FTHD686-100.00 - Connor-Winfield

THE CONNOR-WINFIELD CORP.

2111 COMPREHENSIVE DRIVE.

AURORA, IL 60505.

FAX (630) 581-5040.

PHONE (630) 851-4722. PRODUCT DATA SHEET

Specifications subject to change without notice.

DATA SHEET #: REV: DATE:

CRYSTAL CONTROLLED OSCILLATORS

The Connor-Winfield FTHD686

is a surface mount 5.0V Crystal

Controlled Oscillator (XO) with

Sine Wave output. Based on a

fundamental crystal design the

FTHD686 is designed for

applications requiring low

noise, low jitter and tight

stability.

1 2

FTHD686 - 100.00 MHz

CLOCK

SERIES CENTER

FREQUENCY

5.0V OPERATION

SINE WAVE OUTPUT

TEMPERATURE STABILITY: ±40ppm

TEMPERATURE RANGE: -40 to 85°C

SURFACE MOUNT PACKAGE

TAPE AND REEL PACKAGING

SM 5.0V HF SINE WAVE OSCILLATOR

FTHD686

Sw045 01 4/15/03

www.conwin.com

ORDERING INFORMATION

FEATURES

DESCRIPTION

CW 0701

FTHD686

100.00M

ABSOLUTE MAXIMUM RATINGS TABLE 1.0

PARAMETER UNITS MINIMUM NOMINAL MAXIMUM UNITS NOTE

Storage Temperature -40 - 85 °C

Supply Voltage (Vcc) -0.5 - 7.0 Vdc

OPERATING SPECIFICATIONS TABLE 2.0

PARAMETER MINIMUM NOMINAL MAXIMUM UNITS NOTE

Center Frequency (Fo) 70 - 170 MHz

Total Frequency Tolerance -35 35 ppm 1

Operating Temperature Range -40 - 85 °C

Supply Voltage (Vcc) 4.75 5.00 5.25 Vdc

Supply Current (Icc) - - 50 mA

Start-up Time @ 25°C - - 10 mS

PHASE NOISE

CHARACTERISTICS TABLE 3.0

PARAMETER MINIMUM NOMINAL MAXIMUM UNITS NOTE

SSB Phase Noise at 10Hz offset - -60 - dBc/Hz

SSB Phase Noise at 100Hz offset - -90 - dBc/Hz

SSB Phase Noise at 1KHz offset - -110 - dBc/Hz

SSB Phase Noise at 10KHz offset - -135 - dBc/Hz

SSB Phase Noise at 100KHz offset - -145 - dBc/Hz

SINE WAVE OUTPUT

CHARACTERISTICS TABLE 4.0

PARAMETER MINIMUM NOMINAL MAXIMUM UNITS NOTE

LOAD - - 50 ohm

Voltage 2 3 4 dBm

Voltage vs. Supply Voltage Change -1 - 1 dBm

SPURIOUS CHARACTERISTICS TABLE 5.0

PARAMETER MINIMUM NOMINAL MAXIMUM UNITS NOTE

Harmonics - - -20 dBm

Sub Harmonics - - -70 dBm

PACKAGE CHARACTERISTICS TABLE 6.0

Package Non-hermetic package consisting of an FR4 substrate with grounded metal

cover.

PROCESS

RECOMMENDATIONS TABLE 7.0

Solder Reflow The component solder used internal to this device has a melting point of

221°C. The peak temperature inside the device should be less than or

equal to 220°C for a maximum of 10 seconds

Wash Ultrasonic cleaning is not recommended.

Notes

1.0 Includes initial tolerance, deviation over temperature, supply and load variations, shock, vibration and aging fifteen years.