Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LM26 SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 LM26 SOT-23, 3C Accurate, Factory-Preset Thermostat 1 Features 3 Description * The LM26 is a precision, single digital-output, lowpower thermostat comprised of an internal reference, DAC, temperature sensor and comparator. Utilizing factory programming, it can be manufactured with different trip points as well as different digital output functionality. The trip point (TOS) can be preset at the factory to any temperature in the range of -55C to 110C in 1C increments. The LM26 has one digital output (OS/OS/US/US), one digital input (HYST) and one analog output (VTEMP). The digital output stage can be preset as either open-drain or push-pull. In addition, it can be factory programmed to be active HIGH or LOW. The digital output can be factory programmed to indicate an over temperature shutdown event (OS or OS) or an under temperature shutdown event (US or US). When preset as an overtemperature shutdown (OS) it will go LOW to indicate that the die temperature is over the internally preset TOS and go HIGH when the temperature goes below (TOS-THYST). Similarly, when preprogrammed as an undertemperature shutdown (US) it will go HIGH to indicate that the temperature is below TUS and go LOW when the temperature is above (TUS+THYST). The typical hysteresis, THYST, can be set to 2C or 10C and is controlled by the state of the HYST pin. A VTEMP analog output provides a voltage that is proportional to temperature and has a -10.82 mV/C output slope. 1 * * * * * * * * * Internal Comparator With Pin Programmable 2C or 10C Hysteresis No External Components Required Open-Drain or Push-Pull Digital Output; Supports CMOS Logic Levels Internal Temperature Sensor With VTEMP Output Pin VTEMP Output Allows After-Assembly System Testing Internal Voltage Reference and DAC for Trip-Point Setting Currently Available in 5-pin SOT-23 Plastic Package Excellent Power Supply Noise Rejection UL Recognized Component Key Specifications - Power Supply Voltage 2.7 V to 5.5 V - Power Supply Current 40 A (Maximum) 16 A (Typical) - Hysteresis Temperature 2C or 10C (Typical) 2 Applications * * * * * * * * Microprocessor Thermal Management Appliances Portable Battery Powered Systems Fan Control Industrial Process Control HVAC Systems Remote Temperature Sensing Electronic System Protection Available parts are detailed in the Device Comparison Table. For other part options, contact a Texas Instruments Distributor or Sales Representative for information on minimum order qualification. The LM26 is currently available in a 5-lead SOT-23 package. Device Information(1) PART NUMBER LM26 PACKAGE BODY SIZE (NOM) SOT-23 (5) 2.90 mm x 1.60 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. LM26CIM5-TPA Simplified Block Diagram and Connection Diagram TOS HYST OS HYST REF Temp. of Leads + GND TEMP SENSOR VTEMP TOS - THYST - LM26TPA OS V+ = 2.7V to 5.5V HYST=GND for 10C Hysteresis HYST = V+ for 2C Hysteresis VTEMP = (-3.479 x 10-6 x (T-30)2) + (-1.082 x 10-2 x (T-30)) + 1.8015V The LM26CIM5-TPA has a fixed trip point of 85C. For other trip point and output function availability, please see the Device Comparison Table or contact Texas Instruments. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM26 SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 4 7.1 7.2 7.3 7.4 7.5 7.6 4 5 5 5 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics .......................................... Typical Characteristics .............................................. Detailed Description .............................................. 7 8.1 Overview ................................................................... 7 8.2 Functional Block Diagrams ....................................... 7 8.3 Feature Description................................................... 8 8.4 Device Functional Modes.......................................... 9 9 Application and Implementation ........................ 10 9.1 Application Information............................................ 10 9.2 Typical Application .................................................. 10 9.3 System Examples ................................................... 11 10 Power Supply Recommendations ..................... 12 11 Layout................................................................... 12 11.1 11.2 11.3 11.4 Layout Guidelines ................................................. Layout Example .................................................... Thermal Considerations ........................................ Part Number Template.......................................... 12 12 13 14 12 Device and Documentation Support ................. 15 12.1 12.2 12.3 12.4 Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 15 15 15 15 13 Mechanical, Packaging, and Orderable Information ........................................................... 15 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision R (February 2013) to Revision S Page * Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................................................................................................... 1 * Removed Part Number Template table ................................................................................................................................. 6 * Removed Temperature Trip Point Accuracy table ................................................................................................................ 6 Changes from Revision Q (September 2011) to Revision R * 2 Page Changed layout of National Data Sheet to TI format ........................................................................................................... 11 Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM26 LM26 www.ti.com SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 5 Device Comparison Table Order Number Top Mark Trip Point Setting Output Function LM26CIM5X-BPB TBPB -45C Active-Low, Open-Drain, US output LM26CIM5-DPB LM26CIM5X-DPB TDPB -25C Active-Low, Open-Drain, US output LM26CIM5-HHD LM26CIM5X-HHD THHD 0C Active-High, Push-Pull, US output LM26CIM5-NPA LM26CIM5X-NPA TNPA 45C Active-Low, Open-Drain, OS output LM26CIM5-RPA LM26CIM5X-RPA TRPA 65C Active-Low, Open-Drain, OS output LM26CIM5-SHA LM26CIM5X-SHA TSHA 75C Active-Low, Open-Drain, OS output LM26CIM5-SPA LM26CIM5X-SPA TSPA 70C Active-Low, Open-Drain, OS output LM26CIM5-TPA LM26CIM5X-TPA TTPA 85C Active-Low, Open-Drain, OS output LM26CIM5-VHA LM26CIM5X-VHA TVHA 90C Active-Low, Open-Drain, OS output LM26CIM5-VPA LM26CIM5X-VPA TVPA 95C Active-Low, Open-Drain, OS output LM26CIM5-XHA LM26CIM5X-XHA TXHA 100C Active-Low, Open-Drain, OS output LM26CIM5-XPA LM26CIM5X-XPA TXPA 105C Active-Low, Open-Drain, OS output LM26CIM5-YHA LM26CIM5X-YHA TYHA 110C Active-Low, Open-Drain, OS output LM26CIM5-YPA LM26CIM5X-YPA TYPA 115C Active-Low, Open-Drain, OS output LM26CIM5-ZHA LM26CIM5X-ZHA TZHA 120C Active-Low, Open-Drain, OS output Bulk Rail (1000 Units) Tape & Reel (3000 Units) LM26CIM5-BPB Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM26 3 LM26 SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 www.ti.com 6 Pin Configuration and Functions DBV Package 5-Pin SOT-23 (Top View) Pin Functions PIN NO. NAME 1 HYST 2 GND 3 VTEMP 4 V+ TYPE Input (1) Hysteresis control, digital input; connect to GND for 10C or V+ for 2C Power Ground, connected to the back side of the die through lead frame; connect to system ground Output Analog output voltage proportional to temperature; leave floating or connect to a high impedance node. Power Supply input; connect to 2.7 V to 5.5 V with a 0.1-F bypass capacitor. Output Overtemperature Shutdown open-drain active low thermostat digital output; connect to controller interrupt, system/power supply shutdown; pullup resistor 10 k OS Output Overtemperature Shutdown push-pull active high thermostat digital output; connect to controller interrupt, system/power supply shutdown US Output Undertemperature Shutdown open-drain active low thermostat digital output; connect to controller interrupt, system/power supply shutdown; pullup resistor 10 k US Output Undertemperature Shutdown push-pull active high thermostat digital output; connect to controller interrupt, system/power supply shutdown OS 5 DESCRIPTION (1) Pin 5 functionality and trip point setting are programmed during LM26 manufacture. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN Input Voltage Input Current at any pin Package Input Current (2) (2) Package Dissipation at TA = 25C Soldering Information (4) (3) SOT-23 Package (2) (3) (4) 4 V 5 mA 20 mA 500 mW 215 Infrared (15 seconds) 220 -65 UNIT 6 Vapor Phase (60 seconds) Storage Temperature, Tstg (1) MAX 150 C C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5 mA. The 20-mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5 mA each. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX (maximum junction temperature), JA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD = (TJMAX-TA) / JA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJMAX = 150C. For this device the typical thermal resistance (JA) of the different package types when board mounted follow: See the URL http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices. Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM26 LM26 www.ti.com SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 7.2 ESD Ratings VALUE V(ESD) (1) Electrostatic discharge (1) Human body model (HBM) 2500 Machine Model 250 UNIT V The human body model is a 100-pF capacitor discharge through a 1.5-k resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) Specified Temperature Range (TMIN TA TMAX) Positive Supply Voltage (V+) MIN MAX UNIT -55 125 C 2.7 5.5 V 5.5 V Maximum VOUT (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. 7.4 Thermal Information LM26 THERMAL METRIC (1) DBV (SOT-23) UNIT 5 PINS RJA (1) Junction-to-ambient thermal resistance 250 C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.5 Electrical Characteristics The following specifications apply for V+ = 2.7 VDC to 5.5 VDC, and VTEMP load current = 0 A unless otherwise specified. All limits apply for TA = TJ = TMIN to TMAX unless otherwise specified. PARAMETER TEST CONDITIONS MIN (1) TYP (2) MAX (1) UNIT TEMPERATURE SENSOR Trip Point Accuracy (Includes VREF, DAC, Comparator Offset, and Temperature Sensitivity errors) Trip Point Hysteresis -55C TA +110C 3 C TA = +120C 4 C HYST = GND HYST = V+ VO = (-3.479 x 10-6 x (T - 30)2) + (-1.082 x 10-2 x (T - 30)) + 1.8015 V VTEMP Load Regulation VTEMP Line Regulation IS (1) (2) Supply Current C 2 C -10.82 VTEMP Output Temperature Sensitivity VTEMP Temperature Sensitivity Error to Equation: 11 mV/C -30C TA 120C 3 C -55C TA 120C, 3 C 2.5 C 4.5 V V+ 5.5 V TA = 30C Source 1 A 0.070 Sink 40 A +2.7 V V+ +5.5 V, -30C TA +120C TA = 25C mV 0.7 -0.2 16 mV mV/V 20 A 40 Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level). Typicals are at TJ = TA = 25C and represent most likely parametric norm. Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM26 5 LM26 SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 www.ti.com Electrical Characteristics (continued) The following specifications apply for V+ = 2.7 VDC to 5.5 VDC, and VTEMP load current = 0 A unless otherwise specified. All limits apply for TA = TJ = TMIN to TMAX unless otherwise specified. PARAMETER MIN (1) TEST CONDITIONS TYP (2) MAX (1) UNIT DIGITAL OUTPUT AND INPUT IOUT(1) Logical 1 Output Leakage Current (3) Logical 0 Output Voltage VOUT(1) Logical 1 Push-Pull Output Voltage VIH HYST Input Logical 1 Threshold Voltage VIL HYST Input Logical 0 Threshold Voltage (4) 0.001 IOUT = +1.2 mA and V+ 2.7 V; IOUT = +3.2 mA and V+ 4.5 V (4) VOUT(0) (3) V+ = +5.0 V TA = 25C ISOURCE = 500 A, V+ 2.7 V + ISOURCE = 800 A, V 4.5 V 1 A 0.4 V 0.8 x V+ V V+ - 1.5 V 0.8 x V+ V 0.2 x V+ V The 1-A limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the current for every 15C increase in temperature. For example, the 1-nA typical current at 25C would increase to 16 nA at 85C. Take care to include the effects of self heating when setting the maximum output load current. The power dissipation of the LM26 would increase by 1.28 mW when IOUT = 3.2 mA and VOUT = 0.4 V. With a thermal resistance of 250C/W, this power dissipation would cause an increase in the die temperature of about 0.32C due to self heating. Self heating is not included in the trip point accuracy specification. 7.6 Typical Characteristics 100 Supply Current (A) 80 60 40 20 0 60 40 20 0 20 40 60 80 Temperature (C) 100 120 140 C001 Figure 1. Power Supply Current Temperature Dependence 6 Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM26 LM26 www.ti.com SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 8 Detailed Description 8.1 Overview The LM26 is a factory preset thermostat (temperature switch) that includes an integrated temperature sensor, reference voltage, DAC and comparator. The LM26 can be factory programmed to have a trip point anywhere in the range of -55C to +120C. The output functionality can also be changed during the manufacturing process, as described in the functional block diagrams. Available options include: * OS: active low, open drain that indicates an over temperature shutdown event (most common) * US: active low, open-drain that indicates an under temperature shutdown event * OS: active high, push-pull that indicates an over temperature shutdown event * US: active high, push-pull that indicates an under temperature shutdown event The internal temperature sensor is brought out on the VTEMP pin and can be used to determine the temperature that the LM26 is reading by monitoring with an ADC. It has a negative temperature coefficient (NTC) of approximately -10mV/C. This pin also allows after assembly PCB testing (see section After Assembly PCB Testing for more details). The comparator hysteresis is selectable by the state of the HYST. Two values are available 10C or 2C. Comparator hysteresis is essential, as it prevents comparator output chattering when the temperature is at the comparator threshold set point (REF as shown in the functional block diagrams). Once the comparator trips the hysteresis function changes the comparator threshold (REF) level such that the output remains locked in the active state. The threshold is changed by either 10C or 2C as programmed by the state of the HYST pin. 8.2 Functional Block Diagrams HYST OS HYST REF GND TEMP SENSOR + + VTEMP V LM26__A Figure 2. LM26-_ _A Output Pin Block Diagram US HYST HYST REF GND TEMP SENSOR + + V VTEMP LM26__B Figure 3. LM26-_ _B Output Pin Block Diagram HYST HYST REF GND TEMP SENSOR VTEMP V+ OS + + V LM26__C Figure 4. LM26-_ _C Output Pin Block Diagram Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM26 7 LM26 SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 www.ti.com Functional Block Diagrams (continued) HYST US HYST REF V+ - GND TEMP SENSOR + + VTEMP V LM26__D Figure 5. LM26-_ _D Output Pin Block Diagram 8.3 Feature Description 8.3.1 Hysteresis The HYST pin level sets the comparator hysteresis. Setting the HYST pin to GND selects 10C hysteresis, while setting it to V+ selects 2C. A series resistor can be used for protection purposes. The input leakage current of the pin is less than 10 A. The value of the resistor will depend on the value of V+ as well as the leakage current. For example with V+ = 3.3 V the input threshold level for VIH = 0.8 x 3.3 V = 2.64 V, thus the voltage drop across the resistor should be less than 0.66 V. The 10-A input leakage current requires the resistor value to be less than 66 k. 8.3.2 VTEMP Output The VTEMP output provides an output voltage that can be used to determine the temperature reading of the LM26. The temperature reading of the LM26 can be calculated using the equation: VO = ( - 3.47 10-6 (T - 30)2 ) + (1.082 10-2 (T - 30)) + 1.8015 V (1) or T = -1525.04 + 2.4182 106 + 1.8015 - VTEMP 3.479 10-6 (2) The VTEMP output has very weak drive capability (1-A source, 40-A sink). So care should be taken when attaching circuitry to this pin. Capacitive loading may cause the VTEMP output to oscillate. Simply adding a resistor in series as shown in Figure 6 and Figure 7 will prevent oscillations from occurring. To determine the value of the resistor follow the guidelines given in Table 1. The same value resistor will work for either placement of the resistor. If an additional capacitive load is placed directly on the LM26 output, rather than across CLOAD, it should be at least a factor of 10 smaller than CLOAD. Table 1. Resistive Compensation for Capacitive Loading of VTEMP CLOAD 8 R () 100pF 0 1nF 8200 10nF 3000 100nF 1000 1F 430 Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM26 LM26 www.ti.com SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 Heavy Capacitive Load, Cable/Wiring HYST Heavy Capacitive Load, Cable/Wiring OS/OS/US/ US GND LM26 VTEMP HYST R V+ OS/OS/US/ US GND LM26 VTEMP V+ CLOAD R CLOAD 0.1Pf Figure 6. Resistor Placement for CapacitiveLoading Compensation of VTEMP With R in Series With Capacitor 0.1Pf Figure 7. Resistor Placement for CapacitiveLoading Compensation of VTEMP With R in Series With Signal Path 8.4 Device Functional Modes The LM26 after factory programming has two functional modes one with 2C Hysteresis and the other with 10C hysteresis as programmed by the level of the HYST pin. Selection of the level will depend on the system noise and the temperature transition rate. 8.4.1 After Assembly PCB Testing The LM26's VTEMP output allows after-assembly PCB testing by following a simple test procedure. Simply measuring the VTEMP output voltage will verify that the LM26 has been assembled properly and that its temperature sensing circuitry is functional. The VTEMP output has very weak drive capability that can be overdriven by 1.5mA. Therefore, one can simply force the VTEMP voltage to cause the digital output to change state, thereby verifying that the comparator and output circuitry function after assembly. Here is a sample test procedure that can be used to test the LM26CIM5-TPA which has an 85C trip point. 1. Turn on V+ and measure VTEMP. Then calculate the temperature reading of the LM26 using the equation: VO = ( - 3.47 10-6 (T - 30)2 ) + (1.082 10-2 (T - 30)) + 1.8015 V (3) or T = -1525.04 + 2.4182 106 + 1.8015 - VTEMP 3.479 10-6 (4) 2. Verify that the temperature measured in step one is within (3C + error of reference temperature sensor) of the ambient/board temperature. The ambient/board temperature (reference temperature) should be measured using an extremely accurate calibrated temperature sensor. 3. (a) Observe that OS is high. (b) Drive VTEMP to ground. (c) Observe that OS is now low. (d) Release the VTEMP pin. (e) Observe that OS is now high. 4. (a) Observe that OS is high. (b) Drive VTEMP voltage down gradually. (c) When OS goes low, note the VTEMP voltage. (d) VTEMPTrig = VTEMP at OS trigger (HIGH->LOW) (e) Calculate Trig using Equation 2. 5. (a) Gradually raise VTEMP until OS goes HIGH. Note VTEMP. (b) Calculate THYST using Equation 2. Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM26 9 LM26 SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The LM26 thermostat (temperature switch) can be used in applications such as microprocessor thermal management, appliances, fan control, industrial process control, power supplies for system protection, fan speed adjust or plain temperature monitoring. 9.2 Typical Application System Fan Sanyo Denki 109R0612T4H12 12V HYST OS GND LM26 VTEMP V+ +5V 10k 0.1Pf Figure 8. Two-Speed Fan Speed Control 9.2.1 Design Requirements The requirement is to change speed fo a fan to maximum at 45C with an accuracy of Table 2. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Min Fan Speed 1900 RPM Max Fan Speed 3800 RPM Temperature Threshold To Switch From Min Speed to Max Speed 45C Threshold accuracy 3C 9.2.2 Detailed Design Procedure The design procedure is simple. A fan was selected that has the capability to be controlled by an external NTC thermistor. The recommended NTC thermistor adjusts the fan speed to maximum at 40C. The LM26 meets the threshold accuracy requirements for temperature control of the fan speed and allows setting the max speed temperature threshold higher as required to 45C. The resistance of the thermistor for the min fan speed is 6.8 k. Since thermistors have a negative temperature coefficient (NTC), 10 k was chosen to ensure that the fan is at min speed when the LM26 OS is off. When the OS output goes low at 45C it simulates the low thermistor resistance at higher temperatures thus setting fan to max speed. 10 Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM26 LM26 www.ti.com SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 9.2.3 Application Curve VTEMP Output (Temp. of Leads) Trip Point Trip Point - Hysteresis OFF OS Fan Speed ON 3800 RPM 1900 RPM Figure 9. Temperature Effect on Fan Speed 9.3 System Examples 5V 12V HYST OS GND LM26 VTEMP V+ 1N4001 NDS356P R1 (100k) Vout TOYO USTF802512HW 1N4001 5V 0.1 HYST 5V Fan MC05J3 Comair-Rotron OS GND LM26 VTEMP V+ R1 (1k) 5V 0.1 Figure 10. Fan High-Side Drive Figure 11. Fan Low-Side Drive 5V 5V THERMALLY COUPLED +28V 8: HYST IC2 OS GND LM26 VTEMP V+ + - NDS356P 100k IC1 -28V LM3886 20k 1k 47k 3.3PF Audio Input 0.1Pf 1N4001 5V 10PF HYST OS GND LM26 VTEMP V+ 5V Fan MC05J3 Comair-Rotron Figure 12. Audio Power Amplifier Thermal Protection Heater Supply R1 (10k) Heater 0.1 5V Figure 13. Simple Thermostat Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM26 11 LM26 SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 www.ti.com 10 Power Supply Recommendations The LM26 has excellent power supply noise rejection. Listed below is a variety of signals used to test the LM26 power supply rejection. False triggering of the output was not observed when these signals where coupled into the V+ pin of the LM26. * square wave 400 kHz, 1 Vp-p * square wave 2 kHz, 200 mVp-p * sine wave 100 Hz to 1 MHz, 200 mVp-p Testing was done while maintaining the temperature of the LM26 one degree centigrade way from the trip point with the output not activated. 11 Layout 11.1 Layout Guidelines The LM26 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM26 is sensing will be within about +0.06C of the surface temperature to which the LM26's leads are attached to. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature measured would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity, the backside of the LM26 die is directly attached to the GND pin (pin 2). The temperatures of the lands and traces to the other leads of the LM26 will also affect the temperature that is being sensed. Alternatively, the LM26 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM26 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM26 or its connections. 11.2 Layout Example VIA to ground plane VIA to power plane R only required for open-drain R is optional maybe directly connected to GND or V + OS, OS, US, US HYST GND + VTEMP V 0.1 F Figure 14. LM26 Typical Layout 12 Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM26 LM26 www.ti.com SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 11.3 Thermal Considerations The junction to ambient thermal resistance (RJA) is the parameter used to calculate the rise of a part's junction temperature due to its power dissipation. For the LM26 the equation used to calculate the rise in the die junction temperature is as follows: TJ = TA + QJA (V + - VTEMP )IL _ TEMP + VDOIDO ) where * * * * TA is the ambient temperature, V+ is the power supply voltage IQ is the quiescent current, IL_TEMP is the load current on the VTEMP output VDO is the voltage on the digital output and IDO is the load current on the digital output (5) Since the LM26's junction temperature is the actual temperature being measured, care should be taken to minimize the load current that the LM26 is required to drive. Table 3 summarizes the thermal resistance for different conditions and the rise in die temperature of the LM26 without any loading on VTEMP and a 10-k pullup resistor on an open-drain digital output with a 5.5-V power supply. Table 3. Thermal resistance (RJA) and Temperature Rise Due to Self Heating (TJ-TA) SOT-23 5 pin no heat sink RJA (C/W) TJ-TA (C) Still Air 250 0.11 Moving Air TBD TBD Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM26 13 LM26 SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 www.ti.com 11.4 Part Number Template The series of digits labeled xyz in the part number LM26CIM-xyz, describe the set point value and the function of the output as follows: The place holders xy describe the set point temperature as shown in the following table. x (10x) y (1x) Temperature (C) A - -5 B - -4 C - -3 D - -2 E - -1 F - -0 H H 0 J J 1 K K 2 L L 3 N N 4 P P 5 R R 6 S S 7 T T 8 V V 9 X - 10 Y - 11 Z - 12 The value of z describes the assignment/function of the output as shown in the following table: Active-Low/High Open-Drain/ PushPull OS/US Value of z 0 0 0 A Active-Low, Open-Drain, OS output 0 0 1 B Active-Low, Open-Drain, US output 1 1 0 C Active-High, Push-Pull, OS output 1 1 1 D Active-High, Push-Pull, US output Digital Output Function For example: * the part number LM26CIM5-TPA has TOS = 85C, and programmed as an active-low open-drain overtemperature shutdown output. * the part number LM26CIM5-FPD has TUS = -5C, and programmed as an active-high, push-pull undertemperature shutdown output. Active-high open-drain and active-low push-pull options are available, please contact Texas Instruments for more information. 14 Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM26 LM26 www.ti.com SNIS115S - MAY 2001 - REVISED SEPTEMBER 2015 12 Device and Documentation Support 12.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.2 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.4 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 2001-2015, Texas Instruments Incorporated Product Folder Links: LM26 15 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM26CIM5-BPB/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM LM26CIM5-DPB/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TDPB LM26CIM5-HHD/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 THHD LM26CIM5-NPA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TNPA LM26CIM5-PHA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TPHA LM26CIM5-RPA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TRPA LM26CIM5-SHA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TSHA LM26CIM5-SPA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TSPA LM26CIM5-TPA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TTPA LM26CIM5-VHA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TVHA LM26CIM5-VPA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TVPA LM26CIM5-XHA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TXHA LM26CIM5-XPA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TXPA LM26CIM5-YHA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TYHA LM26CIM5-YPA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TYPA LM26CIM5-ZHA NRND SOT-23 DBV 5 1000 Non-RoHS & Non-Green Call TI Call TI -55 to 125 TZHA LM26CIM5-ZHA/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TZHA LM26CIM5X-DPB/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TDPB LM26CIM5X-HHD/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 THHD LM26CIM5X-NPA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TNPA Addendum-Page 1 TBPB Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 10-Dec-2020 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM26CIM5X-PHA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TPHA LM26CIM5X-SPA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TSPA LM26CIM5X-TPA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TTPA LM26CIM5X-VHA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TVHA LM26CIM5X-VPA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TVPA LM26CIM5X-XHA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TXHA LM26CIM5X-XPA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TXPA LM26CIM5X-YHA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TYHA LM26CIM5X-YPA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TYPA LM26CIM5X-ZHA/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 TZHA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LM26CIM5-BPB/NOPB SOT-23 DBV 5 1000 178.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-DPB/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-HHD/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-NPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-PHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-RPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-SHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-SPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-TPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-VHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-VPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-XHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-XPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-YHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-YPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-ZHA SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5-ZHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5X-DPB/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM26CIM5X-HHD/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5X-NPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5X-PHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5X-SPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5X-TPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5X-VHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5X-VPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5X-XHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5X-XPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5X-YHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5X-YPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM26CIM5X-ZHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM26CIM5-BPB/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-DPB/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-HHD/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-NPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-PHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM26CIM5-RPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-SHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-SPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-TPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-VHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-VPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-XHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-XPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-YHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-YPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-ZHA SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5-ZHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM26CIM5X-DPB/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-HHD/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-NPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-PHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-SPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-TPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-VHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-VPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-XHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-XPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-YHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-YPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM26CIM5X-ZHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 Pack Materials-Page 3 PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 1.75 1.45 PIN 1 INDEX AREA 1 0.1 C B A 5 2X 0.95 1.9 1.45 0.90 3.05 2.75 1.9 2 4 0.5 5X 0.3 0.2 3 (1.1) C A B 0.15 TYP 0.00 0.25 GAGE PLANE 8 TYP 0 0.22 TYP 0.08 0.6 TYP 0.3 SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MIN ARROUND 0.07 MAX ARROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X(0.95) 4 3 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. 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