Pressure Freescale Semiconductor + MPX2010 Rev 13, 10/2008 10 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors MPX2010 Series 0 to 10 kPa (0 to 1.45 psi) 25 mV Full Scale (Typical) The MPX2010 series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output directly proportional to the applied pressure. These sensors house a single monolithic silicon die with the strain gauge and thin film resistor network integrated. The sensor is laser trimmed for precise span, offset calibration and temperature compensation. Application Examples Features * * * * * * * * Temperature Compensated over 0C to +85C Ratiometric to Supply Voltage Differential and Gauge Options Available in Easy-to-Use Tape & Reel Respiratory Diagnostics Air Movement Control Controllers Pressure Switching ORDERING INFORMATION Package Case Device Name Options No. Small Outline Package (MPXV2010 Series) MPXV2010GP Tray 1369 MPXV2010DP Tray 1351 Unibody Package (MPX2010 Series) MPX2010D Tray 344 MPX2010DP Tray 344C MPX2010GP Tray 344B MPX2010GS Tray 344E MPX2010GSX Tray 344F MPAK Package (MPXM2010 Series) MPXM2010D Rail 1320 MPXM2010DT1 Tape and Reel 1320 MPXM2010GS Rail 1320A MPXM2010GST1 Tape and Reel 1320A None # of Ports Single Dual Gauge * Device Marking * MPXV2010GP MPXV2010DP * * * * * MPX2010D MPX2010DP MPX2010GP MPX2010D MPX2010D * * MPXM2010D MPXM2010D MPXM2010GS MPXM2010GS * * * * * * * * * * * * * SMALL OUTLINE PACKAGES MPXV2010GP CASE 1369-01 Pressure Type Differential Absolute MPAK PACKAGES MPXV2010DP CASE 1351-01 MPXM2010D/DT1 CASE 1320-02 MPXM2010GS/GST1 CASE 1320A-02 UNIBODY PACKAGES MPX2010D CASE 344-15 MPX2010GP CASE 344B-01 MPX2010DP CASE 344C-01 (c) Freescale Semiconductor, Inc., 2005-2008. All rights reserved. MPX2010GS CASE 344E-01 MPX2010GSX CASE 344F-01 Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 VDC, TA = 25C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units POP 0 -- 10 kPa Supply Voltage(2) VS -- 10 16 VDC Supply Current IO -- 6.0 -- mAdc Full Scale Span(3) VFSS 24 25 26 mV Offset(4) VOFF -1.0 -- 1.0 mV Sensitivity V/ -- 2.5 -- mV/kPa Linearity -- -1.0 -- 1.0 %VFSS Pressure Hysteresis (0 to 10 kPa) -- -- 0.1 -- %VFSS Temperature Hysteresis (-40C to +125C) -- -- 0.5 -- %VFSS Temperature Coefficient on Full Scale Span TCVFSS -1.0 -- 1.0 %VFSS Temperature Coefficient on Offset TCVOFF -1.0 -- 1.0 mV ZIN 1300 -- 2550 ZOUT 1400 -- 3000 Response Time(5) (10% to 90%) tR -- 1.0 -- ms Warm-Up Time -- -- 20 -- ms Offset Stability(6) -- -- 0.5 -- %VFSS Pressure Range(1) Input Impedance Output Impedance 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device at a different range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2010 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Burst Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Value Unit PMAX 75 kPa PBURST 100 kPa TSTG -40 to +125 C TA -40 to +125 C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Voltage Output versus Applied Differential Pressure The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1. shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip. VS 3 Thin Film Temperature Compensation and Calibration Circuitry Sensing Element 2 4 +VOUT -VOUT 1 GND Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic MPX2010 Sensors Freescale Semiconductor 3 Pressure On-Chip Temperature Compensation and Calibration Figure 2. shows the output characteristics of the MPX2010 series at 25C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics. This performance over temperature is achieved by having both the shear stress strain gauge and the thin-film resistor circuitry on the same silicon diaphragm. Each chip is dynamically laser trimmed for precise span and offset calibration and temperature compensation. Figure 3. illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2010 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor 30 25 LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 4.) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. VS = 10 Vdc TA = 25C P1 > P2 TYP 20 Output (mVdc) performance and long term reliability. Contact the factory for information regarding media compatibility in your application. a 15 MAX Span Range (Typical) 10 5 MIN 0 -5 kPa PSI 2.5 0.362 5 0.725 7.5 1.09 10 1.45 Offset (Typical) Figure 2. Output vs. Pressure Differential Least Square Deviation Silicone Die Coat Stainless Steel Metal Cover Die P1 Wire Bond Lead Frame P2 Epoxy Case Relative Voltage Output Least Squares Fit Exaggerated Performance Curve Straight Line Deviation End Point Straight Line Fit RTV Die Bond Offset 0 Figure 3. Unibody Package: Cross Sectional Diagram (not to scale) 50 Pressure (% Full Scale) 100 Figure 4. Linearity Specification Comparison MPX2010 4 Sensors Freescale Semiconductor Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Table 3. Pressure (P1) Side Delineation Part Number MPX2010D Case Type 344 Pressure (P1) Side Identifier Stainless Steel Cap MPX2010DP 344C Side with Part Marking MPX2010GP 344B Side with Port Attached MPX2010GS 344E Side with Port Attached MPX2010GSX 344F Side with Port Attached MPXV2010GP 1369 Side with Port Attached MPXV2010DP 1351 Side with Part Marking MPXM2010D/DTI 1320 Side with Part Marking MPXM2010GS/GSTI 1320A Side with Port Attached MPX2010 Sensors Freescale Semiconductor 5 Pressure PACKAGE DIMENSIONS C R M 1 B 2 -A- 3 Z 4 DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F Y D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 3: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30 NOM 30 NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -A- -T- U L R H N PORT #1 POSITIVE PRESSURE (P1) -Q- B 1 2 3 4 PIN 1 K -P0.25 (0.010) J M T Q S S F C G D 4 PL 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2010 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) N -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- -T- 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE CASE 344E-01 ISSUE B UNIBODY PACKAGE MPX2010 Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS -TC A E -Q- U N V B R PORT #1 POSITIVE PRESSURE (P1) PIN 1 -P0.25 (0.010) M T Q M 4 3 2 1 S K J F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX 1.080 1.120 27.43 28.45 0.740 0.760 18.80 19.30 0.630 0.650 16.00 16.51 0.016 0.020 0.41 0.51 0.160 0.180 4.06 4.57 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.220 0.240 5.59 6.10 0.070 0.080 1.78 2.03 0.150 0.160 3.81 4.06 0.150 0.160 3.81 4.06 0.440 0.460 11.18 11.68 0.695 0.725 17.65 18.42 0.840 0.860 21.34 21.84 0.182 0.194 4.62 4.92 G D 4 PL 0.13 (0.005) M T P S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2010 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2010 Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2010 10 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2010 Sensors Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2010 12 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK MPX2010 Sensors Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE A MPAK MPX2010 14 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PIN 4 PIN 1 CASE 1320A-02 ISSUE A MPAK MPX2010 Sensors Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE A MPAK MPX2010 16 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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