FEATURES
* Planar Die Constrruction
*200mW Power Dissipation on FR-4 PCB
*Gemera purpose, Medium Current
*
MECHANICAL DATA
* Case: Molded plastic
* Epoxy: UL 94V-O rate flame retardant
* Lead: MIL-STD-202E method 208C guaranteed
* Mounting position: Any
* Weight: 0.004 gram
MMSZ5223BS-
MMSZ5259BS
Ldeally Suited for Automated Assembly
Dimensions in inches and (millimeters)
VC 2008-12
REV: A
ELECTRICAL CHARACTERISTICS (@ TA = 25oC unless otherwise noted )
MAXIMUM RATINGES (@ TA = 25oC unless otherwise noted )
Max. Instantaneous Forward Voltage at IF= 10mA
CHARACTERISTICS SYMBOL UNITS
625
0.9
Volts
oC/WThermal Resistance Junction to Ambient (Note 1)
RATINGS
Max. Steady State Power Dissipation @TA=25oC (Note 1)
Max. Operating Temperature Range
Storage Temperature Range
SYMBOL
PD
TJ
TSTG
R qJA
VF
VALUE
MAX.
-
-
TYP.
-
-
MIN.
UNITS
mW200
Notes 1. Valld provided that device terminals are kept at amblent temperature.
2. "Fully RoHS Compliant", "100% Sn plating (Pb-free)".
+150
-65 to +150
oC
oC
SURFACE MOUNT ZENER DIODE
VOLTAGE RANGE 2.7 to 39 Volts POWER RATING 200 mWatts
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 oC ambient temperature unless otherwise specified. REF .019(0.46)
.014(.35)
.010(.25)
.106(2.70)
.098(2.50)
.055(1.40)
.047(1.20)
.071(1.80)
.063(1.60)
.006(.15)
.003(.08)
MAX.039(1.00)
.004(.10)
.000(.00)
SOD-323