REGULATORY COMPLIANCE (Data Sheet downloaded on Nov 29, 2017)
2011/65 +
2015/863 174 SVHC
EQRE13F2J-125.000M TR
ITEM DESCRIPTION
Quartz Crystal Clock Oscillators XO (SPXO) LVDS (DS) 3.3Vdc 6 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)
125.000MHz ±50ppm over -20°C to +70°C
ELECTRICAL SPECIFICATIONS
Nominal Frequency 125.000MHz
Frequency Tolerance/Stability ±50ppm Maximum over -20°C to +70°C (Inclusive of all conditions: Calibration Tolerance (at 25°C), Frequency Stability
over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,
Shock, and Vibration)
Aging at 25°C ±3ppm Maximum First Year
Supply Voltage 3.3Vdc ±5%
Input Current 30mA Maximum
Output Voltage Logic High (Voh) 1.43Vdc Typical, 1.6Vdc Maximum
Output Voltage Logic Low (Vol) 1.1Vdc Typical, 0.9Vdc Minimum
Differential Output Error (dVod) 50mV Maximum
Differential Output Voltage (Vod) 247mV Minimum, 330mV Typical, 454mV Maximum
Offset Voltage (Vos) 1.125V Minimum, 1.250V Typical, 1.375V Maximum
Rise/Fall Time 400pSec Maximum (Measured at 20% to 80% of Waveform)
Duty Cycle 50 ±5(%) (Measured at 50% of Waveform)
Offset Error (dVos) 50mV Maximum
Load Drive Capability 100 Ohms Between Output and Complementary Output
Output Logic Type LVDS
Phase Noise All Values are Typical
-50dBc/Hz at 10Hz Offset
-82dBc/Hz at 100Hz Offset
-116dBc/Hz at 1kHz Offset
-138dBc/Hz at 10kHz Offset
-144dBc/Hz at 100kHz Offset
-149dBc/Hz at 1MHz Offset
-155dBc/Hz at 10MHz Offset
-155dBc/Hz at 20MHz Offset
Output Control Function Standby (on Pad 1)
Output Control Input Voltage Logic
High (Vih) 70% of Vdd Minimum or No Connect to Enable Output and Complementary Output
Output Control Input Voltage Logic
Low (Vil) 30% of Vdd Maximum to Disable Output and Complementary Output (High Impedance)
Standby Output Enable Time 10mSec Maximum
Standby Output Disable Time 200nSec Maximum
Standby Current 10µA Maximum (Without Load)
RMS Phase Jitter 200fSec Maximum (Fj=12kHz to 20MHz (Random))
Period Jitter (Deterministic) 0.2pSec Typical
Period Jitter (Random) 1.0pSec Typical
Period Jitter (One Sigma) 1.5pSec Typical
Period Jitter (tp-p) 40pSec Maximum
Start Up Time 10mSec Maximum
Storage Temperature Range -55°C to +125°C
www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 1 of 8
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
EQRE13F2J-125.000M TR
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Flammability UL94-V0
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity J-STD-020, MSL 1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010, Condition B
Vibration MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 2 of 8
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
EQRE13F2J-125.000M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
MARKING
ORIENTATION
5.00
±0.20
7.00
±0.20 5.08
±0.15
2.54
TYP
1.2 ±0.2
2.60 ±0.15
1
2
3
4
5
6
1.4
±0.1
1.80
±0.10
PIN CONNECTION
1 Standby
2 No Connect
3 Case Ground
4 Output
5 Complementary Output
6 Supply Voltage
LINE MARKING
1ECLIPTEK
2125.00M
3XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X6)
All Dimensions in Millimeters
0.54 (X4)
1.89
1.80 (X6)
2.00 (X6)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 3 of 8
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
EQRE13F2J-125.000M TR
OUTPUT STANDBY
(HIGH IMPEDANCE
STATE)
OUTPUT WAVEFORM & TIMING DIAGRAM
VOH
VOL
80%
50%
20%
Fall
Time
Rise
Time TW
T
Duty Cycle (%) = TW/T x 100
VIH
VIL
tPLZ tPZL
CLOCK OUTPUTS TRI-STATE INPUT
Q
Q
VOD VOS
www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 4 of 8
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
EQRE13F2J-125.000M TR
Output
Supply
Voltage
(VDD)
Ground
Power
Supply Voltage
Meter
Current
Meter
0.01µF
(Note 1)
0.1µF
(Note 1)
Power
Supply No
Connect
Switch
Complementary
Output
Standby
Oscilloscope Frequency
Counter
Probe 2
(Note 2) Probe 1
(Note 2)
Test Circuit for Standby (Pad 1) and Complementary Output
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm)
to the package ground and supply voltage pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is
recommended.
Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.
100 Ohms
www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 5 of 8
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET
Tape & Reel Dimensions
All Dimensions in Millimeters
Compliant to EIA-481
DIA 50 MIN
DIA 20.20 MIN
DIA 13.00 ±0.20
2.50 MIN Width
10 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.50 MIN
Direction of Unreeling
MARKING
ORIENTATION
EQRE13F2J-125.000M TR
16.00 ±0.30
7.50 ±0.10
DIA 1.50 MIN
4.00 ±0.10
2.00 ±0.10
8.00 ±0.10 A0
DIA 1.50 +0.10/-0.00
1.75 ±0.10
B0
0.60 MAX
0.10 MAX
K0
22.40 MAX
Quantity Per Reel: 1,000 units
360 MAX
16.40 +2.00/-0.00
www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 6 of 8
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
EQRE13F2J-125.000M TR
Recommended Solder Reflow Methods
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/Second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 Seconds
Ramp-down Rate 6°C/Second Maximum
Time 25°C to Peak Temperature (t) 8 Minutes Maximum
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 7 of 8
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
EQRE13F2J-125.000M TR
Recommended Solder Reflow Methods
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/Second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 2 Times / 230°C Maximum 1 Time
Time within 5°C of actual peak (tp)10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
Ramp-down Rate 5°C/Second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures listed are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures listed are applied to body of device.)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 8 of 8
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
