SKAI 45 A2 GD12-W12DI
© by SEMIKRON Rev. 6 20.04.2011 1
HV SKAI 2
HV SKAI 2
Three-phase IGBT inverter
SKAI 45 A2 GD12-W12DI
Target Data
Features
•Optimized for HEV and EV
high power density
high overload capability
Compact integration in IP67 Enclosure:
V, I, T sensors
Gate driver with protection features
EMI filters
Liquid cooling
DC link capacitor
Typical Applications*
commercial application vehicle
hybrid vehicle
battery driven vehicle
No. 14282015
Characteristics
Symbol Conditions min. typ. max. Unit
Electrical Data
Visol DC, t = 1 s 4000 V
VCC DC supply voltage 750 800 V
Inom
rms @ rated conditions: dV/dt = 10l/
min, 50% Glykol/ 50% H20, fsw = 4kHz,
VCC = 750V, Vout = 400V, fout = 50Hz,
cos(phi) = 0.85, M = 0.87,
Tcoolant =6C, T
air =6C
300 A
fsw Switching frequency 1 20 kHz
CDC DC Bus Capacitance 0.9 1.25 mF
CyEMI Capacitor; DC to enclosure 0.66 µF
RFDC+ to enclosure, DC- to enclosure 7.5 M
RBL DC+ to DC- 1 M
Mechanical Data
Weight 15 kg
Height 109 mm
Width 244 mm
Length 475 mm
MtAC / DC terminals (M8 screw) 13 14 15 Nm
Mc
Cover of terminal box (M5x16
flat-head-screw) 3.5 4 4.5 Nm
Mcg AC / DC cable glands (recommended) 10 Nm
MeAssembly of
e n c l o s u r e ;
thread (l): > 15mm
M8 screw 20 Nm
M6 screw 14 Nm
Mgnd Ground connection 13 14 15 Nm
Hydraulical Data
dp Pressure drop@ 10l/min,
Tcoolant = 25°C 100 mbar
p Operating pressure 2 bar
PPower dissipation to coolant; rated
conditions 2.4 kW
Environmental Data
Tstg storage temperature -40 85 °C
Tno Non operating temperature range -40 105 °C
Tair
Operating range, derating for
Tair > 85°C -40 105 °C
Tcoolant
O p e r a t i n g r a n g e , d e r a t i n g f o r
Tcoolant > 65°C -40 75 °C
IP Enclosure protection level IP67
With external connector protection IP6K9K
Altitude Vcc = 800 V 2000 m
SKAI 45 A2 GD12-W12DI
2 Rev. 6 20.04.2011 © by SEMIKRON
HV SKAI 2
HV SKAI 2
Three-phase IGBT inverter
SKAI 45 A2 GD12-W12DI
Target Data
Features
•Optimized for HEV and EV
high power density
high overload capability
Compact integration in IP67 Enclosure:
V, I, T sensors
Gate driver with protection features
EMI filters
Liquid cooling
DC link capacitor
Typical Applications*
commercial application vehicle
hybrid vehicle
battery driven vehicle
No. 14282015
Characteristics
Symbol Conditions min. typ. max. Unit
Interface parameters
VsAuxiliary supply voltage primary side 8 12 16 V
ISO
Auxiliary supply current primary side
without driving a gate (Vs = 12 V) 900 mA
IS
Auxiliary supply current primary side,
driving the gates (Vs = 12 V) 1740 mA
ViH Input signal voltage (HIGH) 0.7 * Vs Vs + 0.3 V
ViL Input signal voltage (LOW) GND - 0.3 0.3 * Vs V
tPOR Power-on reset completed 0.1 0.9 s
tpRESET Error reset time 3 s
Controller switching parameters
td(on)IO Input-output turn-on propagation time 0.5 0.6 µs
td(off)IO Input-output turn-off propagation time 0.5 0.6 µs
tjitter Signal transfer prim - sec (total jitter) 50 ns
tSIS Short pulse suppression time 0.2 0.25 0.3 µs
tet Input impulse extension time 0.9 1 1.1 µs
td(err)DSCP
Error input-output propagation time for
DSCP error 0.2 1 µs
td(err)OCP
Error input-output propagation time for
OCP error 410µs
td(err)TMP
Error input-output propagation time for
temperature error 50 ms
tTD Top-Bot interlock dead time 4 4.1 µs
tbl VCE monitoring blanking time 5 5.1 µs
Protection functions
TPCBtrip
Over temperature protection trip level
(PCB) 100 °C
TCStrip
Over temperature protection trip level
on ceramic-substrate 120 °C
TRelPCBtrip
Release temperature for PCB
overtemperature trip level 90 °C
TRelCStrip
Release temperature for ceramic
substrate overtemperature trip level 85 °C
VDCtrip DC-Link voltage trip level 800 V
VVStrip
Under voltage protection trip level of
board primary side 7V
VVSrst
Threshold voltage level for driver reset
after failure event 8V
ITRIPSC Overcurrent trip level 567 APEAK
Ioutsens AC sensing range -616 616 A
mIoutsens Gradient of output current sensing 16.2 16.695 17.205 mV/A
BWIoutsens Bandwidth (3 dB) of AC current sensing 17 kHz
VDCsens Measurable DC-link-voltage 0 1000 V
mVDCsens Gradient of DC-link voltage sensing 9.835 10.034 10.236 mV/V
BWVDCsens
Bandwidth (3 dB) of DC-link voltage
sensing 0.25 kHz
TCSsens
Temperature sensing range on ceramic
substrate 30 150 °C
mTCSsens
Gradient of temperature sensing on
ceramic-substrate 83.3 mV/°C
BWTCSsens
Bandwidth of temperature sensing on
ceramic-substrate 100 Hz
SKAI 45 A2 GD12-W12DI
© by SEMIKRON Rev. 6 20.04.2011 3
Signal Connector
PIN Signal Function Specifications
X1:01 PWR_VP INPUT
Auxiliary power supply / battery “+”
Supply voltage Vs
X1:02 PWR_GND Auxiliary power supply ground Ground of auxiliary power supply
X1:03 DC_LINK_DISCHAR
GE
INPUT HIGH, NOT CONNECTED (n.c.) or module
not supplied with Auxiliary power = DC Link
discharge active
LOW = DC Link discharge disabled
(internal pull-up resistor, external pull-up
resistor required as well)
X1:04 CMN_HALT INPUT/OUTPUT All connected units have to change the signal
mode to „dominant“ if following happens:
The unit is not ready to operate
Error happened
All connected units must be able to process
(read) the signal. In case of recognised
dominant signal, following steps need to be
performed:
The unit must be switched to a defined safe
operation mode
The unit must interrupt the main process unitl
a recessive signal has been recognised
LOW (dominant) = not ready to operate
HIGH (recessive) = ready to operate
X1:05 CMN_TEMP_GND Ground for temperature sensor signal
CMN_TEMP
Internally connected to PWR_GND
X1:06 HB1_TOP INPUT
Switching PWM signal [push/pull]
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:07 HB1_BOT INPUT
Switching PWM signal [push/pull]
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:08 HB2_TOP INPUT
Switching PWM signal [push/pull]
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:09 HB2_BOT INPUT
Switching PWM signal [push/pull]
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:10 HB3_TOP INPUT
Switching PWM signal [push/pull]
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:11 HB3_BOT INPUT
Switching PWM signal [push/pull]
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:12 CAN_GND GND Ground of CAN bus
SKAI 45 A2 GD12-W12DI
4 Rev. 6 20.04.2011 © by SEMIKRON
X1:13 PWR_VP INPUT
Auxiliary power supply / battery “+”
Supply voltage Vs
X1:14 PWR_GND Auxiliary power supply ground Ground of auxiliary power supply
X1:15 CMN_GND Ground for CMN_DIAG, CMN_HALT,
CMN_GPIO
Internally connected to PWR_GND
X1:16 CMN_TEMP OUTPUT
Temperature sensor signal CMN_TEMP
This pin is used to transmit the temperature
sensor analog signal.
Max. output current: 5 mA
Nominal voltage range: 0…10 V
X1:17 Reserved
X1:18 HB1_GND Ground for HB1_TOP, HB1_BOT Internally connected to PWR_GND
X1.19 Reserved
X1:20 HB2_GND Ground for HB2_TOP, HB2_BOT Internally connected to PWR_GND
X1:21 Reserved
X1:22 HB3_GND Ground for HB3_TOP, HB3_BOT Internally connected to PWR_GND
X1:23 CAN_L INPUT/OUTPUT
CAN interface LOW line
Input impedance = 121
Specification:
ISO 11783 (2.5V, 250 kbit/sec minimum,
quad twisted cable) or J1939/11 (250 kbit/sec
minimum, twisted shielded pair).
X1:24 PWR_VP INPUT
Auxiliary power supply / battery “+”
Supply voltage Vs
X1:25 PWR_GND Auxiliary power supply ground Ground of auxiliary power supply
X1:26 CMN_DIAG INPUT/OUTPUT
Single line CAN communication
[dominant/recessive]
Dominant/Recessive diagnose input/output
signal. All connected units can communicate
using this serial signal for setting/getting
parameters of the unit and reading error
information from unit registers.
X1:27 CMN_DCL OUTPUT
DC-Link voltage signal
[analog]
This pin is used to transmit the DC-Link
voltage level.
Max. output current: 5 mA
Nominal voltage range: 0….+10 V
Bandwidth 3dB = 250Hz at load resistance of
2k
X1:28 CMN_DCL_GND Ground for DC-Link voltage signal CMN_DCL Internally connected to PWR_GND
X1:29 HB1_I OUTPUT
Current sensor out for HB1
[analog]
Max. output current: 5 mA
Nominal voltage range: -10 … +10 V
Bandwidth (3dB) = 17kHz at load resistance
of 2k;
(18kHz at load resistance of 10k)
X1:30 HB1_I_GND Ground for HB1_I Internally connected to PWR_GND
PIN Signal Function Specifications
SKAI 45 A2 GD12-W12DI
© by SEMIKRON Rev. 6 20.04.2011 5
Power Connectors
Coolant fittings
X1:31 HB2_I OUTPUT
Current sensor out for HB2
[analog]
Max. output current: 5 mA
Nominal voltage range: -10 … +10 V
Bandwidth (3dB) = 17kHz at load resistance
of 2k;
(18kHz at load resistance of 10k)
X1:32 HB2_I_GND Ground for HB2_I Internally connected to PWR_GND
X1:33 HB3_I OUTPUT
Current sensor out for HB3
[analog]
Max. output current: 5 mA
Nominal voltage range: -10 … +10 V
Bandwidth (3dB) = 17kHz at load resistance
of 2k;
(18kHz at load resistance of 10k)
X1:34 HB3_I_GND Ground for HB3_I Internally connected to PWR_GND
X1:35 CAN_H INPUT/OUTPUT
CAN interface HIGH line
Input impedance = 121
Specification:
ISO 11783 (2.5V, 250 kbit/sec minimum,
quad twisted cable) or J1939/11 (250 kbit/sec
minimum, twisted shielded pair).
Terminal Function cable harness cross section Cu / mm²
DC+ HVDC Bus "+" 70
DC- HVDC Bus "-" 70
L1 Phase L1 70
L2 Phase L2 70
L3 Phase L3 70
Terminal Function
IN Coolant Inlet
OUT Coolant Outlet
PIN Signal Function Specifications
SKAI 45 A2 GD12-W12DI
6 Rev. 6 20.04.2011 © by SEMIKRON
Fig. 1: Normalized output current vs. cos(phi) Fig. 2: Normalized output current vs. coolant
temperature
Fig. 3: Normalized output current vs. ambient
temperature Fig. 4: Normalized output current vs. coolant flow
Fig. 5: Overload capability Fig. 6: Legend
SKAI 45 A2 GD12-W12DI
© by SEMIKRON Rev. 6 20.04.2011 7
Fig. 7: Pressure drop characteristic Fig. 8: Safe operating area
Fig. 9: Normilized output current vs. output frequency
SKAI 45 A2 GD12-W12DI
8 Rev. 6 20.04.2011 © by SEMIKRON
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.