ESP32-WROVER
Datasheet
Version 2.2
Espressif Systems
Copyright © 2019
www.espressif.com
About This Document
This document provides the specifications for the ESP32-WROVER modules with a PCB antenna or an IPEX
antenna.
Revision History
For revision history of this document, please refer to the last page.
Documentation Change Notification
Espressif provides email notifications to keep customers updated on changes to technical documentation. Please
subscribe at www.espressif.com/en/subscribe.
Certification
Download certificates for Espressif products from www.espressif.com/en/certificates.
Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS
PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABIL-
ITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE
ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this docu-
ment is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights
are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property of their respective
owners, and are hereby acknowledged.
Copyright © 2019 Espressif Inc. All rights reserved.
Contents
1 Overview 1
2 Pin Definitions 3
2.1 Pin Layout 3
2.2 Pin Description 4
2.3 Strapping Pins 5
3 Functional Description 7
3.1 CPU and Internal Memory 7
3.2 External Flash and SRAM 7
3.3 Crystal Oscillators 7
3.4 RTC and Low-Power Management 8
4 Peripherals and Sensors 9
5 Electrical Characteristics 10
5.1 Absolute Maximum Ratings 10
5.2 Recommended Operating Conditions 10
5.3 DC Characteristics (3.3 V, 25 °C) 10
5.4 Wi-Fi Radio 11
5.5 BLE Radio 12
5.5.1 Receiver 12
5.5.2 Transmitter 12
5.6 Reflow Profile 13
6 Schematics 14
7 Peripheral Schematics 15
8 Physical Dimensions 17
9 Recommended PCB Land Pattern 18
10U.FL Connector Dimensions 19
11Learning Resources 20
11.1 Must-Read Documents 20
11.2 Must-Have Resources 20
Revision History 21
List of Tables
1 ESP32-WROVER Ordering Information 1
2 ESP32-WROVER Specifications 1
3 Pin Definitions 4
4 Strapping Pins 5
5 Absolute Maximum Ratings 10
6 Recommended Operating Conditions 10
7 DC Characteristics (3.3 V, 25 °C) 10
8 Wi-Fi Radio Characteristics 11
9 Receiver Characteristics – BLE 12
10 Transmitter Characteristics – BLE 12
List of Figures
1 Pin Layout of ESP32-WROVER (Top View) 3
2 Reflow Profile 13
3 Schematics of ESP32-WROVER 14
4 Peripheral Schematics of ESP32-WROVER 15
5 Discharge Circuit for VDD33 Rail 16
6 Reset Circuit 16
7 Physical Dimensions of ESP32-WROVER 17
8 Recommended PCB Land Pattern of ESP32-WROVER 18
9 U.FL Connector Dimensions 19
1. Overview
1. Overview
ESP32-WROVER is a powerful, generic WiFi-BT-BLE MCU module that targets a wide variety of applications,
ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music streaming
and MP3 decoding.
This module is provided in two versions: one with a PCB antenna, the other with an IPEX antenna. ESP32-
WROVER features a 4 MB external SPI flash and an additional 8 MB SPI Pseudo static RAM (PSRAM).
The ordering information on the two variants of ESP32-WROVER is listed as follows:
Table 1: ESP32-WROVER Ordering Information
Module Chip embedded Flash PSRAM Dimensions (mm)
ESP32-WROVER (PCB) ESP32-D0WDQ6 4 MB 8 MB (18.00±0.10)×(31.40±0.10)×(3.30±0.10)
ESP32-WROVER (IPEX)
For detailed ordering information, please see Espressif Product Ordering Information. For dimensions of the IPEX
connector, please see Chapter 10.The information in this datasheet is applicable to both modules.
At the core of this module is the ESP32-D0WDQ6 chip*. The chip embedded is designed to be scalable and
adaptive. There are two CPU cores that can be individually controlled, and the CPU clock frequency is adjustable
from 80 MHz to 240 MHz. The user may also power off the CPU and make use of the low-power co-processor to
constantly monitor the peripherals for changes or crossing of thresholds. ESP32 integrates a rich set of peripherals,
ranging from capacitive touch sensors, Hall sensors, SD card interface, Ethernet, high-speed SPI, UART, I²S and
I²C.
Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet.
The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet
through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast
low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable
for battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps,
and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer
industry-leading specifications and the best performance for electronic integration, range, power consumption,
and connectivity.
The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products
even after their release, at minimum cost and effort.
Table 2provides the specifications of ESP32-WROVER.
Table 2: ESP32-WROVER Specifications
Categories Items Specifications
Certification RF certification FCC/CE-RED/SRRC/TELEC
Wi-Fi certification Wi-Fi Alliance
Espressif Systems 1 ESP32-WROVER Datasheet V2.2
1. Overview
Categories Items Specifications
Bluetooth certification BQB
Green certification RoHS/REACH
Test Reliablity HTOL/HTSL/uHAST/TCT/ESD
Wi-Fi Protocols
802.11 b/g/n (802.11n up to 150 Mbps)
A-MPDU and A-MSDU aggregation and 0.4 µs guard in-
terval support
Frequency range 2.4 GHz ~2.5 GHz
Bluetooth
Protocols Bluetooth v4.2 BR/EDR and BLE specification
Radio
NZIF receiver with –97 dBm sensitivity
Class-1, class-2 and class-3 transmitter
AFH
Audio CVSD and SBC
Hardware
Module interfaces
SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM,
I2S, IR, pulse counter, GPIO, capacitive touch sensor,
ADC, DAC
On-chip sensor Hall sensor
Integrated crystal 40 MHz crystal
Integrated SPI flash 4 MB
Integrated PSRAM 8 MB
Operating voltage/Power supply 2.3 V ~3.6 V
Operating current Average: 80 mA
Minimum current delivered by
power supply 500 mA
Recommended operating tem-
perature range –40 °C ~85 °C
Package size (18.00±0.10) mm × (31.40±0.10) mm × (3.30±0.10) mm
Moisture sensitivity level (MSL) Level 3
Espressif Systems 2 ESP32-WROVER Datasheet V2.2
2. Pin Definitions
2. Pin Definitions
2.1 Pin Layout
Keepout Zone
GND
IO23
IO22
TXD0
RXD0
IO21
NC
IO19
IO18
IO5
NC
NC
IO4
IO0
IO2
IO15
SD1
SD0
CLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
GND
VDD33
EN
SENSOR_VP
SENSOR_VN
IO34
IO35
IO32
IO33
IO25
IO26
IO27
IO14
IO12
GND
IO13
SD2
SD3
CMD
39 GND
Figure 1: Pin Layout of ESP32-WROVER (Top View)
Espressif Systems 3 ESP32-WROVER Datasheet V2.2
2. Pin Definitions
2.2 Pin Description
ESP32-WROVER has 38 pins. See pin definitions in Table 3.
Table 3: Pin Definitions
Name No. Type Function
GND 1 P Ground
3V3 2 P Power supply
EN 3 I Module-enable signal. Active high.
SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3
IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4
IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5
IO32 8 I/O GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
TOUCH9, RTC_GPIO9
IO33 9 I/O GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output),
ADC1_CH5, TOUCH8, RTC_GPIO8
IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
IO14 13 I/O GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK,
HS2_CLK, SD_CLK, EMAC_TXD2
IO12 114 I/O GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ,
HS2_DATA2, SD_DATA2, EMAC_TXD3
GND 15 P Ground
IO13 16 I/O GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID,
HS2_DATA3, SD_DATA3, EMAC_RX_ER
SHD/SD2 217 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SWP/SD3 218 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
SCS/CMD 219 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
SCK/CLK 220 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
SDO/SD0 221 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SDI/SD1 222 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
IO15 23 I/O GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13,
HS2_CMD, SD_CMD, EMAC_RXD3
IO2 24 I/O GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
SD_DATA0
IO0 25 I/O GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1,
EMAC_TX_CLK
IO4 26 I/O GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER
NC1 27 - -
NC2 28 - -
IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7
Espressif Systems 4 ESP32-WROVER Datasheet V2.2
2. Pin Definitions
Name No. Type Function
IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC 32 - -
IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN
RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2
TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 37 I/O GPIO23, VSPID, HS1_STROBE
GND 38 P Ground
Notice:
1. GPIO12 is internally pulled high in the module and is not recommended for use as a touch pin.
2. Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are con-
nected to the SPI flash integrated on the module and are not recommended for other uses.
2.3 Strapping Pins
ESP32 has five strapping pins, which can be seen in Chapter 6Schematics:
• MTDI
• GPIO0
• GPIO2
• MTDO
• GPIO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches
of the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip
is powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping
pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will
determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset release, the strapping pins work as normal-function pins.
Refer to Table 4for a detailed boot-mode configuration by strapping pins.
Table 4: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
Pin Default 3.3 V 1.8 V
Espressif Systems 5 ESP32-WROVER Datasheet V2.2
2. Pin Definitions
MTDI Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin Default U0TXD Active U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
Pin Default Falling-edge Sampling
Falling-edge Output
Falling-edge Sampling
Rising-edge Output
Rising-edge Sampling
Falling-edge Output
Rising-edge Sampling
Rising-edge Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1
Note:
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave” after booting.
• The MTDI is internally pulled high in the module, as the flash and SRAM in ESP32-WROVER only support a power
voltage of 1.8 V (output by VDD_SDIO).
Espressif Systems 6 ESP32-WROVER Datasheet V2.2
3. Functional Description
3. Functional Description
This chapter describes the modules and functions integrated in ESP32-WROVER.
3.1 CPU and Internal Memory
ESP32-D0WDQ6 contains two low-power Xtensa®32-bit LX6 microprocessors. The internal memory includes:
• 448 KB of ROM for booting and core functions.
• 520 KB of on-chip SRAM for data and instructions.
• 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed
by the main CPU during RTC Boot from the Deep-sleep mode.
• 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during
the Deep-sleep mode.
• 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.
3.2 External Flash and SRAM
ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the
ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to pro-
tect developers’ programs and data in flash.
ESP32 can access the external QSPI flash and SRAM through high-speed caches.
• The external flash can be mapped into CPU instruction memory space and read-only memory space simul-
taneously.
–When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be
mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be
reduced due to speculative reads by the CPU.
–When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a
time. 8-bit, 16-bit and 32-bit reads are supported.
• External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time. 8-bit,
16-bit and 32-bit reads and writes are supported.
ESP32-WROVER integrates a 4 MB of external SPI flash and an 8 MB PSRAM for more memory space.
3.3 Crystal Oscillators
The module uses a 40-MHz crystal oscillator.
Espressif Systems 7 ESP32-WROVER Datasheet V2.2
3. Functional Description
3.4 RTC and Low-Power Management
With the use of advanced power-management technologies, ESP32 can switch between different power modes.
For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and Low-Power
Management” in ESP32 Datasheet.
Espressif Systems 8 ESP32-WROVER Datasheet V2.2
4. Peripherals and Sensors
4. Peripherals and Sensors
Please refer to Section Peripherals and Sensors in ESP32 Datasheet.
Note:
1. GPIO12 is internally pulled high in the module and is not recommended for use as a touch pin.
2. External connections can be made to any GPIO except for GPIOs in the range 6-11, 16, or 17. GPIOs 6-11 are
connected to the module’s integrated SPI flash and PSRAM. GPIOs 16 and 17 are connected to the module’s
integrated PSRAM. For details, please see Chapter 6Schematics.
Espressif Systems 9 ESP32-WROVER Datasheet V2.2
5. Electrical Characteristics
5. Electrical Characteristics
5.1 Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should follow
the recommended operating conditions.
Table 5: Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
Ioutput
1Cumulative IO output current - 1,100 mA
Tstore Storage temperature –40 150 °C
1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains
(VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash
and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
2. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain.
5.2 Recommended Operating Conditions
Table 6: Recommended Operating Conditions
Symbol Parameter Min Typical Max Unit
VDD33 - 2.3 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 - - A
T Operating temperature –40 - 85 °C
5.3 DC Characteristics (3.3 V, 25 °C)
Table 7: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit
CIN Pin capacitance - 2 - pF
VIH High-level input voltage 0.75×VDD1- VDD1+0.3 V
VIL Low-level input voltage –0.3 - 0.25×VDD1V
IIH High-level input current - - 50 nA
IIL Low-level input current - - 50 nA
VOH High-level output voltage 0.8×VDD1- - V
VOL Low-level output voltage - - 0.1×VDD1V
IOH
High-level source current VDD3P3_CPU power domain 1,2- 40 - mA
(VDD1= 3.3 V, VOH >= 2.64 V, VDD3P3_RTC power domain 1,2- 40 - mA
output drive strength set to the
maximum) VDD_SDIO power domain 1,3- 20 - mA
Espressif Systems 10 ESP32-WROVER Datasheet V2.2
5. Electrical Characteristics
Symbol Parameter Min Typ Max Unit
IOL
Low-level sink current
(VDD1= 3.3 V, VOL = 0.495 V,
output drive strength set to the maximum)
- 28 - mA
RP U Resistance of internal pull-up resistor - 45 - kΩ
RP D Resistance of internal pull-down resistor - 45 - kΩ
VIL_nRST Low-level input voltage of CHIP_PU to power off the chip - - 0.6 V
Notes:
1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power
domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced
from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
5.4 Wi-Fi Radio
Table 8: Wi-Fi Radio Characteristics
Parameter Condition Min Typical Max Unit
Operating frequency range note1- 2412 - 2484 MHz
Output impedance note2- - See note 2 - Ω
TX power note311n, MCS7 12 13 14 dBm
11b mode 17.5 18.5 20 dBm
Sensitivity 11b, 1 Mbps - –98 - dBm
11b, 11 Mbps - –89 - dBm
11g, 6 Mbps - –92 - dBm
11g, 54 Mbps - –74 - dBm
11n, HT20, MCS0 - –91 - dBm
11n, HT20, MCS7 - –71 - dBm
11n, HT40, MCS0 - –89 - dBm
11n, HT40, MCS7 - –69 - dBm
Adjacent channel rejection 11g, 6 Mbps - 31 - dB
11g, 54 Mbps - 14 - dB
11n, HT20, MCS0 - 31 - dB
11n, HT20, MCS7 - 13 - dB
1. Device should operate in the frequency range allocated by regional regulatory authorities. Target operating frequency
range is configurable by software.
2. For the modules that use IPEX antennas, the output impedance is 50 Ω. For other modules without IPEX antennas,
users do not need to concern about the output impedance.
3. Target TX power is configurable based on device or certification requirements.
Espressif Systems 11 ESP32-WROVER Datasheet V2.2
5. Electrical Characteristics
5.5 BLE Radio
5.5.1 Receiver
Table 9: Receiver Characteristics – BLE
Parameter Conditions Min Typ Max Unit
Sensitivity @30.8% PER - - –97 - dBm
Maximum received signal @30.8% PER - 0 - - dBm
Co-channel C/I - - +10 - dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz - –5 - dB
F = F0 – 1 MHz - –5 - dB
F = F0 + 2 MHz - –25 - dB
F = F0 – 2 MHz - –35 - dB
F = F0 + 3 MHz - –25 - dB
F = F0 – 3 MHz - –45 - dB
Out-of-band blocking performance
30 MHz ~2000 MHz –10 - - dBm
2000 MHz ~2400 MHz –27 - - dBm
2500 MHz ~3000 MHz –27 - - dBm
3000 MHz ~12.5 GHz –10 - - dBm
Intermodulation - –36 - - dBm
5.5.2 Transmitter
Table 10: Transmitter Characteristics – BLE
Parameter Conditions Min Typ Max Unit
RF transmit power - - 0 - dBm
Gain control step - - 3 - dBm
RF power control range - –12 - +9 dBm
Adjacent channel transmit power
F = F0 ± 2 MHz - –52 - dBm
F = F0 ± 3 MHz - –58 - dBm
F = F0 ± > 3 MHz - –60 - dBm
∆f1avg - - - 265 kHz
∆f2max - 247 - - kHz
∆f2avg/∆f1avg - - –0.92 - -
ICFT - - –10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz
Espressif Systems 12 ESP32-WROVER Datasheet V2.2
5. Electrical Characteristics
5.6 Reflow Profile
50 150
0
25
1 ~ 3℃/s
0
200
250
200
-1 ~ -5℃/s
Cooling zone
100
217
50
100 250
Reflow zone
!217℃ 60 ~ 90s
Temperature (℃)
Preheating zone
150 ~ 200℃ 60 ~ 120s
Ramp-up zone
Peak Temp.
235 ~ 250℃
Soldering time
> 30s
Time (sec.)
Ramp-up zone — Temp.: <150℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s
Preheating zone — Temp.: 150 ~ 200℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s
Reflow zone — Temp.: >217℃ 7LPH60 ~ 90s; Peak Temp.: 235 ~ 250℃ (<245℃ recommended) Time: 30 ~ 70s
Cooling zone — Peak Temp. ~ 180℃ Ramp-down rate: -1 ~ -5℃/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Figure 2: Reflow Profile
Espressif Systems 13 ESP32-WROVER Datasheet V2.2
6. Schematics
6. Schematics
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
Espressif Systems
The BLUE netname means 1.8V.
ESP32 Module:
with 1.8V Flash & SRAM
Pin.1
GND
Pin.2
VDD33
Pin.3
CHIP_PU/EN
Pin.4
SENSOR_VP
Pin.5
SENSOR_VN
Pin.6
IO34
Pin.7
IO35
Pin.8
IO32
Pin.9
IO33
Pin.10
IO25
Pin.11
IO26
Pin.12
IO27
Pin.13
IO14
Pin.14
IO12
Pin.15
GND
Pin.16
IO13
Pin.17
SD2
Pin.18
SD3
Pin.19
CMD
Pin.20
CLK
Pin.21
SD0
Pin.22
SD1
Pin.23
IO15
Pin.24
IO2
Pin.39
GND Pin.25
IO0
Pin.26
IO4
Pin.27
NC
Pin.28
NC
Pin.29
IO5
Pin.30
IO18
Pin.31
IO19
Pin.32
NC
Pin.33
IO21
Pin.34
RXD0
Pin.35
TXD0
Pin.36
IO22
Pin.37
IO23
Pin.38
GND
The values of C1 and C2 vary with
the selection of a crystal.
The values of C14, L4 and C15 vary with
the actual selection of a PCB board.
GPIO16
SRAM_CLK
SENSOR_VP
SENSOR_VN
GPIO32
GPIO33 GPIO18
GPIO2
U0TXD
U0RXD
GPIO22
GPIO21
GPIO19
SHD/SD2
SWP/SD3
SCS/CMD
FLASH_CLK
SDO/SD0
SDI/SD1
GPIO23
CHIP_PU
GPIO34
GPIO35
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
GPIO13
GPIO0
GPIO15
GPIO4
GPIO5
FLASH_CLK
SCS/CMD
SHD/SD2 SWP/SD3
SDI/SD1
SDO/SD0
SCK/CLK
GPIO17
FLASH_CLK
SRAM_CLK
SDO/SD0
SWP/SD3
SHD/SD2
SDI/SD1
CHIP_PU
GPIO35
SENSOR_VP
SENSOR_VN
GPIO34
GPIO32
U0RXD
GPIO22
GPIO21
U0TXD
GPIO33
GPIO25
GPIO4
GPIO0
GPIO2
GPIO15
GPIO13
GPIO12
GPIO14
GPIO27
GPIO26
GPIO19
GPIO17
SHD/SD2
SWP/SD3
SCS/CMD
SCK/CLK
SDO/SD0
SDI/SD1
GPIO5
GPIO18
GPIO23
GPIO16
GND
GND
VDD_SDIO
GND
GND
VDD33
GND
GND
VDD_SDIO
VDD33
VDD_SDIO
GND
VDD33
GND
GND
VDD_SDIO
GND
GND
VDD33
GND
GND
GND
GNDGND
GND
GND
VDD33
GND
GND
GND GND
VDD33
GND
VDD33
GND
GND GND
Title
Size
Document Number Rev
Date: Sheet o f
<Doc>
ESP32-WROVER-V4
C
11
Wednesday, November 14, 2018
Title
Size
Document Number Rev
Date: Sheet o f
<Doc>
ESP32-WROVER-V4
C
11
Wednesday, November 14, 2018
Title
Size
Document Number Rev
Date: Sheet o f
<Doc>
ESP32-WROVER-V4
C
11
Wednesday, November 14, 2018
L4
TBD
R15 0R(5%)
U2 ESP32-D0WDQ6
VDDA
1
LNA_IN
2
VDD3P3
3
VDD3P3
4
SENSOR_VP
5
SENSOR_CAPP
6
SENSOR_CAPN
7
SENSOR_VN
8
CHIP_PU
9
VDET_1
10
VDET_2
11
32K_XP
12
32K_XN
13
GPIO25
14
GPIO26
15
GPIO27
16
MTMS
17
MTDI
18
VDD3P3_RTC
19
MTCK
20
MTDO
21
GPIO2
22
GPIO0
23
GPIO4
24
VDD_SDIO 26
GPIO16 25
GPIO17 27
SD_DATA_2 28
SD_DATA_3 29
SD_CMD 30
SD_CLK 31
SD_DATA_0 32
GND 49
SD_DATA_1 33
GPIO5 34
GPIO18 35
GPIO19 38
CAP2 47
VDDA 43
XTAL_N 44
XTAL_P 45
GPIO23 36
U0TXD 41
GPIO22 39
GPIO21 42
VDD3P3_CPU 37
CAP1 48
VDDA 46
U0RXD 40
C9
0.1uF/6.3V(10%)
C15
TBD
U4
PSRAM
CS#
1
SO/SIO1
2
SIO2
3
VSS
4SI/SIO0 5
SCLK 6
SIO3 7
VDD 8
R13 0R(5%)
R12 0R(5%)
C17
270pF/6.3V(10%)
C10
0.1uF/6.3V(10%)
R11
0R(5%)(NC)
C11
1uF/10V(20%)
C16
270pF/6.3V(10%)
C4
0.1uF/6.3V(10%)
C2
22pF/6.3V(10%)
R1 20K(5%)
D1
ESD3.3V88D-LCDN
C14 TBD
R10
10K(5%)
C1
22pF/6.3V(10%)
C13
10uF/6.3V(10%)
C12
10uF/6.3V(10%)
C5
3.3nF/6.3V(10%)
C24
2K(5%)
R14 0R(5%)/NC
C19
0.1uF/6.3V(10%)
ANT1
PCB ANT
1
2
C6
10nF/6.3V(10%)
R9
10K(5%)
C18
4.7uF/16V(10%)
J39
IPEX
1
2
3
U3
FLASH
/CS
1
DO 2
/WP 3
GND
4
DI 5
CLK
6
/HOLD
7
VCC 8
C3
100pF/6.3V(10%)
U1
40MHz+/-10ppm
XIN
1
GND
2XOUT 3
GND 4
Figure 3: Schematics of ESP32-WROVER
Espressif Systems 14 ESP32-WROVER Datasheet V2.2
7. Peripheral Schematics
7. Peripheral Schematics
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
MTMS
MTDI
MTCK
MTDO
GND
EN
SENSOR_VP
GPI36
SENSOR_VN
GPI39
GPI34
GPI35
GPIO32
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO13
GND
GPIO22
TXD0
RXD0
GPIO21
GPIO19
GPIO18
GPIO4
GPIO0
GPIO5
GPIO23
GPIO15
GPIO2
GND
GPIO12
SD2
SD3
CMD SCK
SDO
SDI
EN
GPIO14
GPIO12
GPIO13
GPIO15
GND
VDD33
GND
VDD33
GND
GND
GND
Title
Size Document Number Re v
Date: Sheet o f
<Doc> 1.0
<ESP32-WROVER-B_Peripheral-Schematics>
C
1 1Monday, August 26, 2019
Title
Size Document Number Re v
Date: Sheet o f
<Doc> 1.0
<ESP32-WROVER-B_Peripheral-Schematics>
C
1 1Monday, August 26, 2019
Title
Size Document Number Re v
Date: Sheet o f
<Doc> 1.0
<ESP32-WROVER-B_Peripheral-Schematics>
C
1 1Monday, August 26, 2019
SW1
R1
TBD
R2 0R(5%)
JP2
Boot Option
11
22
C2
0.1uF/50V(10%)
JP3
JTAG
11
22
33
44
JP1
UART
1
1
2
2
3
3
4
4
U1
GND1
1
3V3
2
EN
3
SENSOR_VP
4
SENSOR_VN
5
IO34
6
IO35
7
IO32
8
IO33
9
IO25
10
IO26
11
IO27
12
IO14
13
IO12
14
GND2
15
IO13
16
SD2
17
SD3
18
CMD
19 CLK 20
SD0 21
SD1 22
IO15 23
IO2 24
IO0 25
IO4 26
NC1 27
NC2 28
IO5 29
IO18 30
IO19 31
NC 32
IO21 33
RXD0 34
TXD0 35
IO22 36
IO23 37
GND3 38
P_GND 39
C3
TBD
C4 0.1uF/50V(10%)
C1
22uF/25V(10%)
Figure 4: Peripheral Schematics of ESP32-WROVER
Note:
• Soldering Pad 39 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users
do want to solder it, they need to ensure that the correct quantity of soldering paste is applied.
• To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the
EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩand C = 0.1 µF. However, specific
parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence
timing of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to Section Power Scheme
in ESP32 Datasheet.
Espressif Systems 15 ESP32-WROVER Datasheet V2.2
7. Peripheral Schematics
VCC
GND
GND GND
VDD33
GND
ESP Module
Discharge Circuit CAP Added By User
Q1
R1
100K
D1SW1
1 2
R2
1K
+
C1
Bulk CAP
Figure 5: Discharge Circuit for VDD33 Rail
Note:
The discharge circuit can be applied in scenarios where ESP32 is powered on and off repeatedly by switching the
power rails, and there is a large capacitor on the VDD33 rail. For details, please refer to Section Power Scheme in
ESP32 Datasheet.
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
CHIP_PU
VBAT
GND
GND
Title
Size Document Number Re v
Date: Sheet o f
<Doc> V1
<ResetCirciut>
A4
1 1Thursday, May 31, 2018
Title
Size Document Number Re v
Date: Sheet o f
<Doc> V1
<ResetCirciut>
A4
1 1Thursday, May 31, 2018
Title
Size Document Number Re v
Date: Sheet o f
<Doc> V1
<ResetCirciut>
A4
1 1Thursday, May 31, 2018
R1 0R
R2
100K
U1
Power Supply Supervisor
GND 1
VCC
3
RESET# 2
Figure 6: Reset Circuit
Note:
When battery is used as the power supply for ESP32 series of chips and modules, a supply voltage supervisor is recom-
mended to avoid boot failure due to low voltage. Users are recommended to pull CHIP_PU low if the power supply for
ESP32 is below 2.3 V.
Espressif Systems 16 ESP32-WROVER Datasheet V2.2
8. Physical Dimensions
8. Physical Dimensions
Figure 7: Physical Dimensions of ESP32-WROVER
Espressif Systems 17 ESP32-WROVER Datasheet V2.2
9. Recommended PCB Land Pattern
9. Recommended PCB Land Pattern
Antenna Area
31.40
18.00
6.30
0.50
1.10
1.27
16.46
8.00
5.00
5.00
1.33
1.33
0.90
2.00
1
19 20
38
Unit: mm
Copper
Via for thermal pad
Figure 8: Recommended PCB Land Pattern of ESP32-WROVER
Espressif Systems 18 ESP32-WROVER Datasheet V2.2
10. U.FL Connector Dimensions
10. U.FL Connector Dimensions
Unit: mm
Figure 9: U.FL Connector Dimensions
Espressif Systems 19 ESP32-WROVER Datasheet V2.2
11. Learning Resources
11. Learning Resources
11.1 Must-Read Documents
The following link provides documents related to ESP32.
•ESP32 Datasheet
This document provides an introduction to the specifications of the ESP32 hardware, including overview, pin
definitions, functional description, peripheral interface, electrical characteristics, etc.
•ESP-IDF Programming Guide
It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.
•ESP32 Technical Reference Manual
The manual provides detailed information on how to use the ESP32 memory and peripherals.
•ESP32 Hardware Resources
The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development
boards.
•ESP32 Hardware Design Guidelines
The guidelines outline recommended design practices when developing standalone or add-on systems
based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development
boards.
•ESP32 AT Instruction Set and Examples
This document introduces the ESP32 AT commands, explains how to use them, and provides examples of
several common AT commands.
•Espressif Products Ordering Information
11.2 Must-Have Resources
Here are the ESP32-related must-have resources.
•ESP32 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share knowledge,
explore ideas, and help solve problems with fellow engineers.
•ESP32 GitHub
ESP32 development projects are freely distributed under Espressif’s MIT license on GitHub. It is established
to help developers get started with ESP32 and foster innovation and the growth of general knowledge about
the hardware and software surrounding ESP32 devices.
•ESP32 Tools
This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32 Certifi-
cation and Test”.
•ESP-IDF
This webpage links users to the official IoT development framework for ESP32.
•ESP32 Resources
This webpage provides the links to all available ESP32 documents, SDK and tools. �����������
Espressif Systems 20 ESP32-WROVER Datasheet V2.2
Revision History
Revision History
Date Version Release notes
2019.09 V2.2
• Added Moisture sensitivity level (MSL) 3 in Table 2ESP32-WROVER Specifica-
tions;
• Added notes about ”Operating frequency range” and ”TX power” under Table
8Wi-Fi Radio Characteristics;
• Updated Section 7Peripheral Schematics and added a note about RC delay
circuit under it;
• Updated Figure 9Recommended PCB Land Pattern.
2019.01 V2.1 Added a note on the use of GPIO12 under Table 3, as well as in Section 4;
Changed the RF power control range in Table 10 from –12 ~+12 to –12 ~+9 dBm.
2018.11 V2.0
Updated the recommended operating temperature from –40 °C ~65 °C to –40 °C
~85 °C.
Updated Chapter 6: Schematics, where C18 is changed from a 1 µF capacitor to a
4.7 µF capacitor.
2018.10 V1.9 Added ”Cumulative IO output current” entry to Table 5: Absolute Maximum Ratings;
Added more parameters to Table 7: DC Characteristics.
2018.08 V1.8
• Added certifications and reliability test items the module has passed in Table 2:
ESP32-WROVER Specifications, and removed software-specific information;
• Updated Section 3.4: RTC and Low-Power Management;
• Changed the module’s dimensions from (18±0.15) mm x (31.4 ±0.2) mm x
(3.5±0.15) mm to (18.00±0.10) mm x (31.40±0.10) mm x (3.30±0.10) mm;
• Updated Figure 8: Physical Dimensions;
• Updated Chapter 6: Schematics;
• Changed the recommended operating temperature from –40°C ~85°C to –
40°C ~65°C and added a note to custom order of ESP32-WROVER with high
temperature range;
• Corrected a typo in Electrical Characteristics section;
• Updated Table 8: Wi-Fi Radio.
2018.06 V1.7
• Updated the capacity of PSRAM from 32 Mbit to 64 Mbit;
• Deleted Temperature Sensor in Table 2: ESP32-WROVER Specifications;
• Updated Chapter 3: Functional Description;
• Updated Chapter 6: Schematics;
• Added Chapter 9: Recommended PCB Land Pattern;
Changes to electrical characteristics:
• Updated Table 5: Absolute Maximum Ratings;
• Added Table 6: Recommended Operating Conditions;
• Added Table 7: DC Characteristics;
• Updated the values of ”Gain control step”, ”Adjacent channel transmit power”
in Table 10: Transmitter Characteristics - BLE.
2018.03 V1.6 Corrected typos in Table 3Pin Definitions.
2018.03 V1.5 Updated Table 2in Chapter 1.
2018.03 V1.4 Updated Chapter 6Schematics;
Updated Chapter 8Dimensions.
Espressif Systems 21 ESP32-WROVER Datasheet V2.2
Revision History
Date Version Release notes
Updated section 3.4 RTC and Low-Power Management;
2018.01 V1.3 Deleted information on LNA pre-amplifier;
Updated section 3.4 RTC and Low-Power Management;
Updated the ESP32-WROVER schematics in Chapter 6;
Added a note in Chapter 7;
Added the U.FL dimensions (Figure 10).
2017.10 V1.2
Updated the description of the chip’s system reset in Section 2.3 Strapping Pins;
Deleted ”Association sleep pattern” in Table ”Power Consumption by Power Modes”
and added notes to Active-sleep and Modem-sleep;
Added a note to Output Impedance in Table 8;
Updated the notes to Figure 4Peripheral Schematics.
2017.09 V1.1
Updated Section 2.1 Pin Layout;
Updated the ESP32-WROVER Schematics and dded a note in Chapter 7;
Added Chapter 8Dimensions.
2017.08 V1.0 First release.
Espressif Systems 22 ESP32-WROVER Datasheet V2.2