LMV721-N, LMV722-N
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LMV721-N/LMV722 10MHz, Low Noise, Low Voltage, and Low Power Operational Amplifier
Check for Samples: LMV721-N,LMV722-N
1FEATURES DESCRIPTION
The LMV721-N (Single) and LMV722 (Dual) are low
2• (For Typical, 5 V Supply Values; Unless noise, low voltage, and low power op amps, that can
Otherwise Noted) be designed into a wide range of applications. The
• Ensured 2.2V and 5.0V Performance LMV721-N/LMV722 has a unity gain bandwidth of
• Low Supply Current LMV721-N/2 10MHz, a slew rate of 5V/us, and a quiescent current
of 930uA/amplifier at 2.2V.
930µA/Amplifier at 2.2V
• High Unity-Gain Bandwidth 10MHz The LMV721-N/722 are designed to provide optimal
performance in low voltage and low noise systems.
• Rail-to-Rail Output Swing They provide rail-to-rail output swing into heavy
– at 600ΩLoad 120mV from Either Rail at loads. The input common-mode voltage range
2.2V includes ground, and the maximum input offset
– at 2kΩLoad 50mV from Either Rail at 2.2V voltage are 3.5mV (Over Temp) for the LMV721-
N/LMV722. Their capacitive load capability is also
• Input Common Mode Voltage Range Includes good at low supply voltages. The operating range is
Ground from 2.2V to 5.5V.
• Silicon Dust, SC70-5 Package 2.0x2.0x1.0 mm The chip is built with TI's advanced Submicron
• Input Voltage Noise 9 nV/√Hz at f = 1KHz Silicon-Gate BiCMOS process. The single version,
LMV721-N, is available in 5 pin SOT-23 and a SC70
APPLICATIONS (new) package. The dual version, LMV722, is
• Cellular an Cordless Phones available in an SOIC-8 and VSSOP-8 package.
• Active Filter and Buffers
• Laptops and PDAs
• Battery Powered Electronics
Typical Application
Figure 1. A Battery Powered Microphone Preamplifier
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1999–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMV721-N, LMV722-N
SNOS414I –AUGUST 1999–REVISED AUGUST 2013
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Absolute Maximum Ratings (1)(2)
ESD Tolerance (3)
Human Body Model 2000V
Machine Model 100V
Differential Input Voltage ± Supply Voltage
Supply Voltage (V+– V−) 6V
Soldering Information
Infrared or Convection (20 sec.) 235°C
Storage Temp. Range −65°C to 150°C
Junction Temperature (4) 150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model, 1.5 kΩin series with 100 pF. Machine model, 200Ωin series with 100 pF.
(4) The maximum power dissipation is a function of TJ(max),θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is P D= (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board.
Operating Ratings (1)
Supply Voltage 2.2V to 5.5V
Temperature Range −40°C ≤TJ≤85°C
Thermal Resistance (θJA)
Silicon Dust SC70-5 Pkg 440°C/W
Tiny SOT-23 package 265 °C/W
SOIC package, 8-pin Surface Mount 190°C/W
VSSOP package, 8-Pin Mini Surface Mount 235 °C/W
SOIC package, 14-Pin Surface Mount 145°C/W
(1) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of 30 mA over long term may adversely
affect reliability.
2.2V DC Electrical Characteristics
Unless otherwise specified, all limits specified for TJ= 25°C. V+= 2.2V, V−= 0V, VCM = V+/2, VO= V+/2 and R L> 1 MΩ.
Boldface limits apply at the temperature extremes.
Parameter Test Conditions Typ (1) Limit (2) Units
VOS Input Offset Voltage 0.02 3 mV
3.5 max
TCVOS Input Offset Voltage Average Drift 0.6 μV/°C
IBInput Bias Current 260 nA
IOS Input Offset Current 25 nA
CMRR Common Mode Rejection Ratio 0V ≤VCM ≤1.3V 88 70 dB
64 min
PSRR Power Supply Rejection Ratio 2.2V ≤V+≤5V, VO= 0 VCM = 0 90 70 dB
64 min
VCM Input Common-Mode Voltage Range For CMRR ≥50dB −0.30 V
1.3 V
AVLarge Signal Voltage Gain RL=600Ω81 75 dB
VO= 0.75V to 2.00V 60 min
RL= 2kΩ84 75 dB
VO= 0.50V to 2.10V 60 min
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
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2.2V DC Electrical Characteristics (continued)
Unless otherwise specified, all limits specified for TJ= 25°C. V+= 2.2V, V−= 0V, VCM = V+/2, VO= V+/2 and R L> 1 MΩ.
Boldface limits apply at the temperature extremes.
Parameter Test Conditions Typ (1) Limit (2) Units
VOOutput Swing RL= 600Ωto V+/2 2.125 2.090 V
2.065 min
0.071 0.120 V
0.145 max
RL= 2kΩto V+/2 2.177 2.150 V
2.125 min
0.056 0.080 V
0.105 max
IOOutput Current Sourcing, VO= 0V 14.9 10.0 mA
VIN(diff) = ± 0.5V 5.0 min
Sinking, VO= 2.2V 17.6 10.0 mA
VIN(diff) = ± 0.5V 5.0 min
ISSupply Current LMV721-N 0.93 1.2
1.5 mA
max
LMV722 1.81 2.2
2.6
2.2V AC Electrical Characteristics
Unless otherwise specified, all limits specified for TJ= 25°C. V+= 2.2V, V−= 0V, VCM = V+/2, VO= V+/2 and R L> 1
MΩ.Boldface limits apply at the temperature extremes.
Parameter Test Conditions Typ (1) Units
SR Slew Rate (2) 4.9 V/μs
GBW Gain-Bandwidth Product 10 MHz
ΦmPhase Margin 67.4 Deg
GmGain Margin −9.8 dB
enInput-Referred Voltage Noise f = 1 kHz 9 nV/√Hz
inInput-Referred Current Noise f = 1 kHz 0.3 pA/√Hz
THD Total Harmonic Distortion f = 1 kHz AV= 1 0.004 %
RL= 600Ω, VO= 500 mVPP
(1) Typical Values represent the most likely parametric norm.
(2) Connected as voltage follower with 1V step input. Number specified is the slower of the positive and negative slew rate.
5V DC Electrical Characteristics
Unless otherwise specified, all limits specified for TJ= 25°C. V+= 5V, V−= 0V, VCM = V+/2, VO= V+/2 and RL> 1 MΩ.
Boldface limits apply at the temperature extremes.
Parameter Test Conditions Typ (1) Limit (2) Units
VOS Input Offset Voltage −0.08 3 mV
3.5 max
TCVOS Input Offset Voltage Average Drift 0.6 μV/°C
IBInput Bias Current 260 nA
IOS Input Offset Current 25 nA
CMRR Common Mode Rejection Ratio 0V ≤VCM ≤4.1V 89 70 dB
64 min
PSRR Power Supply Rejection Ratio 2.2V ≤V+≤5.0V, VO= 0 VCM = 0 90 70 dB
64 min
VCM Input Common-Mode Voltage Range For CMRR ≥50dB −0.30 V
4.1 V
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
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5V DC Electrical Characteristics (continued)
Unless otherwise specified, all limits specified for TJ= 25°C. V+= 5V, V−= 0V, VCM = V+/2, VO= V+/2 and RL> 1 MΩ.
Boldface limits apply at the temperature extremes.
Parameter Test Conditions Typ (1) Limit (2) Units
AVLarge Signal Voltage Gain RL= 600Ω87 80 dB
VO= 0.75V to 4.80V 70 min
RL= 2kΩ, 94 85 dB
VO= 0.70V to 4.90V, 70 min
VOOutput Swing RL= 600Ωto V+/2 4.882 4.840 V
4.815 min
0.134 0.190 V
0.215 max
RL= 2kΩto V+/2 4.952 4.930 V
4.905 min
0.076 0.110 V
0.135 max
IOOutput Current Sourcing, VO= 0V 52.6 25.0 mA
VIN(diff) = ±0.5V 12.0 min
Sinking, VO= 5V 23.7 15.0 mA
VIN(diff) = ±0.5V 8.5 min
ISSupply Current LMV721-N 1.03 1.4
1.7 mA
max
LMV722 2.01 2.4
2.8
5V AC Electrical Characteristics
Unless otherwise specified, all limits specified for TJ= 25°C. V+= 5V, V−= 0V, VCM = V+/2, VO= V+/2 and R L> 1 MΩ.
Boldface limits apply at the temperature extremes.
Parameter Test Conditions Typ (1) Units
SR Slew Rate (2) 5.25 V/μs
GBW Gain-Bandwidth Product 10.0 MHz
ΦmPhase Margin 72 Deg
GmGain Margin −11 dB
enInput-Related Voltage Noise f = 1 kHz 8.5 nV/√Hz
inInput-Referred Current Noise f = 1 kHz 0.2 pa/√Hz
THD Total Harmonic Distortion f = 1kHz, AV= 1 0.001 %
RL= 600Ω, VO= 1 VPP
(1) Typical Values represent the most likely parametric norm.
(2) Connected as voltage follower with 1V step input. Number specified is the slower of the positive and negative slew rate.
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Typical Performance Characteristics
Supply Current Sourcing Current
vs. vs.
Supply Voltage (LMV721-N) Output Voltage (VS= 2.2V)
Figure 2. Figure 3.
Sinking Current
Sourcing Current vs. vs.
Output Voltage (VS= 5V) Output Voltage (VS= 2.2V)
Figure 4. Figure 5.
Sinking Current Output Voltage Swing
vs. vs.
Output Voltage (VS= 5V) Supply Voltage (RL= 600Ω)
Figure 6. Figure 7.
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Typical Performance Characteristics (continued)
Output Voltage Swing
vs. Input Offset Voltage
Suppy Voltage vs.
(RL= 2kΩ) Input Common-Mode Voltage Range VS= 2.2V
Figure 8. Figure 9.
Input Offset Voltage
vs.
Input Offset Voltage Supply Voltage
vs.
Input Common-Mode Voltage Range VS= 5V (VCM = V+/2)
Figure 10. Figure 11.
Input Voltage Input Voltage
vs. vs.
Output Voltage (VS= 2.2V, RL= 2kΩ) Output Voltage (VS= 5V, RL= 2kΩ)
Figure 12. Figure 13.
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Typical Performance Characteristics (continued)
Input Voltage Noise Input Current Noise
vs. vs.
Frequency Frequency
Figure 14. Figure 15.
+PSRR −PSRR
vs. vs.
Frequency Frequency
Figure 16. Figure 17.
Gain and Phase Margin
CMRR vs.
vs. Frequency
Frequency (VS= 2.2V, RL600Ω)
Figure 18. Figure 19.
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Typical Performance Characteristics (continued)
Gain and Phase Margin
vs. Slew Rate
Frequency vs.
(VS= 5V, RL600Ω) Supply Voltage
Figure 20. Figure 21.
THD
vs.
Frequency
Figure 22.
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APPLICATION NOTES
BENEFITS OF THE LMV721-N/722 SIZE
The small footprints of the LMV721-N/722 packages save space on printed circuit boards, and enable the design
of smaller electronic products, such as cellular phones, pagers, or other portable systems. The low profile of the
LMV721-N/722 make them possible to use in PCMCIA type III cards.
Signal Integrity Signals can pick up noise between the signal source and the amplifier. By using a physically
smaller amplifier package, the LMV721-N/722 can be placed closer to the signal source, reducing noise
pickup and increasing signal integrity.
Simplified Board Layout These products help you to avoid using long pc traces in your pc board layout. This
means that no additional components, such as capacitors and resistors, are needed to filter out the
unwanted signals due to the interference between the long pc traces.
Low Supply CurrentThese devices will help you to maximize battery life. They are ideal for battery powered
systems.
Low Supply Voltage TI provides ensured performance at 2.2V and 5V. These specifications ensure operation
throughout the battery lifetime.
Rail-to-Rail Output Rail-to-rail output swing provides maximum possible dynamic range at the output. This is
particularly important when operating on low supply voltages.
Input Includes Ground Allows direct sensing near GND in single supply operation.
Protection should be provided to prevent the input voltages from going negative more than −0.3V (at 25°C). An
input clamp diode with a resistor to the IC input terminal can be used.
CAPACITIVE LOAD TOLERANCE
The LMV721-N/722 can directly drive 4700pF in unity-gain without oscillation. The unity-gain follower is the most
sensitive configuration to capacitive loading. Direct capacitive loading reduces the phase margin of amplifiers.
The combination of the amplifier's output impedance and the capacitive load induces phase lag. This results in
either an underdamped pulse response or oscillation. To drive a heavier capacitive load, circuit in Figure 23 can
be used.
Figure 23. Indirectly Driving A capacitive Load Using Resistive Isolation
In Figure 23, the isolation resistor RISO and the load capacitor CLform a pole to increase stability by adding more
phase margin to the overall system. the desired performance depends on the value of RISO. The bigger the RISO
resistor value, the more stable VOUT will be. Figure 24 is an output waveform of Figure 23 using 100kΩfor RISO
and 2000µF for CL.
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Figure 24. Pulse Response of the LMV721-N Circuit in Figure 23
The circuit in Figure 25 is an improvement to the one in Figure 23 because it provides DC accuracy as well as
AC stability. If there were a load resistor in Figure 23, the output would be voltage divided by RISO and the load
resistor. Instead, in Figure 25, RFprovides the DC accuracy by using feed-forward techniques to connect VIN to
RL. Caution is needed in choosing the value of RFdue to the input bias current of the LMV721-N/722. CFand
RISO serve to counteract the loss of phase margin by feeding the high frequency component of the output signal
back to the amplifier's inverting input, thereby preserving phase margin in the overall feedback loop. Increased
capacitive drive is possible by increasing the value of CF. This in turn will slow down the pulse response.
Figure 25. Indirectly Driving A Capacitive Load with DC Accuracy
INPUT BIAS CURRENT CANCELLATION
The LMV721-N/722 family has a bipolar input stage. The typical input bias current of LMV721-N/722 is 260nA
with 5V supply. Thus a 100kΩinput resistor will cause 26mV of error voltage. By balancing the resistor values at
both inverting and non-inverting inputs, the error caused by the amplifier's input bias current will be reduced. The
circuit in Figure 26 shows how to cancel the error caused by input bias current.
Figure 26. Cancelling the Error Caused by Input Bias Current
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TYPICAL SINGLE-SUPPLY APPLICATION CIRCUITS
Difference Amplifier
The difference amplifier allows the subtraction of two voltages or, as a special case, the cancellation of a signal
common to two inputs. It is useful as a computational amplifier, in making a differential to single-ended
conversion or in rejecting a common mode signal.
Figure 27. Difference Application
(1)
(2)
Instrumentation Circuits
The input impendance of the previous difference amplifier is set by the resistor R1, R2, R3and R4. To eliminate
the problems of low input impendance, one way is to use a voltage follower ahead of each input as shown in the
following two instrumentation amplifiers.
Three-op-amp Instrumentation Amplifier
The LMV721-N/722 can be used to build a three-op-amp instrumentation amplifier as shown in Figure 28
Figure 28. Three-op-amp Instrumentation Amplifier
The first stage of this instrumentation amplifier is a differential-input, differential-output amplifier, with two voltage
followers. These two voltage followers assure that the input impedance is over 100MΩ. The gain of this
instrumentation amplifier is set by the ratio of R2/R1. R3should equal R1and R4equal R2. Matching of R3to R1
and R4to R2affects the CMRR. For good CMRR over temperature, low drift resistors should be used. Making R4
slightly smaller than R2and adding a trim pot equal to twice the difference between R2and R4will allow the
CMRR to be adjusted for optimum.
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Two-op-amp Instrumentation Amplifier
A two-op-amp instrumentation amplifier can also be used to make a high-input impedance DC differential
amplifier (Figure 29). As in the two-op-amp circuit, this instrumentation amplifier requires precise resistor
matching for good CMRR. R4should equal to R1and R3should equal R2.
Figure 29. Two-op-amp Instrumentation Amplifier
(3)
Single-Supply Inverting Amplifier
There may be cases where the input signal going into the amplifier is negative. Because the amplifier is
operating in single supply voltage, a voltage divider using R3and R4is implemented to bias the amplifier so the
input signal is within the input common-common voltage range of the amplifier. The capacitor C1is placed
between the inverting input and resistor R1to block the DC signal going into the AC signal source, VIN. The
values of R1and C1affect the cutoff frequency, fc = ½πR1C1.
As a result, the output signal is centered around mid-supply (if the voltage divider provides V+/2 at the non-
inverting input). The output can swing to both rails, maximizing the signal-to-noise ratio in a low voltage system.
Figure 30. Single-Supply Inverting Amplifier
(4)
Active Filter
Simple Low-Pass Active Filter
The simple low-pass filter is shown in Figure 31. Its low-pass frequency gain (ω → o) is defined by −R3/R1. This
allows low-frequency gains other than unity to be obtained. The filter has a −20dB/decade roll-off after its corner
frequency fc. R2should be chosen equal to the parallel combination of R1and R3to minimize error due to bias
current. The frequency response of the filter is shown in Figure 32.
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Figure 31. Simple Low-Pass Active Filter
(5)
Figure 32. Frequency Response of Simple Low-pass Active Filter in Figure 31
Note that the single-op-amp active filters are used in to the applications that require low quality factor, Q(≤10),
low frequency (≤5KHz), and low gain (≤10), or a small value for the product of gain times Q(≤100). The op amp
should have an open loop voltage gain at the highest frequency of interest at least 50 times larger than the gain
of the filter at this frequency. In addition, the selected op amp should have a slew rate that meets the following
requirement:
Slew Rate ≥0.5 x (ωHVOPP) X 10 −6V/µsec
where
•ωHis the highest frequency of interest
• VOPP is the output peak-to-peak voltage
Figure 33. A Battery Powered Microphone Preamplifier
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Here is a LMV721-N used as a microphone preamplifier. Since the LMV721-N is a low noise and low power op
amp, it makes it an ideal candidate as a battery powered microphone preamplifier. The LMV721-N is connected
in an inverting configuration. Resistors, R1= R2= 4.7kΩ, sets the reference half way between VCC = 3V and
ground. Thus, this configures the op amp for single supply use. The gain of the preamplifier, which is 50 (34dB),
is set by resistors R3= 10kΩand R4= 500kΩ. The gain bandwidth product for the LMV721-N is 10 MHz. This is
sufficient for most audio application since the audio range is typically from 20 Hz to 20kHz. A resistor R5= 5kΩis
used to bias the electret microphone. Capacitors C1= C2= 4.7µF placed at the input and output of the op amp to
block out the DC voltage offset.
Connection Diagrams
Top View Top View
Figure 34. 5-Pin SC70 and SOT-23 Packages Figure 35. 8-Pin SOIC and VSSOP Packages
See Package Numbers DCK0005A AND DBV0005A See Package Numbers D0008A and DGK0008A
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REVISION HISTORY
Changes from Revision G (March 2013) to Revision H Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 14
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMV721M5 NRND SOT-23 DBV 5 1000 Non-RoHS
& Green Call TI Call TI -40 to 85 A30A
LMV721M5/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 A30A
LMV721M5X/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 A30A
LMV721M7 NRND SC70 DCK 5 1000 Non-RoHS
& Green Call TI Call TI -40 to 85 A20
LMV721M7/NOPB ACTIVE SC70 DCK 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 A20
LMV721M7X/NOPB ACTIVE SC70 DCK 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 A20
LMV722M NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI -40 to 85 LMV
722M
LMV722M/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LMV
722M
LMV722MM/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 V722
LMV722MMX/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 V722
LMV722MX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LMV
722M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMV722-N :
•Automotive: LMV722-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMV721M5 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMV721M5/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMV721M5X/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMV721M7 SC70 DCK 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3
LMV721M7/NOPB SC70 DCK 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3
LMV721M7X/NOPB SC70 DCK 5 3000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3
LMV722MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMV722MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMV722MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV721M5 SOT-23 DBV 5 1000 210.0 185.0 35.0
LMV721M5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LMV721M5X/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LMV721M7 SC70 DCK 5 1000 210.0 185.0 35.0
LMV721M7/NOPB SC70 DCK 5 1000 210.0 185.0 35.0
LMV721M7X/NOPB SC70 DCK 5 3000 210.0 185.0 35.0
LMV722MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMV722MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMV722MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.9
1.45
0.90
0.15
0.00 TYP
5X 0.5
0.3
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
5X (1.1)
5X (0.6)
(2.6)
(1.9)
2X (0.95)
(R0.05) TYP
4214839/E 09/2019
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
(1.9)
2X(0.95)
5X (1.1)
5X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
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