAM 165-bump BGA 375 I

8M x 18 GS81302D18E-350I SigmaQuad-II SRAM 165-bump BGA 350 I

8M x 18 GS81302D18E-333I SigmaQuad-II SRAM 165-bump BGA 333 I

8M x 18 GS81302D18E-300I SigmaQuad-II SRAM 165-bump BGA 300 I

8M x 18 GS81302D18E-250I SigmaQuad-II SRAM 165-bump BGA 250 I

4M x 36 GS81302D36E-375 SigmaQuad-II SRAM 165-bump BGA 375 C

Notes:

1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS81302D36E-300T.

2. C = Commercial Temperature Range. I = Industrial Temperature Range.

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

4M x 36 GS81302D36E-350 SigmaQuad-II SRAM 165-bump BGA 350 C

4M x 36 GS81302D36E-333 SigmaQuad-II SRAM 165-bump BGA 333 C

4M x 36 GS81302D36E-300 SigmaQuad-II SRAM 165-bump BGA 300 C

4M x 36 GS81302D36E-250 SigmaQuad-II SRAM 165-bump BGA 250 C

4M x 36 GS81302D36E-375I SigmaQuad-II SRAM 165-bump BGA 375 I

4M x 36 GS81302D36E-350I SigmaQuad-II SRAM 165-bump BGA 350 I

4M x 36 GS81302D36E-333I SigmaQuad-II SRAM 165-bump BGA 333 I

4M x 36 GS81302D36E-300I SigmaQuad-II SRAM 165-bump BGA 300 I

4M x 36 GS81302D36E-250I SigmaQuad-II SRAM 165-bump BGA 250 I

16M x 8 GS81302D08GE-375 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 375 C

16M x 8 GS81302D08GE-350 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 350 C

16M x 8 GS81302D08GE-333 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 333 C

16M x 8 GS81302D08GE-300 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 300 C

16M x 8 GS81302D08GE-250 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 250 C

16M x 8 GS81302D08GE-375I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 375 I

16M x 8 GS81302D08GE-350I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 350 I

16M x 8 GS81302D08GE-333I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 333 I

16M x 8 GS81302D08GE-300I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 300 I

16M x 8 GS81302D08GE-250I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 250 I

16M x 9 GS81302D09GE-375 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 375 C

16M x 9 GS81302D09GE-350 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 350 C

16M x 9 GS81302D09GE-333 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 333 C

16M x 9 GS81302D09GE-300 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 300 C

16M x 9 GS81302D09GE-250 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 250 C

16M x 9 GS81302D09GE-375I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 375 I

16M x 9 GS81302D09GE-350I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 350 I

16M x 9 GS81302D09GE-333I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 333 I

16M x 9 GS81302D09GE-300I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 300 I

16M x 9 GS81302D09GE-250I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 250 I

8M x 18 GS81302D18GE-375 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 375 C

8M x 18 GS81302D18GE-350 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 350 C

8M x 18 GS81302D18GE-333 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 333 C

Ordering Information—GSI SigmaQuad-II SRAM

Org Part Number1 Type Package Speed

(MHz) TJ2

Notes:

1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS81302D36E-300T.

2. C = Commercial Temperature Range. I = Industrial Temperature Range.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

8M x 18 GS81302D18GE-300 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 300 C

8M x 18 GS81302D18GE-250 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 250 C

8M x 18 GS81302D18GE-375I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 375 I

8M x 18 GS81302D18GE-350I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 350 I

8M x 18 GS81302D18GE-333I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 333 I

8M x 18 GS81302D18GE-300I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 300 I

8M x 18 GS81302D18GE-250I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 250 I

4M x 36 GS81302D36GE-375 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 375 C

4M x 36 GS81302D36GE-350 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 350 C

4M x 36 GS81302D36GE-333 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 333 C

4M x 36 GS81302D36GE-300 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 300 C

4M x 36 GS81302D36GE-250 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 250 C

4M x 36 GS81302D36GE-375I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 375 I

4M x 36 GS81302D36GE-350I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 350 I

4M x 36 GS81302D36GE-333I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 333 I

4M x 36 GS81302D36GE-300I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 300 I

4M x 36 GS81302D36GE-250I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 250 I

SigmaQuad-II Revision History

File Name Format/Content Description of changes

81302Dxx_r1 Creation of datasheet

Ordering Information—GSI SigmaQuad-II SRAM

Org Part Number1 Type Package Speed

(MHz) TJ2

Notes:

1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS81302D36E-300T.

2. C = Commercial Temperature Range. I = Industrial Temperature Range.

GS81302D08/09/18/36E-375/350/333/300/250

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

81302Dxx_r1.00a Editorial Corrected Ordering Information Table

81302Dxx_r1.01 Content Updated AC Characteristics Table

Updated 165 BGA Package Drawing

Updated JTAG Port Operation Section

81302Dxx_r1.02 Content Added 300 MHz speed bin to Q

(Rev1.02a: removed CQ reference from SAMPLE-Z section in

JTAG Tap Instruction Set Summary)

(Rev1.02b: Updated DLL Lock time to 2048 cycles)

81302Dxx_r1.03 Content Added 350 & 375 MHz speed bins

Removed 200 & 167 speed bins

(Rev1.03a: fixed erroneous data in AC Char table)

81302Dxx_r1.04 Content Added Op Currents

Removed Preliminary banner due to MP status

(Rev1.04a: Editorial updates)

(Rev.104b: Updated DLL lock time in AC Char table)

SigmaQuad-II Revision History

File Name Format/Content Description of changes