BC847BWT1 - ON Semiconductor - Products.Express

General Purpose Transistors

NPN Silicon

These transistors are designed for general purpose amplifier

applications. They are housed in the SOT–323/SC–70 which is

designed for low power surface mount applications.

MAXIMUM RATINGS

Rating Symbol BC846 BC847 BC848 Unit

Collector–Emitter Voltage VCEO 65 45 30 V

Collector–Base Voltage VCBO 80 50 30 V

Emitter–Base V oltage VEBO 6.0 6.0 5.0 V

Collector Current — Continuous IC100 100 100 mAdc

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Total Device Dissipation FR–5 Board, (1)

TA = 25°CPD150 mW

Thermal Resistance, Junction to Ambient RJA 833 °C/W

Total Device Dissipation PD2.4 mW/°C

Junction and Storage Temperature TJ, Tstg –55 to +150 °C

DEVICE MARKING

BC846AWT1 = 1A; BC846BWT1 = 1B; BC847AWT1 = 1E; BC847BWT1 = 1F;

BC847CWT1 = 1G; BC848AWT1 = 1J; BC848BWT1 = 1K; BC848CWT1 = 1L

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristic Symbol Min Typ Max Unit

OFF CHARACTERISTICS

Collector–Emitter Breakdown Voltage BC846 Series

(IC = 10 mA) BC847 Series

BC848 Series

V(BR)CEO 65

—

Collector–Emitter Breakdown Voltage BC846 Series

(IC = 10 µA, VEB = 0) BC847 Series

BC848 Series

V(BR)CES 80

—

Collector–Base Breakdown Voltage BC846 Series

(IC = 10 A) BC847 Series

BC848 Series

V(BR)CBO 80

—

Emitter–Base Breakdown Voltage BC846 Series

(IE = 1.0 A) BC847 Series

BC848 Series

V(BR)EBO 6.0

6.0

5.0

—

Collector Cutoff Current (VCB = 30 V)

(VCB = 30 V, TA = 150°C) ICBO —

——

—15

5.0 nA

µA

1. FR–5 = 1.0 x 0.75 x 0.062 in

ON Semiconductor

 Semiconductor Components Industries, LLC, 2001

September, 2001 – Rev. 2 1Publication Order Number:

BC846AWT1/D

BC846AWT1

Series,

BC847AWT1

Series,

BC848AWT1

Series

CASE 419–02, STYLE 3

SOT–323/SC–70

COLLECTOR

BASE

EMITTER

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ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Continued)

Characteristic Symbol Min Typ Max Unit

ON CHARACTERISTICS

DC Current Gain BC846A, BC847A, BC848A

(IC = 10 µA, VCE = 5.0 V) BC846B, BC847B, BC848B

BC847C, BC848C

(IC = 2.0 mA, VCE = 5.0 V) BC846A, BC847A, BC848A

BC846B, BC847B, BC848B

BC847C, BC848C

hFE —

—

110

200

420

150

270

180

290

520

—

220

450

800

—

Collector–Emitter Saturation Voltage (IC = 10 mA, IB = 0.5 mA)

Collector–Emitter Saturation Voltage (IC = 100 mA, IB = 5.0 mA) VCE(sat) —

——

—0.25

0.6 V

Base–Emitter Saturation Voltage (IC = 10 mA, IB = 0.5 mA)

Base–Emitter Saturation Voltage (IC = 100 mA, IB = 5.0 mA) VBE(sat) —

—0.7

0.9 —

—V

Base–Emitter Voltage (IC = 2.0 mA, VCE = 5.0 V)

Base–Emitter Voltage (IC = 10 mA, VCE = 5.0 V) VBE(on) 580

—660

—700

770 mV

SMALL–SIGNAL CHARACTERISTICS

Current–Gain — Bandwidth Product

(IC = 10 mA, VCE = 5.0 Vdc, f = 100 MHz) fT100 — — MHz

Output Capacitance (VCB = 10 V, f = 1.0 MHz) Cobo — — 4.5 pF

Noise Figure (IC = 0.2 mA, VCE = 5.0 Vdc, RS = 2.0 kΩ, f = 1.0 kHz, BW = 200 Hz) NF — — 10 dB

Figure 1.

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BC847 SERIES & BC848 SERIES

Figure 1. Normalized DC Current Gain

IC, COLLECTOR CURRENT (mAdc)

2.0

Figure 2. “Saturation” and “On” Voltages

IC, COLLECTOR CURRENT (mAdc)

0.2 0.5 1.0 10 20 50

0.2 100

Figure 3. Collector Saturation Region

IB, BASE CURRENT (mA)

Figure 4. Base–Emitter Temperature Coefficient

IC, COLLECTOR CURRENT (mA)

2.0 5.0 200

0.6

0.7

0.8

0.9

1.0

0.5

0.2

0.4

0.1

0.3

1.6

1.2

2.0

2.8

2.4

1.2

1.6

2.0

0.02 1.0 10

020

0.1

0.4

0.8

hFE, NORMALIZED DC CURRENT GAIN

V, VOLTAGE (VOLTS)

VCE, COLLECTOR-EMITTER VOLTAGE (V)

VB, TEMPERATURE COEFFICIENT (mV/ C)°θ

1.5

1.0

0.8

0.6

0.4

0.3

0.2 0.5 1.0 10 20 50

2.0 10070

307.05.03.00.70.30.1

0.2 1.0 10 100

TA = 25°C

VBE(sat) @ IC/IB = 10

VCE(sat) @ IC/IB = 10

VBE(on) @ VCE = 10 V

VCE = 10 V

TA = 25°C

-55°C to +125°CTA = 25°C

IC = 50 mA IC = 100 mA

IC = 200 mA

IC =

20 mA

IC =

10 mA

1.0

Figure 5. Capacitances

VR, REVERSE VOLTAGE (VOLTS)

Figure 6. Current–Gain – Bandwidth Product

IC, COLLECTOR CURRENT (mAdc)

0.4 0.6 1.0 10 20

1.0 2.0 6.0 40

100

200

300

400

7.0

5.0

3.0

2.0

0.7 1.0 10 202.0 50

307.05.03.00.5

VCE = 10 V

TA = 25°C

C, CAPACITANCE (pF)

f, CURRENT-GAIN - BANDWIDTH PRODUCT (MHz)

0.8 4.0 8.0

TA = 25°C

Cob

Cib

BC846AWT1 Series, BC847AWT1 Series, BC848AWT1 Series

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BC846 SERIES

Figure 7. DC Current Gain

IC, COLLECTOR CURRENT (mA)

Figure 8. “On” Voltage

IC, COLLECTOR CURRENT (mA)

0.8

1.0

0.6

0.2

0.4

1.0

2.0

0.1 1.0 10 100

0.2

0.5

0.2 1.0 10 200

TA = 25°C

VBE(sat) @ IC/IB = 10

VCE(sat) @ IC/IB = 10

VBE @ VCE = 5.0 V

Figure 9. Collector Saturation Region

IB, BASE CURRENT (mA)

Figure 10. Base–Emitter Temperature Coefficient

IC, COLLECTOR CURRENT (mA)

-1.0

1.2

1.6

2.0

0.02 1.0 10

020

0.1

0.4

0.8

VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)

VB, TEMPERATURE COEFFICIENT (mV/ C)°θ

0.2 2.0 10 200

1.0

TA = 25°C

200 mA

50 mA

IC =

10 mA

hFE, DC CURRENT GAIN (NORMALIZED)

V, VOLTAGE (VOLTS)

VCE = 5 V

TA = 25°C

00.5 2.0 5.0 20 50 100

0.05 0.2 0.5 2.0 5.0

100 mA

20 mA

-1.4

-1.8

-2.2

-2.6

-3.0

0.5 5.0 20 50 100

-55°C to 125°C

θVB for VBE

Figure 11. Capacitance

VR, REVERSE VOLTAGE (VOLTS)

Figure 12. Current–Gain – Bandwidth Product

IC, COLLECTOR CURRENT (mA)

0.1 0.2 1.0 50

2.0 2.0 10 100

100

200

500

6.0

4.0

1.0 10 50 100

5.0

VCE = 5 V

TA = 25°C

C, CAPACITANCE (pF)

f, CURRENT-GAIN - BANDWIDTH PRODUCT

0.5 5.0 20

TA = 25°C

Cob

Cib

BC846AWT1 Series, BC847AWT1 Series, BC848AWT1 Series

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PD = TJ(max) – TA

RθJA

PD = 150°C – 25°C

0.625°C/W = 200 milliwatts

•The soldering temperature and time should not exceed

260°C for more than 10 seconds.

•When shifting from preheating to soldering, the

maximum temperature gradient should be 5°C or less.

•After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and

result in latent failure due to mechanical stress.

•Mechanical stress or shock should not be applied dur-

ing cooling

* Soldering a device without preheating can cause exces-

sive thermal shock and stress which can result in damage

to the device.

INFORMATION FOR USING THE SC–70/SOT–323 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

SC–70/SOT–323 POWER DISSIPATION

The power dissipation of the SC–70/SOT–323 is a func-

tion of the pad size. This can vary from the minimum pad

size for soldering to the pad size given for maximum power

dissipation. Power dissipation for a surface mount device

is determined by TJ(max), the maximum rated junction tem-

perature of the die, RθJA, the thermal resistance from the

device junction to ambient; and the operating temperature,

TA. Using the values provided on the data sheet, PD can be

calculated as follows.

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

the equation for an ambient temperature TA of 25°C, one

can calculate the power dissipation of the device which in

this case is 200 milliwatts.

The 0.625°C/W assumes the use of the recommended

footprint on a glass epoxy printed circuit board to achieve

a power dissipation of 200 milliwatts. Another alternative

would be to use a ceramic substrate or an aluminum core

board such as Thermal Clad. Using a board material such

as Thermal Clad, a higher power dissipation of 300 milli-

watts can be achieved using the same footprint.

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within

a short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

•Always preheat the device.

•The delta temperature between the preheat and

soldering should be 100°C or less.*

•When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering

method, the difference should be a maximum of 10°C.

inches

0.035

0.9

0.075

0.7

1.9

0.028

0.65

0.025

0.65

0.025

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STEP 1

PREHEAT

ZONE 1

RAMP"

STEP 2

VENT

SOAK"

STEP 3

HEATING

ZONES 2 & 5

RAMP"

STEP 4

HEATING

ZONES 3 & 6

SOAK"

STEP 5

HEATING

ZONES 4 & 7

SPIKE"

STEP 6

VENT

STEP 7

COOLING

200°C

150°C

100°C

50°C

TIME (3 TO 7 MINUTES TOTAL) TMAX

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

205° TO 219°C

PEAK AT

SOLDER JOINT

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

100°C

150°C

160°C

140°C

Figure 13. Typical Solder Heating Profile

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

170°C

For any given circuit board, there will be a group of

control settings that will give the desired heat pattern. The

operator must set temperatures for several heating zones,

and a figure for belt speed. Taken together, these control

settings make up a heating “profile” for that particular

circuit board. On machines controlled by a computer, the

computer remembers these profiles from one operating

session t o the next. Figure 7 shows a typical heating profile

for use when soldering a surface mount device to a printed

circuit board. This profile will vary among soldering

systems but it is a good starting point. Factors that can

affect the profile include the type of soldering system in

use, density and types of components on the board, type of

solder used, and the type of board or substrate material

being used. This profile shows temperature versus time.

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed

circuit board, solder paste must be applied to the pads. A

solder stencil is required to screen the optimum amount of

solder paste onto the footprint. The stencil is made of brass

or stainless steel with a typical thickness of 0.008 inches.

The stencil opening size for the surface mounted package

should be the same as the pad size on the printed circuit

board, i.e., a 1:1 registration.

TYPICAL SOLDER HEATING PROFILE

The line on the graph shows the actual temperature that

might be experienced on the surface of a test board at or

near a central solder joint. The two profiles are based on a

high density and a low density board. The Vitronics

SMD310 convection/infrared reflow soldering system was

used to generate this profile. The type of solder used was

62/36/2 Tin Lead Silver with a melting point between

177–189°C. When this type of furnace is used for solder

reflow work, the circuit boards and solder joints tend to

heat first. The components on the board are then heated by

conduction. The circuit board, because i t has a lar ge surface

area, absorbs the thermal energy more efficiently, then

distributes this energy to the components. Because of this

effect, the main body of a component may be up to 30

degrees cooler than the adjacent solder joints.

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PACKAGE DIMENSIONS

CASE 419–04

ISSUE L

SC–70 (SOT–323)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.071 0.087 1.80 2.20

B0.045 0.053 1.15 1.35

C0.032 0.040 0.80 1.00

D0.012 0.016 0.30 0.40

G0.047 0.055 1.20 1.40

H0.000 0.004 0.00 0.10

J0.004 0.010 0.10 0.25

K0.017 REF 0.425 REF

L0.026 BSC 0.650 BSC

N0.028 REF 0.700 REF

S0.079 0.095 2.00 2.40

0.05 (0.002)

STYLE 3:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

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Notes

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes

without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular

purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,

including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be

validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.

SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or

death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold

SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable

attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim

alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.

PUBLICATION ORDERING INFORMATION

JAPAN: ON Semiconductor, Japan Customer Focus Center

4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031

Phone: 81–3–5740–2700

Email: r14525@onsemi.com

ON Semiconductor Website: http://onsemi.com

For additional information, please contact your local

Sales Representative.

BC846AWT1/D

Thermal Clad is a trademark of the Bergquist Company.

Literature Fulfillment:

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Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada

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