LM26CIM5-XPA/NOPB - NATIONAL SEMICONDUCTOR

LM26TPA V+ = 2.7V

to 5.5V

VTEMP

GND

HYST OS

HYST

REF

TEMP

SENSOR

HYST=GND for 10°C Hysteresis

HYST = V+ for 2°C Hysteresis

VTEMP = (-3.479 x 10-6 x (T-30)2) + (-1.082 x 10-2 x (T-30)) + 1.8015V

TOS

TOS - THYST

Temp. of

Leads

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

LM26

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

LM26 SOT-23, ±3°C Accurate, Factory-Preset Thermostat

1 Features 3 Description

The LM26 is a precision, single digital-output, low-

1• Internal Comparator With Pin Programmable 2°C power thermostat comprised of an internal reference,

or 10°C Hysteresis DAC, temperature sensor and comparator. Utilizing

• No External Components Required factory programming, it can be manufactured with

• Open-Drain or Push-Pull Digital Output; Supports different trip points as well as different digital output

functionality. The trip point (TOS) can be preset at the

CMOS Logic Levels factory to any temperature in the range of −55°C to

• Internal Temperature Sensor With VTEMP Output 110°C in 1°C increments. The LM26 has one digital

Pin output (OS/OS/US/US), one digital input (HYST) and

• VTEMP Output Allows After-Assembly System one analog output (VTEMP). The digital output stage

Testing can be preset as either open-drain or push-pull. In

addition, it can be factory programmed to be active

• Internal Voltage Reference and DAC for Trip-Point HIGH or LOW. The digital output can be factory

Setting programmed to indicate an over temperature

• Currently Available in 5-pin SOT-23 Plastic shutdown event (OS or OS) or an under temperature

Package shutdown event (US or US). When preset as an

• Excellent Power Supply Noise Rejection overtemperature shutdown (OS) it will go LOW to

indicate that the die temperature is over the internally

• UL Recognized Component preset TOS and go HIGH when the temperature goes

• Key Specifications below (TOS–THYST). Similarly, when preprogrammed

– Power Supply Voltage 2.7 V to 5.5 V as an undertemperature shutdown (US) it will go

HIGH to indicate that the temperature is below TUS

– Power Supply Current and go LOW when the temperature is above

40 μA (Maximum) 16 μA (Typical) (TUS+THYST). The typical hysteresis, THYST, can be set

– Hysteresis Temperature 2°C or 10°C (Typical) to 2°C or 10°C and is controlled by the state of the

HYST pin. A VTEMP analog output provides a voltage

2 Applications that is proportional to temperature and has a −10.82

mV/°C output slope.

• Microprocessor Thermal Management

• Appliances Available parts are detailed in the Device Comparison

Table. For other part options, contact a Texas

• Portable Battery Powered Systems Instruments Distributor or Sales Representative for

• Fan Control information on minimum order qualification. The

• Industrial Process Control LM26 is currently available in a 5-lead SOT-23

package.

• HVAC Systems

• Remote Temperature Sensing Device Information(1)

• Electronic System Protection PART NUMBER PACKAGE BODY SIZE (NOM)

LM26 SOT-23 (5) 2.90 mm × 1.60 mm

(1) For all available packages, see the orderable addendum at

the end of the datasheet.

LM26CIM5-TPA Simplified Block Diagram and Connection Diagram

The LM26CIM5-TPA has a fixed trip point of 85°C. For other trip point and output function availability, please see the

Device Comparison Table or contact Texas Instruments.

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM26

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

www.ti.com

Table of Contents

8.4 Device Functional Modes.......................................... 9

1 Features.................................................................. 19 Application and Implementation ........................ 10

2 Applications ........................................................... 19.1 Application Information............................................ 10

3 Description............................................................. 19.2 Typical Application.................................................. 10

4 Revision History..................................................... 29.3 System Examples ................................................... 11

5 Device Comparison Table..................................... 310 Power Supply Recommendations ..................... 12

6 Pin Configuration and Functions......................... 411 Layout................................................................... 12

7 Specifications......................................................... 411.1 Layout Guidelines ................................................. 12

7.1 Absolute Maximum Ratings ...................................... 411.2 Layout Example .................................................... 12

7.2 ESD Ratings.............................................................. 511.3 Thermal Considerations........................................ 13

7.3 Recommended Operating Conditions....................... 511.4 Part Number Template.......................................... 14

7.4 Thermal Information.................................................. 512 Device and Documentation Support................. 15

7.5 Electrical Characteristics .......................................... 512.1 Community Resources.......................................... 15

7.6 Typical Characteristics.............................................. 612.2 Trademarks........................................................... 15

8 Detailed Description.............................................. 712.3 Electrostatic Discharge Caution............................ 15

8.1 Overview................................................................... 712.4 Glossary................................................................ 15

8.2 Functional Block Diagrams ....................................... 713 Mechanical, Packaging, and Orderable

8.3 Feature Description................................................... 8Information ........................................................... 15

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision R (February 2013) to Revision S Page

• Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device

Functional Modes,Application and Implementation section, Power Supply Recommendations section, Layout

section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section ................................................................................................................................................................................... 1

• Removed Part Number Template table ................................................................................................................................. 6

• Removed Temperature Trip Point Accuracy table ................................................................................................................ 6

Changes from Revision Q (September 2011) to Revision R Page

• Changed layout of National Data Sheet to TI format ........................................................................................................... 11

Product Folder Links: LM26

LM26

www.ti.com

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

5 Device Comparison Table

Order Number Top Mark Trip Point Output Function

Setting

Bulk Rail (1000 Units) Tape & Reel (3000 Units)

LM26CIM5-BPB LM26CIM5X-BPB TBPB -45°C Active-Low, Open-Drain, US output

LM26CIM5-DPB LM26CIM5X-DPB TDPB -25°C Active-Low, Open-Drain, US output

LM26CIM5-HHD LM26CIM5X-HHD THHD 0°C Active-High, Push-Pull, US output

LM26CIM5-NPA LM26CIM5X-NPA TNPA 45°C Active-Low, Open-Drain, OS output

LM26CIM5-RPA LM26CIM5X-RPA TRPA 65°C Active-Low, Open-Drain, OS output

LM26CIM5-SHA LM26CIM5X-SHA TSHA 75°C Active-Low, Open-Drain, OS output

LM26CIM5-SPA LM26CIM5X-SPA TSPA 70°C Active-Low, Open-Drain, OS output

LM26CIM5-TPA LM26CIM5X-TPA TTPA 85°C Active-Low, Open-Drain, OS output

LM26CIM5-VHA LM26CIM5X-VHA TVHA 90°C Active-Low, Open-Drain, OS output

LM26CIM5-VPA LM26CIM5X-VPA TVPA 95°C Active-Low, Open-Drain, OS output

LM26CIM5-XHA LM26CIM5X-XHA TXHA 100°C Active-Low, Open-Drain, OS output

LM26CIM5-XPA LM26CIM5X-XPA TXPA 105°C Active-Low, Open-Drain, OS output

LM26CIM5-YHA LM26CIM5X-YHA TYHA 110°C Active-Low, Open-Drain, OS output

LM26CIM5-YPA LM26CIM5X-YPA TYPA 115°C Active-Low, Open-Drain, OS output

LM26CIM5-ZHA LM26CIM5X-ZHA TZHA 120°C Active-Low, Open-Drain, OS output

Product Folder Links: LM26

LM26

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

www.ti.com

6 Pin Configuration and Functions

DBV Package

5-Pin SOT-23

(Top View)

Pin Functions

PIN TYPE DESCRIPTION

NO. NAME

1 HYST Input Hysteresis control, digital input; connect to GND for 10°C or V+ for 2°C

Power Ground, connected to the back side of the die through lead frame; connect to

2 GND system ground

Output Analog output voltage proportional to temperature; leave floating or connect to a

3 VTEMP high impedance node.

4 V+Power Supply input; connect to 2.7 V to 5.5 V with a 0.1-μF bypass capacitor.

Output Overtemperature Shutdown open-drain active low thermostat digital output;

OS connect to controller interrupt, system/power supply shutdown; pullup resistor ≥10

kΩ

OS Output Overtemperature Shutdown push-pull active high thermostat digital output;

connect to controller interrupt, system/power supply shutdown

5(1) US Output Undertemperature Shutdown open-drain active low thermostat digital output;

connect to controller interrupt, system/power supply shutdown; pullup resistor ≥10

kΩ

US Output Undertemperature Shutdown push-pull active high thermostat digital output;

connect to controller interrupt, system/power supply shutdown

(1) Pin 5 functionality and trip point setting are programmed during LM26 manufacture.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN MAX UNIT

Input Voltage 6 V

Input Current at any pin (2) 5 mA

Package Input Current (2) 20 mA

Package Dissipation at TA= 25°C(3) 500 mW

Vapor Phase (60 seconds) 215

Soldering SOT-23 Package °C

Information(4) Infrared (15 seconds) 220

Storage Temperature, Tstg −65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) When the input voltage (VI) at any pin exceeds the power supply (VI< GND or VI> V+), the current at that pin should be limited to 5 mA.

The 20-mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input

current of 5 mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5 mA each.

(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX (maximum junction temperature),

θJA (junction to ambient thermal resistance) and TA(ambient temperature). The maximum allowable power dissipation at any

temperature is PD= (TJMAX–TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJMAX

= 150°C. For this device the typical thermal resistance (θJA) of the different package types when board mounted follow:

(4) See the URL http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.

Product Folder Links: LM26

LM26

www.ti.com

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

7.2 ESD Ratings VALUE UNIT

Human body model (HBM) ±2500

V(ESD) Electrostatic discharge(1) V

Machine Model ±250

(1) The human body model is a 100-pF capacitor discharge through a 1.5-kΩresistor into each pin. The machine model is a 200-pF

capacitor discharged directly into each pin.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)

MIN MAX UNIT

Specified Temperature Range (TMIN ≤TA≤TMAX)−55 125 °C

Positive Supply Voltage (V+) 2.7 5.5 V

Maximum VOUT 5.5 V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see

the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics

may degrade when the device is not operated under the listed test conditions.

7.4 Thermal Information LM26

THERMAL METRIC(1) DBV (SOT-23) UNIT

5 PINS

RθJA Junction-to-ambient thermal resistance 250 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.5 Electrical Characteristics

The following specifications apply for V+= 2.7 VDC to 5.5 VDC, and VTEMP load current = 0 µA unless otherwise specified. All

limits apply for TA= TJ= TMIN to TMAX unless otherwise specified.

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT

TEMPERATURE SENSOR

Trip Point Accuracy (Includes VREF, DAC, –55°C ≤TA≤+110°C ±3 °C

Comparator Offset, and Temperature TA= +120°C ±4 °C

Sensitivity errors) HYST = GND 11 °C

Trip Point Hysteresis HYST = V+2 °C

VTEMP Output Temperature Sensitivity −10.82 mV/°C

VTEMP Temperature Sensitivity Error to −30°C ≤TA≤120°C ±3 °C

Equation: −55°C ≤TA≤4.5 V ≤V+≤5.5 V ±3 °C

VO= (−3.479 × 10−6× (T −30)2) + 120°C,

(−1.082 × 10−2× (T −30)) + 1.8015 V TA= 30°C ±2.5 °C

Source ≤1μA 0.070 mV

VTEMP Load Regulation Sink ≤40 μA 0.7 mV

+2.7 V ≤V+≤+5.5 V,

VTEMP Line Regulation −0.2 mV/V

−30°C ≤TA≤+120°C

TA= 25°C 16 20 µA

ISSupply Current 40

(1) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).

(2) Typicals are at TJ= TA= 25°C and represent most likely parametric norm.

Product Folder Links: LM26

100

±60 ±40 ±20 0 20 40 60 80 100 120 140

Supply Current (µA)

Temperature (°C) C001

LM26

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

www.ti.com

Electrical Characteristics (continued)

The following specifications apply for V+= 2.7 VDC to 5.5 VDC, and VTEMP load current = 0 µA unless otherwise specified. All

limits apply for TA= TJ= TMIN to TMAX unless otherwise specified.

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT

DIGITAL OUTPUT AND INPUT

IOUT(1) Logical 1 Output Leakage Current (3) TA= 25°C V+= +5.0 V 0.001 1 µA

IOUT = +1.2 mA and V+≥2.7 V;

VOUT(0) Logical 0 Output Voltage 0.4 V

IOUT = +3.2 mA and V+≥4.5 V(4)

ISOURCE = 500 µA, V+≥2.7 V 0.8 × V+V

VOUT(1) Logical 1 Push-Pull Output Voltage ISOURCE = 800 µA, V+≥4.5 V V+−1.5 V

VIH HYST Input Logical 1 Threshold Voltage 0.8 × V+V

VIL HYST Input Logical 0 Threshold Voltage 0.2 × V+V

(3) The 1-µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the

current for every 15°C increase in temperature. For example, the 1-nA typical current at 25°C would increase to 16 nA at 85°C.

(4) Take care to include the effects of self heating when setting the maximum output load current. The power dissipation of the LM26 would

increase by 1.28 mW when IOUT = 3.2 mA and VOUT = 0.4 V. With a thermal resistance of 250°C/W, this power dissipation would cause

an increase in the die temperature of about 0.32°C due to self heating. Self heating is not included in the trip point accuracy

specification.

7.6 Typical Characteristics

Figure 1. Power Supply Current Temperature Dependence

Product Folder Links: LM26

VTEMP

GND

HYST

REF

TEMP

SENSOR +

V+

LM26__C

HYST

VTEMP

GND

HYST

REF

TEMP

SENSOR +

HYST

LM26__B V+

VTEMP

GND

HYST OS

REF

TEMP

SENSOR

HYST

LM26__A V+

LM26

www.ti.com

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

8 Detailed Description

8.1 Overview

The LM26 is a factory preset thermostat (temperature switch) that includes an integrated temperature sensor,

reference voltage, DAC and comparator. The LM26 can be factory programmed to have a trip point anywhere in

the range of −55°C to +120°C. The output functionality can also be changed during the manufacturing process,

as described in the functional block diagrams. Available options include:

• OS: active low, open drain that indicates an over temperature shutdown event (most common)

• US: active low, open-drain that indicates an under temperature shutdown event

• OS: active high, push-pull that indicates an over temperature shutdown event

• US: active high, push-pull that indicates an under temperature shutdown event

The internal temperature sensor is brought out on the VTEMP pin and can be used to determine the temperature

that the LM26 is reading by monitoring with an ADC. It has a negative temperature coefficient (NTC) of

approximately -10mV/°C. This pin also allows after assembly PCB testing (see section After Assembly PCB

Testing for more details).

The comparator hysteresis is selectable by the state of the HYST. Two values are available 10°C or 2°C.

Comparator hysteresis is essential, as it prevents comparator output chattering when the temperature is at the

comparator threshold set point (REF as shown in the functional block diagrams). Once the comparator trips the

hysteresis function changes the comparator threshold (REF) level such that the output remains locked in the

active state. The threshold is changed by either 10°C or 2°C as programmed by the state of the HYST pin.

8.2 Functional Block Diagrams

Figure 2. LM26-_ _A Output Pin Block Diagram

Figure 3. LM26-_ _B Output Pin Block Diagram

Figure 4. LM26-_ _C Output Pin Block Diagram

Product Folder Links: LM26

6TEMP

1.8015 V

T 1525.04 2.4182 10

3.479 10-

= - + ´ +

6 2 2

OV = ( 3.47 10 (T 30) ) + (1.082 10 (T 30)) + 1.8015 V

- -

- ´ ´ - ´ ´ -

VTEMP

GND

HYST

REF

TEMP

SENSOR +

V+

LM26__D

HYST

LM26

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

www.ti.com

Functional Block Diagrams (continued)

Figure 5. LM26-_ _D Output Pin Block Diagram

8.3 Feature Description

8.3.1 Hysteresis

The HYST pin level sets the comparator hysteresis. Setting the HYST pin to GND selects 10°C hysteresis, while

setting it to V+selects 2°C. A series resistor can be used for protection purposes. The input leakage current of

the pin is less than 10 µA. The value of the resistor will depend on the value of V+as well as the leakage current.

For example with V+= 3.3 V the input threshold level for VIH = 0.8 × 3.3 V = 2.64 V, thus the voltage drop across

the resistor should be less than 0.66 V. The 10-µA input leakage current requires the resistor value to be less

than 66 kΩ.

8.3.2 VTEMP Output

The VTEMP output provides an output voltage that can be used to determine the temperature reading of the LM26.

The temperature reading of the LM26 can be calculated using the equation:

(1)

(2)

The VTEMP output has very weak drive capability (1-µA source, 40-µA sink). So care should be taken when

attaching circuitry to this pin. Capacitive loading may cause the VTEMP output to oscillate. Simply adding a resistor

in series as shown in Figure 6 and Figure 7 will prevent oscillations from occurring. To determine the value of the

resistor follow the guidelines given in Table 1. The same value resistor will work for either placement of the

resistor. If an additional capacitive load is placed directly on the LM26 output, rather than across CLOAD, it should

be at least a factor of 10 smaller than CLOAD.

Table 1. Resistive Compensation for Capacitive Loading of VTEMP

CLOAD R (Ω)

≤100pF 0

1nF 8200

10nF 3000

100nF 1000

≥1µF 430

Product Folder Links: LM26

6TEMP

1.8015 V

T 1525.04 2.4182 10

3.479 10-

= - + ´ +

6 2 2

OV = ( 3.47 10 (T 30) ) + (1.082 10 (T 30)) + 1.8015 V

- -

- ´ ´ - ´ ´ -

LM26

V+

VTEMP

GND

HYST OS/OS/US/

CLOAD

R0.1Pf

Heavy Capacitive

Load, Cable/Wiring

LM26

V+

VTEMP

GND

HYST OS/OS/US/

CLOAD

0.1Pf

Heavy Capacitive

Load, Cable/Wiring

LM26

www.ti.com

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

Figure 6. Resistor Placement for Capacitive- Figure 7. Resistor Placement for Capacitive-

Loading Compensation of VTEMP With R in Series Loading Compensation of VTEMP With R in Series

With Capacitor With Signal Path

8.4 Device Functional Modes

The LM26 after factory programming has two functional modes one with 2°C Hysteresis and the other with 10°C

hysteresis as programmed by the level of the HYST pin. Selection of the level will depend on the system noise

and the temperature transition rate.

8.4.1 After Assembly PCB Testing

The LM26's VTEMP output allows after-assembly PCB testing by following a simple test procedure. Simply

measuring the VTEMP output voltage will verify that the LM26 has been assembled properly and that its

temperature sensing circuitry is functional. The VTEMP output has very weak drive capability that can be

overdriven by 1.5mA. Therefore, one can simply force the VTEMP voltage to cause the digital output to change

state, thereby verifying that the comparator and output circuitry function after assembly. Here is a sample test

procedure that can be used to test the LM26CIM5-TPA which has an 85°C trip point.

1. Turn on V+and measure VTEMP. Then calculate the temperature reading of the LM26 using the equation:

(3)

(4)

2. Verify that the temperature measured in step one is within (±3°C + error of reference temperature sensor) of

the ambient/board temperature. The ambient/board temperature (reference temperature) should be

measured using an extremely accurate calibrated temperature sensor.

3. (a) Observe that OS is high.

(b) Drive VTEMP to ground.

(d) Release the VTEMP pin.

(e) Observe that OS is now high.

4. (a) Observe that OS is high.

(b) Drive VTEMP voltage down gradually.

(d) VTEMPTrig = VTEMP at OS trigger (HIGH->LOW)

(e) Calculate Trig using Equation 2.

5. (a) Gradually raise VTEMP until OS goes HIGH. Note VTEMP.

(b) Calculate THYST using Equation 2.

Product Folder Links: LM26

12V

System Fan

Sanyo Denki

109R0612T4H12

LM26

V+

VTEMP

GND

HYST OS

10k

0.1Pf

+5V

LM26

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

www.ti.com

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

The LM26 thermostat (temperature switch) can be used in applications such as microprocessor thermal

management, appliances, fan control, industrial process control, power supplies for system protection, fan speed

adjust or plain temperature monitoring.

9.2 Typical Application

Figure 8. Two-Speed Fan Speed Control

9.2.1 Design Requirements

The requirement is to change speed fo a fan to maximum at 45°C with an accuracy of

Table 2. Design Parameters

DESIGN PARAMETER EXAMPLE VALUE

Min Fan Speed 1900 RPM

Max Fan Speed 3800 RPM

Temperature Threshold To Switch From Min Speed to Max Speed 45°C

Threshold accuracy ±3°C

9.2.2 Detailed Design Procedure

The design procedure is simple. A fan was selected that has the capability to be controlled by an external NTC

thermistor. The recommended NTC thermistor adjusts the fan speed to maximum at 40°C. The LM26 meets the

threshold accuracy requirements for temperature control of the fan speed and allows setting the max speed

temperature threshold higher as required to 45°C. The resistance of the thermistor for the min fan speed is 6.8

kΩ. Since thermistors have a negative temperature coefficient (NTC), 10 kΩwas chosen to ensure that the fan is

at min speed when the LM26 OS is off. When the OS output goes low at 45°C it simulates the low thermistor

resistance at higher temperatures thus setting fan to max speed.

Product Folder Links: LM26

LM26

V+

VTEMP

(10k)

0.1

Heater

Supply

GND

HYST

5V Fan

MC05J3

Comair-Rotron

IC2

LM26

V+

VTEMP

GND

HYST OS

100k

NDS356P

IC1

LM3886

47k

20k

THERMALLY COUPLED

0.1Pf

+28V

-28V

Audio

Input

10PF

3.3PF

1N4001

Vout

12V

TOYO

USTF802512HW

LM26

V+

VTEMP

GND

HYST

(1k)

0.1

1N4001

5V Fan

MC05J3

Comair-Rotron

LM26

V+

VTEMP

GND

HYST OS

(100k)

0.1

NDS356P

1N4001

Trip Point

Trip Point - Hysteresis

VTEMP Output

(Temp. of Leads)

OFF

Fan

Speed

1900 RPM

3800 RPM

LM26

www.ti.com

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

9.2.3 Application Curve

Figure 9. Temperature Effect on Fan Speed

9.3 System Examples

Figure 10. Fan High-Side Drive Figure 11. Fan Low-Side Drive

Figure 12. Audio Power Amplifier Thermal Figure 13. Simple Thermostat

Protection

Product Folder Links: LM26

GND

VTEMP

OS, OS,

US, US

V+

VIA to ground plane

VIA to power plane

0.1 µ F

R is optional maybe directly

connected to GND or V+

R only required

for open-drain

HYST

LM26

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

www.ti.com

10 Power Supply Recommendations

The LM26 has excellent power supply noise rejection. Listed below is a variety of signals used to test the LM26

power supply rejection. False triggering of the output was not observed when these signals where coupled into

the V+ pin of the LM26.

• square wave 400 kHz, 1 Vp-p

• square wave 2 kHz, 200 mVp-p

• sine wave 100 Hz to 1 MHz, 200 mVp-p

Testing was done while maintaining the temperature of the LM26 one degree centigrade way from the trip point

with the output not activated.

11 Layout

11.1 Layout Guidelines

The LM26 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued

or cemented to a surface. The temperature that the LM26 is sensing will be within about +0.06°C of the surface

temperature to which the LM26's leads are attached to.

This presumes that the ambient air temperature is almost the same as the surface temperature; if the air

temperature were much higher or lower than the surface temperature, the actual temperature measured would

be at an intermediate temperature between the surface temperature and the air temperature.

To ensure good thermal conductivity, the backside of the LM26 die is directly attached to the GND pin (pin 2).

The temperatures of the lands and traces to the other leads of the LM26 will also affect the temperature that is

being sensed.

Alternatively, the LM26 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or

screwed into a threaded hole in a tank. As with any IC, the LM26 and accompanying wiring and circuits must be

kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold

temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy

paints or dips are often used to ensure that moisture cannot corrode the LM26 or its connections.

11.2 Layout Example

Figure 14. LM26 Typical Layout

Product Folder Links: LM26

J A JA TEMP L _ TEMP DO DO

T T (V V )I V I )

= + Q - +

LM26

www.ti.com

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

11.3 Thermal Considerations

The junction to ambient thermal resistance (RθJA) is the parameter used to calculate the rise of a part's junction

temperature due to its power dissipation. For the LM26 the equation used to calculate the rise in the die junction

temperature is as follows:

where

• TAis the ambient temperature, V+is the power supply voltage

• IQis the quiescent current, IL_TEMP is the load current on the VTEMP output

• VDO is the voltage on the digital output

• and IDO is the load current on the digital output (5)

Since the LM26's junction temperature is the actual temperature being measured, care should be taken to

minimize the load current that the LM26 is required to drive.

Table 3 summarizes the thermal resistance for different conditions and the rise in die temperature of the LM26

without any loading on VTEMP and a 10-kΩpullup resistor on an open-drain digital output with a 5.5-V power

supply.

Table 3. Thermal resistance (RθJA) and Temperature Rise Due to Self Heating (TJ−TA)

SOT-23 5 pin

no heat sink

RθJA TJ−TA

(°C/W) (°C)

Still Air 250 0.11

Moving Air TBD TBD

Product Folder Links: LM26

LM26

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

www.ti.com

11.4 Part Number Template

The series of digits labeled xyz in the part number LM26CIM-xyz, describe the set point value and the function of

the output as follows:

The place holders xy describe the set point temperature as shown in the following table.

x (10x) y (1x) Temperature (°C)

A - −5

B - −4

C - −3

D - −2

E - −1

F - −0

H H 0

J J 1

K K 2

L L 3

N N 4

P P 5

R R 6

S S 7

T T 8

V V 9

X - 10

Y - 11

Z - 12

The value of z describes the assignment/function of the output as shown in the following table:

Open-Drain/ Push-

Active-Low/High OS/US Value of z Digital Output Function

Pull

0 0 0 A Active-Low, Open-Drain, OS output

0 0 1 B Active-Low, Open-Drain, US output

1 1 0 C Active-High, Push-Pull, OS output

1 1 1 D Active-High, Push-Pull, US output

For example:

• the part number LM26CIM5-TPA has TOS = 85°C, and programmed as an active-low open-drain

overtemperature shutdown output.

• the part number LM26CIM5-FPD has TUS =−5°C, and programmed as an active-high, push-pull

undertemperature shutdown output.

Active-high open-drain and active-low push-pull options are available, please contact Texas Instruments for more

information.

Product Folder Links: LM26

LM26

www.ti.com

SNIS115S –MAY 2001–REVISED SEPTEMBER 2015

12 Device and Documentation Support

12.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

12.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: LM26

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM26CIM5-BPB/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM TBPB

LM26CIM5-DPB/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TDPB

LM26CIM5-HHD/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 THHD

LM26CIM5-NPA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TNPA

LM26CIM5-PHA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TPHA

LM26CIM5-RPA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TRPA

LM26CIM5-SHA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TSHA

LM26CIM5-SPA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TSPA

LM26CIM5-TPA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TTPA

LM26CIM5-VHA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TVHA

LM26CIM5-VPA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TVPA

LM26CIM5-XHA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TXHA

LM26CIM5-XPA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TXPA

LM26CIM5-YHA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TYHA

LM26CIM5-YPA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TYPA

LM26CIM5-ZHA NRND SOT-23 DBV 5 1000 Non-RoHS &

Non-Green Call TI Call TI -55 to 125 TZHA

LM26CIM5-ZHA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TZHA

LM26CIM5X-DPB/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TDPB

LM26CIM5X-HHD/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 THHD

LM26CIM5X-NPA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TNPA

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM26CIM5X-PHA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TPHA

LM26CIM5X-SPA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TSPA

LM26CIM5X-TPA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TTPA

LM26CIM5X-VHA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TVHA

LM26CIM5X-VPA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TVPA

LM26CIM5X-XHA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TXHA

LM26CIM5X-XPA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TXPA

LM26CIM5X-YHA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TYHA

LM26CIM5X-YPA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TYPA

LM26CIM5X-ZHA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TZHA

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 3

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM26CIM5-BPB/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-DPB/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-HHD/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-NPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-PHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-RPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-SHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-SPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-TPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-VHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-VPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-XHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-XPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-YHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-YPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-ZHA SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-ZHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-DPB/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 1

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM26CIM5X-HHD/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-NPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-PHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-SPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-TPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-VHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-VPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-XHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-XPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-YHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-YPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-ZHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM26CIM5-BPB/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-DPB/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-HHD/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-NPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-PHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 2

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM26CIM5-RPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-SHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-SPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-TPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-VHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-VPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-XHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-XPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-YHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-YPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-ZHA SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-ZHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5X-DPB/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-HHD/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-NPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-PHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-SPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-TPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-VHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-VPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-XHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-XPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-YHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-YPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-ZHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 3

www.ti.com

PACKAGE OUTLINE

0.22

0.08 TYP

0.25

3.0

2.6

2X 0.95

1.9

1.45

0.90

0.15

0.00 TYP

5X 0.5

0.3

0.6

0.3 TYP

0 TYP

1.9

3.05

2.75

1.75

1.45

(1.1)

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/E 09/2019

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Refernce JEDEC MO-178.

4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ARROUND 0.07 MIN

ARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

4214839/E 09/2019

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/E 09/2019

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

8. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

PKG

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

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