Technical Data 4325 Effective January 2016
Supersedes May 2008
FP0705
High frequency, high current power inductors
Product description
High current carrying capacity
Low core loss
Inductance Range from 72 nH to 220 nH
Current range from 20 A to 65 A
7.0 mm x 7.0 mm footprint surface mount
package in a 4.95 mm height
Ferrite core material
Halogen free, lead free, RoHS compliant
Applications
Multi-phase and Vcore regulators
Voltage Regulator Modules (VRMs)
Server and desktop
Central processing unit (CPU)
Graphics processing unit (GPU)
Application specific integrated circuit (ASIC)
High power density
Data networking and storage systems
Graphics cards and battery power systems
Portable electronics
Point-of-Load modules
Environmental data
Storage temperature range (Component):
-40 °C to +125 °C
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
Solder reflow temperature:
J-STD-020D compliant
Pb
HALOGEN
HF
FREE
2
Technical Data 4325
Effective January 2016
FP0705
High frequency, high current power inductors
www.eaton.com/elx
Product specifications
Part Number7
OCL1
(nH) ±10%
FLL2
(nH) minimum
Irms
3
(A)
Isat14
(A)
Isat25
(A)
DCR (mΩ)
@ 20°C K-factor7
R1 version
FP0705R1-R07-R 72 51 43 65 50 0.25 ± 10% 826
FP0705R1-R10-R 105 78 43 44 34 0.25 ± 10% 826
FP0705R1-R12-R 120 86 43 37 30 0.25 ± 10% 826
FP0705R1-R15-R 150 108 43 30 24 0.25 ± 10% 826
FP0705R1-R18-R 180 130 43 25 20 0.25 ± 10% 826
FP0705R1-R22-R 226 159 43 20 16 0.25 ± 10% 826
R2 version
FP0705R2-R07-R 72 51 38 65 50 0.32 ± 9.4% 826
FP0705R2-R10-R 105 78 38 44 34 0.32 ± 9.4% 826
FP0705R2-R12-R 120 86 38 37 30 0.32 ± 9.4% 826
FP0705R2-R15-R 150 108 38 30 24 0.32 ± 9.4% 826
FP0705R2-R18-R 180 130 38 25 20 0.32 ± 9.4% 826
FP0705R2-R22-R 226 159 38 20 16 0.32 ± 9.4% 826
R2 version
FP0705R3-R07-R 72 51 32 65 50 0.46 ± 6.5% 826
FP0705R3-R10-R 105 78 32 44 34 0.46 ± 6.5% 826
FP0705R3-R12-R 120 86 32 37 30 0.46 ± 6.5% 826
FP0705R3-R15-R 150 108 32 30 24 0.46 ± 6.5% 826
FP0705R3-R18-R 180 130 32 25 20 0.46 ± 6.5% 826
FP0705R3-R22-R 226 159 32 20 16 0.46 ± 6.5% 826
1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C
2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, Isat1, +25 °C
3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary
for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generat-
ing components will affect the temperature rise. It is recommended that the temperature of the part
not exceed 125 °C under worst case operating conditions verified in the end application.
4. Isat1: Peak current for approximately 20% rolloff @ +25 °C
5. Isat2: Peak current for approximately 20% rolloff @ +125 °C
6. K-factor: Used to determine Bp-p for core loss (see graph).
Bp-p = K * L * I * 10-3. Bp-p:(Gauss), K: (K-factor from table),
L: (Inductance in nH), I (Peak to peak ripple current in Amps).
7. Part Number Definition: FP0705Rx-Rxx-R
FP0705= Product code and size
Rx= Version indicator
-Rxx= Inductance value in μH, R= decimal point
-R suffix = RoHS compliant
Dimensions (mm)
Part marking: 0705Rx (Rx = version indicator), Rxx = Inductance value in uH, R = decimal point,
wwllyy = date code, R = revision level
Tolerances are ±0.25 millimeters unless stated otherwise
PCB tolerances are ±0.1 millimeters unless stated otherwise
All soldering surface to be coplanar within 0.1016 millimeters
DCR measured between point “a” and point “b”
Do not route traces or vias underneath the inductor
3
Technical Data 4325
Effective January 2016
FP0705
High frequency, high current power inductors
www.eaton.com/elx
Packaging information (mm)
Temperature rise vs. total loss
Supplied in tape and reel packaging , 950 parts per 13” diameter reel
SECTION A-A
A
A
5.1
7.1
1
2
SECTION B-B
B B
6.57.1
3.
5
0705Rx
Rxx
wwllyyR
16.00
±0.30
1.5
dia.
12.0
1.5
dia
7.5
1.75
2.0
4.0
User direction of feed
4
Technical Data 4325
Effective January 2016
FP0705
High frequency, high current power inductors
www.eaton.com/elx
Core loss vs. Bp-p
Inductance characteristics
0%
20%
40%
60%
80%
100%
%
021%001%08%04%02%0
%ofOCL
+125 °C
+25 °C
-40 °C
60%
% of I
sat
1
OCL vs.I
sat
1
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2016 Eaton
All Rights Reserved
Printed in USA
Publication No. 4325 BU-SB08210
January 2016
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Technical Data 4325
Effective January 2016
FP0705
High frequency, high current power inductors
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25
°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = C/s
Max. Ramp Down Rate = C/s
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350
<2.5mm) 235°C 220°C
2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Eaton:
FP0705R3-R12-R FP0705R2-R12-R FP0705R3-R15-R FP0705R3-R18-R FP0705R2-R15-R FP0705R1-R18-R
FP0705R2-R18-R FP0705R2-R22-R FP0705R3-R22-R FP0705R1-R22-R FP0705R1-R12-R FP0705R2-R10-R
FP0705R3-R07-R FP0705R1-R15-R FP0705R2-R07-R FP0705R1-R10-R FP0705R3-R10-R FP0705R1-R07-R