HS1AFL - HS1MFL
Taiwan Semiconductor
1 Version:A1804
1A, 50V - 1000V High Efficient Surface Mount Rectifier
FEATURES
● Glass passivated junction chip
● Ideal for automated placement
● Low profile package
● Low power loss, high efficiency
● Fast switching for high efficiency
● Moisture sensitivity level: level 1, per J-STD-020
● Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
● Halogen-free according to IEC 61249-2-21
APPLICATIONS
● High frequency rectification
● Freewheeling application
● Switching mode converters and inverters in computer
and telecommunication.
MECHANICAL DATA
● Case: SOD-123FL
● Molding compound meets UL 94V-0 flammability rating
● Terminal: Matte tin plated leads, solderable per J-STD-002
● Meet JESD 201 class 1A whisker test
● Polarity: As marked
● Weight: 0.019 g (approximately)
KEY PARAMETERS
PARAMETER
VALUE
UNIT
IF
1
A
VRRM
50 - 1000
V
IFSM
30
A
TJ MAX
150
°C
Package
SOD-123FL
SOD-123FL
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
HS1A
FL
HS1B
FL
HS1D
FL
HS1F
FL
HS1G
FL
HS1J
FL
HS1K
FL
HS1M
FL
UNIT
Marking code on the
device
HAF
HBF
HDF
HFF
HGF
HJF
HKF
HMF
Repetitive peak reverse
voltage
VRRM
50
100
200
300
400
600
800
1000
V
Reverse voltage, total rms
value
VR(RMS)
35
70
140
210
280
420
560
700
V
Forward current
IF
1
A
Surge peak forward
current, 8.3 ms single half
sine-wave superimposed
on rated load per diode
IFSM
30
A
Junction temperature
TJ
- 55 to +150
°C
Storage temperature
TSTG
- 55 to +150
°C
HS1AFL - HS1MFL
Taiwan Semiconductor
2 Version:A1804
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TYP.
UNIT
Junction-to-lead thermal resistance per diode
RӨJL
17
°C/W
Junction-to-ambient thermal resistance per diode
RӨJA
85
°C/W
Junction-to-case thermal resistance per diode
RӨJC
19
°C/W
Thermal Performance Note: Units mounted on PCB (5mm x 5mm Cu pad test board)
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
CONDITIONS
SYMBOL
TYP.
MAX.
UNIT
Forward voltage per diode (1)
HS1AFL
HS1BFL
HS1DFL
HS1FFL
IF = 0.5A, TJ = 25°C
VF
0.82
-
V
IF = 1.0A, TJ = 25°C
0.89
0.95
V
IF = 0.5A, TJ = 125°C
0.67
-
V
IF = 1.0A, TJ = 125°C
0.75
0.81
V
Forward voltage per diode (1)
HS1GFL
IF = 0.5A, TJ = 25°C
VF
0.93
-
V
IF = 1.0A, TJ = 25°C
1.01
1.30
V
IF = 0.5A, TJ = 125°C
0.74
-
V
IF = 1.0A, TJ = 125°C
0.85
1.10
V
Forward voltage per diode (1)
HS1JFL
HS1KFL
HS1MFL
IF = 0.5A, TJ = 25°C
VF
1.21
-
V
IF = 1.0A, TJ = 25°C
1.36
1.70
V
IF = 0.5A, TJ = 125°C
0.94
-
V
IF = 1.0A, TJ = 125°C
1.10
1.38
V
Reverse current @ rated VR per diode (2)
TJ = 25°C
IR
-
5
µA
TJ = 125°C
-
150
µA
Junction capacitance
HS1AFL
HS1BFL
HS1DFL
HS1FFL
HS1GFL
1 MHz, VR=4.0V
CJ
11
-
pF
HS1JFL
HS1KFL
HS1MFL
6
-
pF
Reverse recovery time
HS1AFL
HS1BFL
HS1DFL
HS1FFL
HS1GFL
IF=0.5A ,IR=1.0A
IRR=0.25A
trr
-
50
ns
HS1JFL
HS1KFL
HS1MFL
trr
-
75
ns
Notes:
1. Pulse test with PW=0.3 ms
2. Pulse test with PW=30 ms
HS1AFL - HS1MFL
Taiwan Semiconductor
3 Version:A1804
ORDERING INFORMATION
ORDERING CODE
PACKAGE
PACKING
HS1AFL RVG
SOD-123FL
3,000 / 7" Plastic reel
HS1BFL RVG
SOD-123FL
3,000 / 7" Plastic reel
HS1DFL RVG
SOD-123FL
3,000 / 7" Plastic reel
HS1FFL RVG
SOD-123FL
3,000 / 7" Plastic reel
HS1GFL RVG
SOD-123FL
3,000 / 7" Plastic reel
HS1JFL RVG
SOD-123FL
3,000 / 7" Plastic reel
HS1KFL RVG
SOD-123FL
3,000 / 7" Plastic reel
HS1MFL RVG
SOD-123FL
3,000 / 7" Plastic reel
HS1AFL - HS1MFL
Taiwan Semiconductor
4 Version:A1804
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
Fig.2 Typical Junction Capacitance
Fig.3 Typical Reverse Characteristics
Fig.4 Typical Forward Characteristics
0
0.5
1
1.5
25 50 75 100 125 150
Heat sink
5mm x 5mm
Cu pad test board
0.1
1
10
100
110 100
f=1.0MHz
Vsig=50mVp-p
HS1JFL - HS1MFL
HS1AFL - HS1GFL
0.001
0.01
0.1
1
10 20 30 40 50 60 70 80 90 100
TJ=25°C
TJ=125°C
HS1AFL - HS1FFL
0.1
1
10
0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4
Pulse width 300μs
1% duty cycle
TJ=25°C
TJ=125°C
HS1AFL - HS1FFL
CAPACITANCE (pF)
INSTANTANEOUS REVERSE CURRENT (μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
INSTANTANEOUS FORWARD CURRENT (A)
(A)
0.001
0.01
0.1
1
10
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
Pulse width
TJ=25°C
TJ=125°C
UF1DLW
FORWARD VOLTAGE (V)
AVERAGE FORWARD CURRENT (A)
REVERSE VOLTAGE (V)
LEAD TEMPERATURE (°C)
HS1AFL - HS1MFL
Taiwan Semiconductor
5 Version:A1804
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.5 Typical Reverse Characteristics
Fig.6 Typical Forward Characteristics
Fig.7 Typical Reverse Characteristics
Fig.8 Typical Forward Characteristics
0.001
0.01
0.1
1
10
10 20 30 40 50 60 70 80 90 100
TJ=125°C
TJ=25°C
HS1GFL
0.1
1
10
0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9
HS1GFL
Pulse width 300μs
1% duty cycle
TJ=25°C
TJ=125°C
0.01
0.1
1
10
100
10 20 30 40 50 60 70 80 90 100
TJ=125°C
HS1JFL - HS1MFL
TJ=25°C
0.1
1
10
0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4
Pulse width 300μs
1% duty cycle
TJ=25°C
TJ=125°C
INSTANTANEOUS REVERSE CURRENT (μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
INSTANTANEOUS FORWARD CURRENT (A)
(A)
0.001
0.01
0.1
1
10
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
Pulse width
TJ=25°C
TJ=125°C
UF1DLW
FORWARD VOLTAGE (V)
HS1JFL - HS1MFL
INSTANTANEOUS REVERSE CURRENT (μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
INSTANTANEOUS FORWARD CURRENT (A)
(A)
0.001
0.01
0.1
1
10
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
Pulse width
TJ=25°C
TJ=125°C
UF1DLW
FORWARD VOLTAGE (V)
HS1AFL - HS1MFL
Taiwan Semiconductor
6 Version:A1804
PACKAGE OUTLINE DIMENSIONS
SOD-123FL
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
P/N = Marking Code
YW = Date Code
F = Factory Code
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
0.80
1.15
0.031
0.045
B
1.70
2.10
0.067
0.083
C
2.60
3.10
0.102
0.122
D
0.88
1.35
0.035
0.053
E
0.10
0.30
0.004
0.012
F
0.30
0.90
0.012
0.035
G
3.45
3.95
0.136
0.156
Symbol
Unit (mm)
Unit (inch)
A
1.4
0.055
B
1.2
0.047
C
3.1
0.122
D
1.9
0.075
E
4.3
0.169
HS1AFL - HS1MFL
Taiwan Semiconductor
7 Version:A1804
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
