DATA SH EET
Preliminary specification
File under Integrated Circuits, IC02 1995 Mar 22
INTEGRATED CIRCUITS
Philips Semiconductors
TDA5732M
Low power VHF, UHF
mixer/oscillator for TV and VCR
2-band tuners
1995 Mar 22 2
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
FEATURES
Balanced mixer with a common emitter input for band A
2-pin oscillator for band A
Balanced mixer with a common base input for band C
4-pin oscillator for band C
Local oscillator buffer output for external prescaler
SAW filter preamplifier with a low output impedance of
75
Band gap voltage stabilizer for oscillator stability
Electronic band switch
External IF filter connected between the mixer output
and the IF amplifier input.
APPLICATIONS
2-band TV tuners
2-band VCR tuners.
DESCRIPTION
The TDA5732M is a monolithic integrated circuit that
performs VHF I, VHF III, hyperband and UHF
mixer/oscillator functions in TV and VCR tuners. This
low-power mixer/oscillator requires a power supply of 5 V
and is available in a very small package.
The device gives the designer the capability to design an
economical and physically small 2-band tuner.
The tuner development time can be drastically reduced by
using this device.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VPsupply voltage 5.0 V
IPsupply current 50 mA
fRfrequency range band A 55.25 361.25 MHz
band C 367.25 801.25 MHz
N noise figure band A 9.5 dB
band C 10 dB
VoIF output voltage band A; RL=75;
1% cross modulation 108 dBµV
band C; RL=75;
1% cross modulation 108 dBm
Gvvoltage gain band A; RL=75Ω− 19 dB
band C; RL=75Ω− 29 dB
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA5732M SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1
1995 Mar 22 3
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MBE391
BAND C
OSCILLATOR
4 5 6 7
BAND A
OSCILLATOR
1 3 2
GND
band A oscillator
tuned circuit band C oscillator
tuned circuit
MIXER MIXER
BAND A
STAGE BAND C
STAGE LOCAL
OSCILLATOR
AMPLIFIER
ELECTRONIC
BAND SWITCH
8
band switch
input
DC
STABILIZER
IF
AMPLIFIER
10
IF outputIF ground
15 14 13 12 1118 17 16
RFGND
band C input
20 19
band A input local oscillator
amplifier outputs VPIF inputs
TDA5732M
1995 Mar 22 4
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
PINNING
SYMBOL PIN DESCRIPTION
AOSCIB 1 band A oscillator input base
GND 2 ground (0 V)
AOSCOC 3 band A oscillator output collector
COSCIB1 4 band C oscillator input base 1
COSCOC1 5 band C oscillator output collector 1
COSCOC2 6 band C oscillator output collector 2
COSCIB2 7 band C oscillator input base 2
BS 8 electronic band switch input
IFGND 9 ground for IF inputs
IFOUT 10 IF amplifier output
IFIN1 11 IF amplifier input 1
IFIN2 12 IF amplifier input 2
VP13 supply voltage
LOOUT1 14 local oscillator amplifier output 1
LOOUT2 15 local oscillator amplifier output 2
RFGND 16 ground for RF inputs
CIN1 17 band C input 1
CIN2 18 band C input 2
AIN1 19 band A input 1
AIN2 20 band A input 2 Fig.2 Pin configuration.
handbook, halfpage
TDA5732M
MBE390
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
BS V
IFOUT IFIN1
IFGND IFIN2
COSCIB2 LOOUT1
COSCOC2 LOOUT2
COSCOC1 RFGND
COSCIB1 CIN1
AOSCOC CIN2
GND AIN1
AOSCIB AIN2
P
1995 Mar 22 5
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
HANDLING
Human body model: the IC withstands 2000 V (except pins 17 and 18 which withstand 1000 V) in accordance with
UZW-BO-FQ-A302
; R = 1.5 k; C = 100 pF.
Machine model: the IC withstands 200 V in accordance with
UZW-BO-FQ-B302
; R = 0 ; C = 200 pF.
SYMBOL PARAMETER MIN. MAX. UNIT
VPsupply voltage range 0.3 +7.0 V
VP(op) operating supply voltage 4.5 5.5 V
Vn(max) maximum voltage on each pin with a 22 k resistor connected in
series 35 V
VSW switching voltage 0 7.0 V
Tstg storage temperature 55 +150 °C
Tamb operating ambient temperature 20 +85 °C
Tjjunction temperature +150 °C
SYMBOL PARAMETER VALUE UNIT
Rth j-a thermal resistance from junction to ambient in free air 120 K/W
1995 Mar 22 6
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
CHARACTERISTICS
VP=5V; T
amb =25°C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
VPsupply voltage 4.5 5.0 5.5 V
IPsupply current IP(max) measured at VP(max) 50 64 mA
VSW switching voltage band A 0 2.0 V
band C 3.0 VPV
ISW switching current band A; VSW =0V −−2µA
band C; VSW =5V 4.5 10 µA
VP(max) 6−µA
IF amplifier
S22 output reflection coefficient fi= 43.5 MHz; see Fig.12 −−13.1 dB
fi= 43.5 MHz; see Fig.12 2.9 deg
fi= 58.75 MHz; see Fig.12 −−13.1 dB
fi= 58.75 MHz; see Fig.12 2.2 deg
ZOoutput impedance fi= 43.5 MHz; see Fig.12 78.4 −Ω
f
i
= 43.5 MHz; see Fig.12 1.8 −Ω
f
i
= 58.75 MHz; see Fig.12 78.4 −Ω
f
i
= 58.75 MHz; see Fig.12 −−1.4 −Ω
SLO visibility of the LO frequency at
the IF output
(worst case in the frequency
range of band A and band C)
RL=75Ω−85 dBµV
Band A mixer (including IF amplifier)
fRfrequency range VHFl 55.25 127.25 MHz
VHFlll 133.25 361.25 MHz
NAnoise figure fi= 50 MHz; see Fig.7 8.5 9.5 dB
fi= 150 MHz; see Fig.7 8.5 10.5 dB
fi= 300 MHz; see Fig.7 9.5 12.5 dB
gos optimum source conductance fi= 50 MHz; see Fig.7 0.7 mS
fi= 150 MHz; see Fig.7 0.9 mS
fi= 300 MHz; see Fig.7 1.5 mS
YIinput admittance (GP//CP)G
P
; fi= 55.25 MHz; see Fig.9 0.25 mS
GP; fi= 361.25 MHz; see Fig.9 0.5 mS
CP; fi= 55.25 to 361.25 MHz;
see Fig.9 1.3 pF
VoA(IF) IF output voltage 1% cross modulation; in channel;
fi= 55.25 to 361.25 MHz;
RL=75; wanted frequency
sound carrier; unwanted frequency
picture carrier; see Fig.5
105 108 dBµV
1995 Mar 22 7
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
Vi(RF) RF input voltage fi= 173 MHz; note 1 91 dBµV
fi= 407 MHz; note 1 83 dBµV
Gv(A) voltage gain at the channel
centre fIF = 43.5 MHz; RL=75;
see Fig.3 16.5 19 21.5 dB
Band A oscillator
fRfrequency range VHFl 101 173 MHz
VHFlll 179 407 MHz
fshift frequency shift (worst case in
the frequency range) VP= 5%; note 2 44 100 kHz
VP= 10%; note 2 220 kHz
χripple(p-p) ripple susceptibility of the
supply voltage
(peak-to-peak value
VP= 4.75 to 5.25 V; fi= 101 MHz;
note 3 78 mV
VP= 4.75 to 5.25 V; fi= 173 MHz;
note 3 34 mV
VP= 4.75 to 5.25 V; fi= 179 MHz;
note 3 8.0 mV
VP= 4.75 to 5.25 V; fi= 407 MHz;
note 3 10 mV
fdrift frequency drift (worst case in
the frequency range) T=25°C with no compensation;
NP0 capacitors; note 4 1800 2200 kHz
5 s to 15 min after switch on; note 5 630 1100 kHz
ΦNphase noise, carrier-to-noise
sideband (worst case in the
frequency range)
±50 kHz; frequency offset;
B=3kHz 60 dBc
Band C mixer (including IF amplifier)
fRfrequency range, picture
carrier 367.25 801.25 MHz
NCnoise figure
(not corrected for image) fi= 367.25 MHz 911 dB
f
i
= 801.25 MHz 10 12 dB
ZIinput impedance (Rs+L
s
)R
s
; fi= 367.25 MHz; see Fig.10 30 −Ω
L
s
; fi= 367.25 MHz; see Fig.10 9nH
Rs; fi= 801.25 MHz; see Fig.10 38 −Ω
L
s
; fi= 801.25 MHz; see Fig.10 6nH
VoC(IF) IF output voltage 1% cross modulation; in channel;
fi= 365.25 to 801.25 MHz;
RL=75; wanted frequency
sound carrier; unwanted frequency
picture carrier; see Fig.6
105 108 dBµV
Vi(RF) RF input voltage fi= 847 MHz; note 1 66 dBµV
Gv(C) voltage gain fIF = 43.5 MHz; RL=75;
see Fig.4 26 29 32 dB
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1995 Mar 22 8
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
Notes
1. The RF signal is modulated with 50% AM at 15 kHz: The level of the RF signal is increased until there is a 23 dB
difference between the LO carrier and the sideband components.
2. The frequency shift is defined as a variation in oscillator frequency when the supply voltage varies from
VP= 5 to 4.75 V or from VP= 5 to 5.75 V.
3. The ripple susceptibility is measured for a 500 kHz ripple at the LO output with the set-up as illustrated in Fig.8. The
level of the ripple signal is increased until there is a 53.5 dB difference between the LO carrier and the sideband
components.
4. The frequency shift is defined as a variation in oscillator frequency when the supply voltage varies from
Tamb =25°Cto0°C or from Tamb =25°Cto50°C.
5. The switching on drift is defined as the variation in oscillator frequency between 5 seconds and 15 minutes after
switching on.
6. SRF: spurious signal on LO with respect to LO output signal;
a) RF voltage level=1V at f
i= 55.25 to 225 MHz.
b) RF level = 2.5 dBm at fi= 225 to 361.25 MHz.
c) RF level = 10 dBm at fi= 367.25 to 801.25 MHz.
Band C oscillator
fRfrequency range 413 847 MHz
fshift frequency shift VP= 5%; note 2 46 200 kHz
VP= 10%; note 2 200 kHz
χripple(p-p) ripple susceptibility of the
supply voltage
(peak-to-peak value
VP= 4.75 to 5.25 V; fi= 413 MHz 203 mV
VP= 4.75 to 5.25 V; fi= 847 MHz;
note 3 22 mV
fdrift frequency drift (worst case in
the frequency range) T=25°C with compensation;
note 4 1100 2500 kHz
5 s to 15 min after switching on;
note 5 300 1300 kHz
ΦNphase noise, carrier-to-noise
sideband (worst case in the
frequency range)
±50 kHz; frequency offset;
B=3kHz 64 dBc
LO output
YOoutput admittance (GP//CP)G
P
; fi= 101 MHz; see Fig.11 2.4 mS
GP; fi= 847 MHz; see Fig.11 3.1 mS
CP; fi= 101 to 847 MHz; see Fig.11 0.5 pF
VOoutput voltage RL=50; VP= 4.5 to 5.5 V;
Vt= 0 to 28 V 83 90 100 dBµV
SRF spurious signal on LO output
with respect to LO output
signal
RL=50; note 6 −−15 10 dB
HLO LO signal harmonics w.r.t. LO
signal RL=50Ω−10.5 9.5 dB
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1995 Mar 22 9
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
Fig.3 Band A gain measurement.
Zi>> 50 Ω≥V
i=2V
meas (Vi=80dBµV); Vo=V'
meas ×(50 + 25)/50; voltage gain for band A = 20log(Vo/Vi).
handbook, full pagewidth
MBE290
signal
source
V
VD.U.T.
A IN
A IN
IF
out
e
50 25
50
50 Vout
in
V
meas
meas V'
RMS
voltmeter
spectrum
analyzer
Fig.4 Band C gain measurement.
Vi=V
meas (Vi=70dBµV); Vo=V'
meas ×(50 + 25)/50; voltage gain for band C = 20log(Vo/Vi).
handbook, full pagewidth
MBE289
signal
source
V
VHYBRID
AC
BD
D.U.T.
C IN
C IN
e
50 25
50
50
50
out
V
meas
meas V'
RMS
voltmeter
spectrum
analyzer
IF
out
1995 Mar 22 10
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
Fig.5 Band A 1% cross modulation.
Wanted input signal = 80 dBµV; Zi >> 50 Ω≥wanted input signal = 2Vmeas; unwanted input signal modulated with 30% AM;
VoA(IF) = unwanted output signalVo when the output wanted signal is modulated with 0.3% AM.
handbook, full pagewidth
MBE288
wanted
input signal
source
V
HYBRID
AC
BD
D.U.T.
A IN IF
out
A IN
ew
50 25
50
unwanted
input signal
source
50
50
eu
50
out
V
meas
V
modulation analyzer
(unwanted AM on
the output wanted
frequency)
wanted
input
signal
RMS
voltmeter
Fig.6 Band C 1% cross modulation.
Wanted input signal = 70 dBµV; unwanted input signal modulated with 30% AM; VoA(IF) = unwanted output signal Vo when the
output wanted signal is modulated with 0.3% AM.
handbook, full pagewidth
MBE287
wanted
input signal
source
V
HYBRID
AC
BD
HYBRID
AC
BD
D.U.T.
C IN IF
out
C IN
ew
50 25
50
50
unwanted
input signal
source
50
50
eu
50
out
V
modulation analyzer
(unwanted AM on
the output wanted
frequency)
wanted
input
signal RMS
voltmeter
1995 Mar 22 11
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
Fig.7 Input circuit for minimum noise figure.
(a) For fR= 50 MHz:
mixer A frequency response measured = 57 MHz, loss = 0 dB
image suppression = 16 dB
C1 = 9 pF
C2=15pF
L1 = 7 turns ( 5.5mm, wire diam. = 0.5 mm)
l1 = rigid cable (RIM): 5 cm long
(rigid cable (RIM); 33 dB/100 m; 50 Ω, 96 pF/m).
handbook, full pagewidth
MBE286 - 1
L1 C2
C1 PCB
plug plug
BNC BNC
RIM-RIM
I1
C4
C3 PCB
RIM-RIM
I3
I2
(a) (b)
(b) For fR= 180 MHz:
mixer A frequency response measured = 150.3 MHz, loss = 1.3 dB
image suppression = 13 dB
C3 = 5 pF
C4=25pF
l2 = rigid cable (RIM): 30 cm long
l3 = rigid cable (RIM): 5 cm long
(rigid cable (RIM); 33 dB/100 m; 50 Ω; 96 pF/m).
Fig.8 Measurement set-up for ripple measurement,
handbook, full pagewidth
MBE376
MEASUREMENT
TEST CIRCUIT
OF FIG. 14
fo
500 kHz 500 kHz
to
spectrum
analyser
ripple
signal 47
100 µF100 µF
6.8 k
DC supply VP
1995 Mar 22 12
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
Fig.9 S11 on VHF mixer input (Z chart; Zo=50).
handbook, full pagewidth
0.2
0.5
1
2
5
10
0.2
0.5
1
2
5
10
0
+ j
– j
MKA987
0.5 10.2 52 50 MHz
370 MHz
Fig.10 S11 on UHF mixer input (Z chart; Zo=50).
handbook, full pagewidth
0.2
0.5
1
2
5
10
0.2
0.5
1
2
5
10
0
+ j
– j
MKA986
0.5 10.2 1052
810 MHz
350 MHz
1995 Mar 22 13
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
Fig.11 S22 on LO output (Z chart; Zo=50).
handbook, full pagewidth
0.2
0.5
1
2
5
10
0.2
0.5
1
2
5
10
0
+ j
– j
MKA985
0.5 10.2 1052 100 MHz
850 MHz
Fig.12 S22 on IFoutput (Z chart; Zo=50).
handbook, full pagewidth
0.2
0.5
1
2
5
10
0.2
0.5
1
2
5
10
0
+ j
– j
MKA984
0.5 10.2 1052
5 MHz
250 MHz
1995 Mar 22 14
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
INTERNAL PIN CONFIGURATION
Table 1 Average DC voltage on pins
UHF/
VHF PINS
1234567891011121314151617181920
VHF 1.8 0 3 3.6 3.6 0 0 2.1 3.6 3.6 5 4.2 4.2 0 −−1.8 1.8
UHF 0 3.6 1.9 2.9 2.9 1.9 5 0 2.1 3.6 3.6 5 4.2 4.2 0 1 1 −−
Fig.13 Internal pin configuration.
handbook, full pagewidth
123 45 67
MBE393
10
13 12 1118 17 1620 19
89
TDA5732M
VsVs
Vs
Vs
Vs
ground
BAND A OSCILLATOR
BAND C OSCILLATOR
BAND SWITCH IF OUTPUT
STABILIZER
15 14
Vp
LO OUTPUT
IF FILTER
BAND C INPUTBAND A INPUT
RF ground
IF ground
1995 Mar 22 15
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
APPLICATION INFORMATION
Fig.14 Measurement test circuit.
handbook, full pagewidth
C6
123
C7 C11
4
C12
5
C9
C13
6
C14
7
R8
D3 L3
C10
C3 L4
R9
MBE392
BAND C
OSCILLATOR
BAND A
OSCILLATOR
MIXER MIXER
BAND A
STAGE BAND C
STAGE
LOCAL
OSCILLATOR
AMPLIFIER
ELECTRONIC
BAND SWITCH
DC
STABILIZER
IF
AMPLIFIER
10
15 14 13 12 1118 17 1620 19
8
C29
AC
5 V
9
C17
R14 IF out
50
NETWORK
MEASUREMENT
50
NETWORK
MEASUREMENT
ΙΙΙ
Ι
C2
R2
R3 C1
R1
D1
5 V
L1
L2
C4
R4
C5
D2
R6
R7
R5
C28C30C8
V
C24 C26 C27
C23C22
R10
ANZAC-183-4
HYBRID
C21C20
ANZAC-183-4
HYBRID
C19C18
50
50 50 50
5 V L7
TDA5732M
t
1995 Mar 22 16
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
Application diagram components values
Table 2 Capacitors (all SMD and NP0 except
C9 to C11 to C14 and C29)
NUMBER VALUE
C1 1 nF
C2 1 nF
C3 1 nF
C4 82 pF
C5 2.2 nF
C6 2.2 nF
C7 1.5 pF
C8 2.2 nF
C9 6 pF (N750)
C10 100 pF
C11 1 pF (N1500)
C12 2 pF (N750)
C13 2 pF (N750)
C14 1 pF (N1500)
C17 1 nF
C18 1 nF
C19 1 nF
C20 1 nF
C21 1 nF
C22 1 nF
C23 1 nF
C24 1 nF
C26 15 pF
C27 15 pF
C28 2.2 nF
C29 1 nF
C30 1 µF (40 V electrolytic
capacitor)
Table 3 Resistors (all SMD)
Table 4 Diodes and coils
Note
1. Wire size for L1 to L4 is 0.4 mm
Transformer (L7 = 2 turns)
Coil type: TOKO 7kN; material: 113kN, screw core
(03-0093), pot core (04-0026).
NUMBER VALUE
R1 10
R2 12 k
R3 2.7 k
R4 47 k
R5 10
R6 47 k
R7 22 k
R8 2.2 k
R9 22 k
R10 100
R14 27
NUMBER VALUE
Diodes
D1 BA792
D2 BB133
D3 BB134
Coils(1)
L1 6 t (3.5 mm)
L2 3 t (2.5 mm)
L3 2 t (2.5 mm)
L4 3 t (3 mm)
1995 Mar 22 17
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
PACKAGE OUTLINE
UNIT A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
01.4
1.2 0.32
0.20 0.20
0.13 6.6
6.4 4.5
4.3 0.65 1.0 0.2
6.6
6.2 0.65
0.45 0.48
0.18 10
0
o
o
0.13 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
0.75
0.45
SOT266-1 90-04-05
95-02-25
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
X
(A )
3
A
y
0.25
110
20 11
pin 1 index
0 2.5 5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1
A
max.
1.5
1995 Mar 22 18
Philips Semiconductors Preliminary specification
Low power VHF, UHF mixer/oscillator
for TV and VCR 2-band tuners TDA5732M
SOLDERING
Plastic small outline packages
BYWAVE
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
BY SOLDER PASTE REFLOW
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.