MSMCG5.0A - MXLSMCG170CAe3, MSMCJ5.0 - MXLSMCJ170CAe3 Available Surface Mount 1500 Watt Transient Voltage Suppressor Screening in reference to MIL-PRF-19500 available DESCRIPTION The MSMCG(J)5.0A through MXLSMCG(J)170A series of 1500 watt high-reliability Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive components. The SMCG gullwing design in the DO-215AB package allows for visible solder connections. The SMCJ J-bend design in the DO-214AB package allows for greater PC board mounting density. Selections include unidirectional and bidirectional as well as RoHS compliant versions. These are available with a variety of upscreening options for enhanced reliability. They can protect against the secondary effects of lightning per IEC61000-4-5 and against voltage pulses from inductive switching environments and induced by RF radiation. Since their response time is virtually instantaneous, they can also be used in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4. DO-215AB (SMCG) Package Important: For the latest information, visit our website http://www.microsemi.com. FEATURES * * * * * * * * High reliability devices with fabrication and assembly lot traceability. All devices are 100% surge tested. 3 lot norm screening performed on standby current (ID). Available in both unidirectional and bidirectional versions. Moisture classification is "Level 1" with no dry pack required per IPC/JEDEC J-STD-020B. Enhanced reliability screening options are available in reference to MIL-PRF-19500. Refer to High Reliability Up-Screened Plastic Products Portfolio for more details on the screening options. (See part nomenclature for all available options). RoHS compliant versions available. Axial-lead equivalent packages for thru-hole mounting are available as 1.5KE6.8A to 1.5KE200CA or 1N6267 thru 1N6303A and 1N5908 (contact Microsemi for other surface mount options). DO-214AB (SMCJ) Package NOTE: All SMC series are equivalent to prior SMM package identifications. Also available: Commercial grade SMCG(J)5.0A - SMCG(J)170CAe3 APPLICATIONS / BENEFITS * * * * * * * High-reliability devices. Selections for 5.0 to 170 volts standoff voltages (VWM). Protection from switching transients and induced RF. Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4. Secondary lightning protection per IEC61000-4-5 with 42 ohms source impedance: Class 1: MSMC 5.0A to MXLSMC 170A or CA Class 2: MSMC 5.0A to MXLSMC 150A or CA Class 3: MSMC 5.0A to MXLSMC 75A or CA Class 4: MSMC 5.0A to MXLSMC 36A or CA Secondary lightning protection per IEC61000-4-5 with 12 ohms source impedance: Class 1: MSMC 5.0A to MXLSMC 90A or CA Class 2: MSMC 5.0A to MXLSMC 45A or CA Class 3: MSMC 5.0A to MXLSMC 24A or CA Class 4: MSMC 5.0A to MXLSMC 11A or CA Secondary lightning protection per IEC61000-4-5 with 2 ohms source impedance: Class 2: MSMC 5.0A to MXLSMC 22A or CA Class 3: MSMC 5.0A to MXLSMC 10A or CA RF01001, Rev. B (22/2/18) (c)2018 Microsemi Corporation MSC - Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC - Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com Page 1 of 7 MSMCG5.0A - MXLSMCG170CAe3, MSMCJ5.0 - MXLSMCJ170CAe3 MAXIMUM RATINGS Parameters/Test Conditions Junction and Storage Temperature Thermal Resistance Junction-to-Lead Thermal Resistance Junction-to-Ambient (1) Peak Pulse Power Dissipation @ 25 C (at 10/1000 s, see Figures 1, 2, and 3) Impulse Repetition Rate (duty factor) tclamping (0 volts to V(BR) min.) Unidirectional Bidirectional Rated Average Power Dissipation TL = +30 C TA = +25 C (2) Maximum Forward Surge Current Solder Temperature @ 10 s Symbol TJ and TSTG RJL RJA PPP Value -65 to +150 20 80 1500 Unit C C/W C/W W df 0.01 <100 <5 6 1.56(1) 200 260 % ps ns W tclamping PM(AV) IFSM TSP A (pk) oC Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see last page). 2. Peak impulse of 8.3 ms half-sine wave at 25 C (unidirectional only). MECHANICAL and PACKAGING * * * * * * * CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0. TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating. Solderable to MIL-STD-750, method 2026. MARKING: Part number marked on package. POLARITY: Cathode indicated by band. No cathode band on bi-directional devices. TAPE & REEL option: Standard per EIA-481-2 with 16 mm tape (add "TR" suffix to part number). Consult factory for quantities. WEIGHT: Approximately 0.25 grams. See Package Dimensions on last page. PART NOMENCLATURE MX SM C G 5.0 C A Reliability Level* M MA MX MXL *(see High Reliability Up-Screened Plastic Products Portfolio) e3 RoHS Compliance e3 = RoHS Compliant Blank = non-RoHS Compliant +/- 5% Tolerance Level Uni/Bidirectional C = Bidirectional Blank = Unidirectional Surface Mount Package Reverse Stand-Off Voltage (see Electrical Characteristics table) 1500 W Power Level Gull-wing Lead Frame G = Gull-Wing J = J-Bend RF01001, Rev. B (22/2/18) (c)2018 Microsemi Corporation Page 2 of 7 MSMCG5.0A - MXLSMCG170CAe3, MSMCJ5.0 - MXLSMCJ170CAe3 SYMBOLS & DEFINITIONS Definition Symbol I(BR) ID IF IO IPP PPP VC V(BR) VWM Breakdown Current: The current used for measuring breakdown voltage V(BR). Standby Current: The current at the rated standoff voltage (VWM). Forward Current: The forward current dc value, no alternating component. Average Rectified Output Current: The output current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave input and a 180-degree conduction angle. Peak Impulse Current: The peak current during the impulse. Peak Pulse Power: The peak power dissipation resulting from the peak impulse current IPP. Clamping Voltage: Maximum clamping voltage at specified IPP (Peak Pulse Current) at the specified pulse conditions. Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. Working Peak Voltage: The maximum peak voltage that can be applied over the operating temperature range. This is also referred to as standoff voltage. ELECTRICAL CHARACTERISTICS @ 25 C unless otherwise stated MICROSEMI PART NUMBER Gull-Wing MSMCG5.0A MSMCG6.0A MSMCG6.5A MSMCG7.0A MSMCG7.5A MSMCG8.0A MSMCG8.5A MSMCG9.0A MSMCG10A MSMCG11A MSMCG12A MSMCG13A MSMCG14A MSMCG15A MSMCG16A MSMCG17A MSMCG18A MSMCG20A MSMCG22A MSMCG24A MSMCG26A MSMCG28A MSMCG30A MSMCG33A MSMCG36A MSMCG40A MSMCG43A MSMCG45A MSMCG48A MSMCG51A MSMCG54A MSMCG58A MSMCG60A MSMCG64A MSMCG70A MSMCG75A J-Bend MSMCJ5.0A MSMCJ6.0A MSMCJ6.5A MSMCJ7.0A MSMCJ7.5A MSMCJ8.0A MSMCJ8.5A MSMCJ9.0A MSMCJ10A MSMCJ11A MSMCJ12A MSMCJ13A MSMCJ14A MSMCJ15A MSMCJ16A MSMCJ17A MSMCJ18A MSMCJ20A MSMCJ22A MSMCJ24A MSMCJ26A MSMCJ28A MSMCJ30A MSMCJ33A MSMCJ36A MSMCJ40A MSMCJ43A MSMCJ45A MSMCJ48A MSMCJ51A MSMCJ54A MSMCJ58A MSMCJ60A MSMCJ64A MSMCJ70A MSMCJ75A REVERSE STAND-OFF VOLTAGE VWM Volts 5.0 6.0 6.5 7.0 7.5 8.0 8.5 9.0 10 11 12 13 14 15 16 17 18 20 22 24 26 28 30 33 36 40 43 45 48 51 54 58 60 64 70 75 BREAKDOWN VOLTAGE V(BR) @ I(BR) Volts I(BR) MIN. MAX. mA 6.40 - 7.00 10 6.67 - 7.37 10 7.22 - 7.98 10 7.78 - 8.60 10 8.33 - 9.21 1 8.89 - 9.83 1 9.44 - 10.4 1 10.0 - 11.1 1 11.1 - 12.3 1 12.2 - 13.5 1 13.3 - 14.7 1 14.4 - 15.9 1 15.6 - 17.2 1 16.7 - 18.5 1 17.8 - 19.7 1 18.9 - 20.9 1 20.0 - 22.1 1 22.2 - 24.5 1 24.4 - 26.9 1 26.7 - 29.5 1 28.9 - 31.9 1 31.1 - 34.4 1 33.3 - 36.8 1 36.7 - 40.6 1 40.0 - 44.2 1 44.4 - 49.1 1 47.8 - 52.8 1 50.0 - 55.3 1 53.3 - 58.9 1 56.7 - 62.7 1 60.0 - 66.3 1 64.4 - 71.2 1 66.7 - 73.7 1 71.1 - 78.6 1 77.8 - 86.0 1 83.3 - 92.1 1 MAXIMUM CLAMPING VOLTAGE @ IPP PEAK PULSE CURRENT (See Fig. 2) IPP Volts 9.2 10.3 11.2 12.0 12.9 13.6 14.4 15.4 17.0 18.2 19.9 21.5 23.2 24.4 26.0 27.6 29.2 32.4 35.5 38.9 42.1 45.4 48.4 53.3 58.1 64.5 69.4 72.7 77.4 82.4 87.1 93.6 96.8 103.0 113 121 Amps 163.0 145.6 133.9 125.0 116.3 110.3 104.2 97.4 88.2 82.4 75.3 69.7 64.7 61.5 57.7 53.3 51.4 46.3 42.2 38.6 35.6 33.0 31.0 28.1 25.8 23.2 21.6 20.6 19.4 18.2 17.2 16.0 15.5 14.6 13.3 12.4 MAXIMUM STANDBY CURRENT @ VWM ID A 1000 1000 500 200 100 50 20 10 5 5 5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Continued. RF01001, Rev. B (22/2/18) (c)2018 Microsemi Corporation Page 3 of 7 MSMCG5.0A - MXLSMCG170CAe3, MSMCJ5.0 - MXLSMCJ170CAe3 ELECTRICAL CHARACTERISTICS @ 25 C unless otherwise stated (continued) MICROSEMI PART NUMBER Gull-Wing MSMCG78A MSMCG85A MSMCG90A MSMCG100A MSMCG110A MSMCG120A MSMCG130A MSMCG150A MSMCG160A MSMCG170A J-Bend MSMCJ78A MSMCJ85A MSMCJ90A MSMCJ100A MSMCJ110A MSMCJ120A MSMCJ130A MSMCJ150A MSMCJ160A MSMCJ170A RF01001, Rev. B (22/2/18) REVERSE STAND-OFF VOLTAGE VWM Volts 78 85 90 100 110 120 130 150 160 170 BREAKDOWN VOLTAGE V(BR) @ I(BR) Volts I(BR) MIN. MAX. mA 86.7 - 95.8 1 94.4 - 104.0 1 100 - 111 1 111 - 123 1 122 - 135 1 133 - 147 1 144 - 159 1 167 - 185 1 178 - 197 1 189 - 209 1 MAXIMUM CLAMPING VOLTAGE @ IPP PEAK PULSE CURRENT (See Fig. 2) IPP Volts 126 137 146 162 177 193 209 243 259 275 Amps 11.4 10.4 10.3 9.3 8.4 7.8 7.2 6.2 5.8 5.5 (c)2018 Microsemi Corporation MAXIMUM STANDBY CURRENT @ VWM ID A 1 1 1 1 1 1 1 1 1 1 Page 4 of 7 MSMCG5.0A - MXLSMCG170CAe3, MSMCJ5.0 - MXLSMCJ170CAe3 GRAPHS IPP - Peak Pulse Current - % IPP (PPP) - Peak Pulse Power - kW 100 10 1.0 0 0 1s 10sec 100sec tp - Pulse Time - sec 1ms 10ms Test wave form parameters tr = 10 sec. tp = 1000 sec. t - Time (msec) FIGURE 2 - Pulse Waveform C - Capacitance (pF) Peak Pulse Power (PPP) or continuous Power in Percent of 25 oC Rating FIGURE 1 - Peak Pulse Power vs. Pulse Time BV - Breakdown Voltage (V) TL Lead Temperature oC FIGURE 3 - Derating Curve FIGURE 4 Typical Capacitance vs. Breakdown Voltage (unidirectional configuration) NOTE: Bidirectional capacitance is half that shown at zero volts. RF01001, Rev. B (22/2/18) (c)2018 Microsemi Corporation Page 5 of 7 MSMCG5.0A - MXLSMCG170CAe3, MSMCJ5.0 - MXLSMCJ170CAe3 PACKAGE DIMENSIONS SMCG (DO-215AB) Ltr A B C E F K Dimensions Inch Millimeters Min Max Min Max .115 .121 2.92 3.07 .260 .280 6.60 7.11 .220 .245 5.59 6.22 .077 .110 1.95 2.80 .380 .400 9.65 10.16 .025 .040 0.635 1.016 NOTES: Dimension "E" exceeds the JEDEC outline as shown. Typical Standoff Height: 0.004" - 0.008" (0.1 mm - 0.2 mm). SMCJ (DO-214AB) Ltr A B C D E L Dimensions Inch Millimeters Min Max Min Max .115 .121 2.92 3.07 .260 .280 6.60 7.11 .220 .245 5.59 6.22 .305 .320 7.75 8.13 .077 .110 1.95 2.80 .030 .060 .760 1.52 NOTES: Dimension "E" exceeds the JEDEC outline in height as shown. Typical Standoff Height: 0.004" - 0.008" (0.1 mm - 0.2 mm). RF01001, Rev. B (22/2/18) (c)2018 Microsemi Corporation Page 6 of 7 MSMCG5.0A - MXLSMCG170CAe3, MSMCJ5.0 - MXLSMCJ170CAe3 PAD LAYOUT RF01001, Rev. B (22/2/18) Ltr A B C SMCG (DO-215AB) Inch Millimeters .510 12.95 .110 2.79 .150 3.81 Ltr A B C SMCJ (DO-214AB) Inch Millimeters .390 9.90 .110 2.79 .150 3.81 (c)2018 Microsemi Corporation Page 7 of 7