Board Level Heat Sinks P/N: 833702T00000 TO-220 PRODUCT SPECIFICATIONS * No Hardware Device Attachment * Constant Spring Force Tension * RoHS Compliant CUSTOMIZED HEATSINKS * Specialized Tabs, Plating * Specialized Body Configurations * Contact Applications Engineering 0 200 400 600 800 1000 100 10 80 8 60 6 40 4 20 2 0 0 0 1 2 3 Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 4 5 Thermal Resistance - oC/ Watt (Mounting Surface to Ambient) FEATURES & BENEFITS Air Velocity - LFM Temp Rise Above Ambient -oC (Mounting Surface) * Devices: TO-220 * Size: 9.5 x 22.0 x 28.0mmm * Material: Copper, 0.6mm thick * Type: Stamped * Finish: Tin Plate * PCB Mounting: Solderable Tabs * IC Mounting: Integrated Spring * Package: Bulk