EQRE13F2J-125.000M TR REGULATORY COMPLIANCE (Data Sheet downloaded on Nov 29, 2017) 2011/65 + 2015/863 174 SVHC ITEM DESCRIPTION Quartz Crystal Clock Oscillators XO (SPXO) LVDS (DS) 3.3Vdc 6 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) 125.000MHz 50ppm over -20C to +70C ELECTRICAL SPECIFICATIONS Nominal Frequency 125.000MHz Frequency Tolerance/Stability 50ppm Maximum over -20C to +70C (Inclusive of all conditions: Calibration Tolerance (at 25C), Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25C, Shock, and Vibration) Aging at 25C 3ppm Maximum First Year Supply Voltage 3.3Vdc 5% Input Current 30mA Maximum Output Voltage Logic High (Voh) 1.43Vdc Typical, 1.6Vdc Maximum Output Voltage Logic Low (Vol) 1.1Vdc Typical, 0.9Vdc Minimum Differential Output Error (dVod) 50mV Maximum Differential Output Voltage (Vod) 247mV Minimum, 330mV Typical, 454mV Maximum Offset Voltage (Vos) 1.125V Minimum, 1.250V Typical, 1.375V Maximum Rise/Fall Time 400pSec Maximum (Measured at 20% to 80% of Waveform) Duty Cycle 50 5(%) (Measured at 50% of Waveform) Offset Error (dVos) 50mV Maximum Load Drive Capability 100 Ohms Between Output and Complementary Output Output Logic Type LVDS Phase Noise All Values are Typical -50dBc/Hz at 10Hz Offset -82dBc/Hz at 100Hz Offset -116dBc/Hz at 1kHz Offset -138dBc/Hz at 10kHz Offset -144dBc/Hz at 100kHz Offset -149dBc/Hz at 1MHz Offset -155dBc/Hz at 10MHz Offset -155dBc/Hz at 20MHz Offset Output Control Function Standby (on Pad 1) Output Control Input Voltage Logic High (Vih) 70% of Vdd Minimum or No Connect to Enable Output and Complementary Output Output Control Input Voltage Logic Low (Vil) 30% of Vdd Maximum to Disable Output and Complementary Output (High Impedance) Standby Output Enable Time 10mSec Maximum Standby Output Disable Time 200nSec Maximum Standby Current 10A Maximum (Without Load) RMS Phase Jitter 200fSec Maximum (Fj=12kHz to 20MHz (Random)) Period Jitter (Deterministic) 0.2pSec Typical Period Jitter (Random) 1.0pSec Typical Period Jitter (One Sigma) 1.5pSec Typical Period Jitter (tp-p) 40pSec Maximum Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 1 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EQRE13F2J-125.000M TR ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 2 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EQRE13F2J-125.000M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 5.00 0.20 1.80 0.10 2.60 0.15 1.2 0.2 MARKING ORIENTATION 7.00 0.20 2.54 TYP 5.08 0.15 6 1 5 2 4 3 PIN CONNECTION 1 Standby 2 No Connect 3 Case Ground 4 Output 5 Complementary Output 6 Supply Voltage LINE MARKING 1.4 0.1 1 ECLIPTEK 2 125.00M 3 XXXXX XXXXX=Ecliptek Manufacturing Identifier Suggested Solder Pad Layout All Dimensions in Millimeters 1.80 (X6) 2.00 (X6) 0.54 (X4) 1.89 Solder Land (X6) All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 3 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EQRE13F2J-125.000M TR CLOCK OUTPUTS TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% Q 50% VOD 20% VOL OUTPUT STANDBY (HIGH IMPEDANCE STATE) VOS Q tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 4 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EQRE13F2J-125.000M TR Test Circuit for Standby (Pad 1) and Complementary Output Frequency Counter Oscilloscope Current Meter Switch 0.01F (Note 1) Supply Voltage (VDD) 0.1F (Note 1) Probe 2 (Note 2) Probe 1 (Note 2) 100 Ohms Complementary Output Output Ground Power Supply Voltage Meter Power Supply Standby No Connect Note 1: An external 0.01F ceramic bypass capacitor in parallel with a 0.1F high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is recommended. Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms. www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 5 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EQRE13F2J-125.000M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units All Dimensions in Millimeters Compliant to EIA-481 4.00 0.10 0.60 MAX DIA 1.50 +0.10/-0.00 0.10 MAX 2.00 0.10 1.75 0.10 7.50 0.10 MARKING ORIENTATION 16.00 0.30 DIA 1.50 MIN 8.00 0.10 B0 A0 K0 Direction of Unreeling 1.50 MIN 22.40 MAX DIA 40 MIN Access Hole at Slot Location 360 MAX DIA 50 MIN DIA 20.20 MIN DIA 13.00 0.20 2.50 MIN Width 10 MIN Depth Tape slot in Core for Tape Start 16.40 +2.00/-0.00 www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 6 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EQRE13F2J-125.000M TR Recommended Solder Reflow Methods High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3C/Second Maximum 150C 175C 200C 60 - 180 Seconds 3C/Second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 Seconds 6C/Second Maximum 8 Minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 7 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EQRE13F2J-125.000M TR Recommended Solder Reflow Methods Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5C/Second Maximum N/A 150C N/A 60 - 120 Seconds 5C/Second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 2 Times / 230C Maximum 1 Time 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time 5C/Second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures listed are applied to body of device.) High Temperature Manual Soldering 260C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures listed are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Revision C 06/25/2014 | Page 8 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200